Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Clock/Timing > Application Specific Clock/Timing

Microchip Technology DSC557-0333FI1

Name: DSC557-0333FI1
Brand: Microchip Technology
SKU: DSC557-0333FI1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: DSC557-0333FI1

Manufacturer:: Microchip Technology

Category:: Application Specific Clock/Timing

Package:: 14-VFQFN Exposed Pad

Datasheet:: DSC557-0333FI1.pdf

Description:: 2-OUTPUT MEMS PCIE GEN1/2/3/4 CL

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,821

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

DSC557-0333FI1 from Microchip Technology is a dual-output PCIe Gen1/2/3/4 clock generator with integrated MEMS resonator, delivering two 100 MHz HCSL differential outputs, ±100 ppm frequency stability over –40°C to +85°C, and 2.25V–3.6V supply operation - used in Ethernet switches, storage controllers, and industrial embedded systems requiring PCIe-compliant timing.

For engineers reviewing the DSC557-0333FI1 datasheet, DSC557-0333FI1 pinout, DSC557-0333FI1 application, or DSC557-0333FI1 equivalent, key selection criteria include PCIe Gen4 jitter compliance (TJ ≤ 86 psPP), HCSL output drive capability (750 mVPP single-ended), OE-controlled output enable/disable, and 14-pin QFN package compatibility with high-density PCB layouts.

Technical Context

The DSC557-0333FI1 implements a PLL-based architecture with silicon MEMS resonator as the frequency reference, eliminating external crystal dependency while maintaining PCIe Common Clock jitter requirements across Gen1–Gen4. Its dual HCSL outputs share a common 100 MHz frequency but operate on independent power domains (VDD0 for CLK0±, VDD1 for CLK1±).

Output Enable (OE) is an active-high control input that disables both outputs within 5 ns when low; startup time to 100 ppm stable output is ≤5 ms after VDD application. The device supports full PCIe Gen4 phase jitter specification (≤0.5 psRMS integrated CC jitter) at 100 MHz under industrial temperature conditions.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Frequency	100 MHz fixed - meets PCIe reference clock requirement for Gen1–Gen4 link layers.
Output Format	HCSL (CLK0± and CLK1±) - provides 750 mVPP single-ended swing into 50 Ω, compatible with standard PCIe PHY receivers.
Frequency Stability	±100 ppm - covers initial tolerance, temperature drift (–40°C to +85°C), and supply variation (2.25V–3.6V).
PCIe Jitter Compliance	TJ ≤ 86 psPP (Gen1), ≤17 psPP (Gen2), ≤0.5 psRMS (Gen4 CC) - verified per PCIe spec, enabling drop-in use in Gen4 designs.
Supply Current	60 mA typical (both outputs enabled, 3.3V, 100 MHz) - enables thermal management in space-constrained networking modules.
Startup Time	≤5 ms - ensures rapid system boot readiness without external reset coordination.
Output Disable Time	≤5 ns - supports dynamic power gating during low-power link states (L0s/L1).

Pinout & Package

Package: 14-pin QFN (2.5 mm × 3.2 mm), exposed thermal pad (ePAD), RoHS-compliant, MSL 1 rated for 260°C reflow.

Pin/Terminal	Circuit Role	Design Meaning
OE (Pin 1)	Input	Active-high output enable; drives both HCSL outputs to high-impedance when low - enables PCIe ASPM L1 entry without board-level gating.
VSS (Pin 4)	Power	Ground reference for core logic and output drivers - requires low-inductance connection to minimize ground bounce in high-speed switching.
CLK0+, CLK0− (Pins 11, 10)	Output	Differential HCSL clock pair for PCIe root complex or endpoint - routed as controlled-impedance 100 Ω differential pair.
CLK1+, CLK1− (Pins 8, 9)	Output	Independent differential HCSL clock pair - supports dual-lane PCIe topology (e.g., x2/x4 bifurcation) with separate power domain (VDD1).
VDD0 (Pin 13)	Power	Core and CLK0± supply - decoupled with 0.1 µF capacitor per datasheet layout guidance.
VDD1 (Pin 12)	Power	CLK1± supply - allows independent voltage scaling or noise isolation from core domain.

Key Features

Feature	Design Value
Integrated MEMS Resonator	Eliminates external 25 MHz crystal - reduces BOM count by 1 component and improves shock/vibration reliability (MIL-STD-883 qualified).
PCIe Gen4-Compliant Jitter	0.313–0.5 psRMS integrated phase noise (CC mode) - satisfies Gen4 receiver eye margin requirements without external jitter cleaners.
Dual Independent Power Domains	VDD0 and VDD1 supplies - enable selective power-down of one output while retaining the other, supporting flexible power management in multi-lane systems.
Fast Output Control	5 ns disable time and 20 ns enable time - aligns with PCIe ASPM timing budgets for seamless L0s/L1 state transitions.
Industrial Temperature Range	–40°C to +85°C operation - validated across full range for use in uncooled industrial switches and storage enclosures.

Applications

Ethernet Switch Timing	PCIe Storage Controller
Use Scenario: High-port-count 10GBASE-T/KR switch ASIC requiring synchronized reference clocks for multiple SerDes lanes. IC Role / Device Role / Timing Role: Dual 100 MHz HCSL clock source meeting PCIe Gen3/Gen4 Common Clock spec for upstream/downstream links. Use Value: Eliminates two external crystals and associated load capacitors, reducing layout area by >12 mm² and improving long-term frequency stability under thermal cycling.	Use Scenario: NVMe SSD controller with dual PCIe x4 interfaces needing independent, low-jitter reference clocks. IC Role / Device Role / Timing Role: Primary PCIe clock generator providing CLK0± to host interface and CLK1± to device-side interface. Use Value: Enables simultaneous Gen4 operation on both interfaces with <0.5 psRMS integrated jitter, avoiding timing closure issues in high-speed routing.
Industrial Router Synchronization	Medical Imaging Data Acquisition
Use Scenario: Ruggedized edge router operating in extended temperature environments (–40°C to +85°C) with multi-gigabit backplane interconnects. IC Role / Device Role / Timing Role: Robust clock source for packet processing SoC and PHYs, immune to mechanical shock per MIL-STD-883. Use Value: Maintains ±100 ppm stability across temperature and vibration, preventing packet loss due to clock drift in deterministic real-time traffic.	Use Scenario: FPGA-based ultrasound beamformer requiring precise 100 MHz sampling clock synchronization across ADC/DAC chains. IC Role / Device Role / Timing Role: Low-phase-noise timing reference for high-resolution time-of-flight calculations. Use Value: Delivers 0.313 psRMS integrated jitter (12 kHz–10 MHz offset) - directly translates to sub-picosecond time resolution in echo delay measurement.

Ethernet Switch Timing

PCIe Storage Controller

Use Scenario: High-port-count 10GBASE-T/KR switch ASIC requiring synchronized reference clocks for multiple SerDes lanes.

IC Role / Device Role / Timing Role: Dual 100 MHz HCSL clock source meeting PCIe Gen3/Gen4 Common Clock spec for upstream/downstream links.

Use Value: Eliminates two external crystals and associated load capacitors, reducing layout area by >12 mm² and improving long-term frequency stability under thermal cycling.

Use Scenario: NVMe SSD controller with dual PCIe x4 interfaces needing independent, low-jitter reference clocks.

IC Role / Device Role / Timing Role: Primary PCIe clock generator providing CLK0± to host interface and CLK1± to device-side interface.

Use Value: Enables simultaneous Gen4 operation on both interfaces with <0.5 psRMS integrated jitter, avoiding timing closure issues in high-speed routing.

Industrial Router Synchronization

Medical Imaging Data Acquisition

Use Scenario: Ruggedized edge router operating in extended temperature environments (–40°C to +85°C) with multi-gigabit backplane interconnects.

IC Role / Device Role / Timing Role: Robust clock source for packet processing SoC and PHYs, immune to mechanical shock per MIL-STD-883.

Use Value: Maintains ±100 ppm stability across temperature and vibration, preventing packet loss due to clock drift in deterministic real-time traffic.

Use Scenario: FPGA-based ultrasound beamformer requiring precise 100 MHz sampling clock synchronization across ADC/DAC chains.

IC Role / Device Role / Timing Role: Low-phase-noise timing reference for high-resolution time-of-flight calculations.

Use Value: Delivers 0.313 psRMS integrated jitter (12 kHz–10 MHz offset) - directly translates to sub-picosecond time resolution in echo delay measurement.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe clock generator applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Si5332A-D-GM	Programmable 2-output clock generator (I2C-configurable), supports 100 MHz + auxiliary frequencies; higher integration (jitter cleaner + divider), larger 4×4 mm QFN.	Used where flexible frequency synthesis or multi-protocol support (PCIe + SATA + USB) is required; not pin-compatible.	Select Si5332A-D-GM only if programmability and multi-frequency capability outweigh cost and footprint penalties.
ICS8430N-01T	Fixed 100 MHz dual-HCSL generator with ±50 ppm stability, older CMOS process, no integrated resonator (requires external crystal), 16-pin TSSOP.	Suitable for legacy PCIe Gen2/Gen3 designs where crystal layout is acceptable and tighter stability is needed.	Choose ICS8430N-01T only for cost-sensitive Gen2 systems where crystal placement is feasible and ±50 ppm is mandatory.

Compared with Si5332A-D-GM and ICS8430N-01T, the DSC557-0333FI1 uniquely combines crystal-free operation, Gen4-compliant jitter, industrial temperature rating, and minimal 2.5×3.2 mm footprint - making it optimal for new PCIe Gen4 designs prioritizing reliability, size, and supply chain simplicity.

Availability

DSC557-0333FI1 is available at Aetrix Electronics and suitable for Ethernet switches, PCIe SSD controllers, and industrial routers requiring stable component supply, long lifecycle support, and RoHS-compliant packaging.

Supply support for DSC557-0333FI1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a U.S.-based semiconductor company specializing in microcontrollers, analog devices, and timing solutions, with global manufacturing and quality certifications including ISO 9001 and IATF 16949.

The DSC557 family is part of Microchip's precision timing portfolio, designed specifically for high-reliability PCIe, Ethernet, and storage applications where crystal-free operation and Gen4 compliance are critical.

FAQ

What output formats does the DSC557-0333FI1 support?

The DSC557-0333FI1 is configured for dual HCSL outputs (CLK0± and CLK1±) as indicated by the "44" in its part number suffix. It does not support LVDS or LVCMOS on this variant - those require different part numbers (e.g., DSC557-0313FL0 for LVCMOS/LVDS). HCSL outputs deliver 750 mVPP single-ended swing into 50 Ω loads, compliant with PCIe Gen1–Gen4 electrical specifications.

Does the DSC557-0333FI1 require an external crystal?

No, the DSC557-0333FI1 integrates a silicon MEMS resonator and does not require an external crystal. This eliminates the need for a 25 MHz quartz crystal, associated load capacitors, and crystal layout constraints - reducing BOM count, PCB area, and long-term aging-related frequency drift. The MEMS resonator is factory-trimmed and qualified to MIL-STD-883 for shock/vibration immunity.

What is the temperature range supported by the DSC557-0333FI1?

The DSC557-0333FI1 operates across the industrial temperature range of –40°C to +85°C, as denoted by the "I" in its part number suffix. It maintains ±100 ppm frequency stability across this full range, including variations due to supply voltage (2.25V–3.6V) and thermal gradients. Junction temperature is rated up to +150°C, supporting reliable operation in fanless industrial enclosures.

How is output control implemented on the DSC557-0333FI1?

Output control is managed via the OE (Output Enable) pin (Pin 1), which is active-high. When OE is driven low, both HCSL outputs enter high-impedance state within 5 ns; when OE is high (or floating), outputs are enabled with ≤20 ns enable time. A 40 kΩ internal pull-up ensures default-enabled operation if OE is left unconnected - simplifying design for always-on clocking use cases.

Is the DSC557-0333FI1 compliant with PCIe Gen4 timing requirements?

Yes, the DSC557-0333FI1 meets PCIe Gen4 Common Clock Architecture (CCA) jitter requirements: integrated phase noise ≤0.5 psRMS (12 kHz–10 MHz offset) and total jitter ≤86 psPP (Gen1) down to ≤0.5 psRMS (Gen4). These values are measured and guaranteed across –40°C to +85°C and 2.25V–3.6V supply, per DS20006318A specifications.

DSC557-0333FI1 Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: DSC557-03

Package/Case:: 14-VFQFN Exposed Pad

Packaging:: Tube

Product Status:: Active

Programmable:: Not Verified

PLL:: Yes

Main Purpose:: PCI Express (PCIe)

Input:: -

Output:: HCSL, LVCMOS, LVDS

Number of Circuits:: 1

Ratio - Input:Output:: 1:2

Differential - Input:Output:: No/Yes

Frequency - Max:: 100MHz

Voltage - Supply:: 2.25V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 14-QFN (2.5x3.2)

DSC557-0333FI1 FAQ

1.How can I place an order for DSC557-0333FI1 through Aetrix?

Please submit a Request for Quotation (RFQ) for DSC557-0333FI1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DSC557-0333FI1 reliable?

The price and inventory of DSC557-0333FI1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DSC557-0333FI1 is usually 5 days.

3.What payment methods are accepted for DSC557-0333FI1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DSC557-0333FI1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DSC557-0333FI1?

DSC557-0333FI1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DSC557-0333FI1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DSC557-0333FI1?

For technical support, including DSC557-0333FI1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DSC557-0333FI1 requirements.

6.How does Aetrix verify that DSC557-0333FI1 is sourced from the original manufacturer or authorized distributors?

All DSC557-0333FI1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DSC557-0333FI1 meets industry standards.

7.What is the process for return or replacement of DSC557-0333FI1?

All DSC557-0333FI1 units undergo pre-shipment inspection (PSI). If there is an issue with DSC557-0333FI1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DSC557-0333FI1 part is unused and in its original packaging.

Return procedure for DSC557-0333FI1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…