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NXP Semiconductors DSP56311VF150

Part No.:
DSP56311VF150
Manufacturer:
NXP Semiconductors
Category:
DSP (Digital Signal Processors)
Package:
196-LBGA
Datasheet:
AetrixDSP56311VF150.pdf
Description:
IC DSP 24BIT 150MHZ 196-BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,826

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Product details

Overview

DSP56311VF150 from Freescale Semiconductor is a 24-bit fixed-point digital signal processor (DSP) with a 150 MHz internal core clock, 1.8 V core supply, and 3.3 V I/O voltage. It integrates a DSP56300-compatible engine, 128 K × 24-bit on-chip RAM (configurable as 32 K program RAM + 48 K X/Y data RAM + 1024-word instruction cache), and an Enhanced Filter Coprocessor (EFCOP) enabling parallel 300 MMACS filtering. It targets echo cancellation and convolution-based algorithms in wireless infrastructure base stations.

For engineers reviewing the DSP56311VF150 datasheet, DSP56311VF150 pinout, DSP56311VF150 application, or DSP56311VF150 equivalent, key selection criteria include EFCOP-accelerated FIR/IIR filter throughput, 150 MHz core timing margin for real-time multi-channel processing, dual-voltage power domain isolation (VCCQL/VCCQH), and MAP-BGA package thermal performance in dense telecom boards.

Technical Context

The DSP56311VF150 implements a fully pipelined 24×24-bit MAC unit with two 56-bit accumulators and a 56-bit barrel shifter, executing one instruction per clock cycle. Its EFCOP operates synchronously at 150 MHz and supports real/complex FIR, DF-I/DF-II IIR, adaptive LMS filters, and 4-bit decimation - all independent of core execution flow.

Memory architecture includes programmable partitioning of 128 K × 24-bit RAM across program, X/Y data, and instruction cache spaces, plus 192 × 24-bit bootstrap ROM. The external memory expansion port supports up to 256 K × 24-bit program and two 256 K × 24-bit data spaces with glueless SRAM/DRAM interfacing up to 100 MHz.

Key Specifications

Parameter Value and Actual Design Meaning
Core Clock Speed 150 MHz internal clock - enables deterministic 6.67 ns instruction cycle time for hard real-time filtering loops.
Processing Performance 150 MMACS core-only; 300 MMACS with EFCOP active - delivers concurrent channel processing without throughput penalty.
On-Chip Memory 128 K × 24-bit RAM (configurable) + 1024 × 24-bit instruction cache - eliminates external memory bottlenecks for coefficient/data buffers.
Power Supply 1.8 V core (VCCQL) + 3.3 V I/O (VCCQH/VCCA/VCCD/etc.) - requires separate low-noise LDOs and split-plane PCB layout.
EFCOP Filter Modes Real/complex FIR, DF-I/DF-II IIR, adaptive LMS, 4-bit decimation - accelerates echo cancellation and channel equalization in baseband processing.
Package Type MAP-BGA (Molded Array Plastic Ball Grid Array) - 256-ball footprint optimized for thermal dissipation in high-density telecom modules.
Operating Temperature –40°C to +105°C ambient - qualified for industrial and outdoor wireless infrastructure enclosures.

Pinout & Package

Molded Array Plastic Ball Grid Array (MAP-BGA) package with 256 solder balls, 1.27 mm pitch, and 17 mm × 17 mm body size. Designed for reflow soldering and thermal vias under die pad to manage 1.8 W typical power dissipation.

Pin/Terminal Circuit Role Design Meaning
A[0–17] External Address Bus Output 18-bit multiplexed address lines for external program/data memory access; tri-stated during Stop/Wait modes.
D[0–23] External Data Bus I/O 24-bit bidirectional bus with weak keepers; supports 24-bit word transfers to SRAM/DRAM with glueless interface logic.
RD / WR Active-Low Control Outputs Asynchronous read/write strobes - timing referenced to CLKOUT; require external wait-state management via TA input.
EXTAL / XTAL Crystal Oscillator Interface XTAL is crystal output; EXTAL is input - supports fundamental-mode crystals up to 150 MHz or external clock source.
MODA–MODD Mode Configuration Inputs Four pins sampled at reset to configure boot mode, PLL enable, and memory mapping - pulled high/low via resistors.
RESET Active-Low Asynchronous Reset Resets all internal registers and state machines; deassertion initiates PLL lock and bootstrap ROM execution sequence.

Key Features

Feature Design Value
EFCOP Parallel Execution Offloads FIR/IIR filtering from main core - preserves 150 MMACS for control, protocol, and supervisory tasks.
Configurable Memory Map Software-selectable RAM partitioning (e.g., 32K PRAM + 48K XRAM + 48K YRAM) - optimizes buffer allocation per algorithm stage.
Multi-Port External Bus Independent address/data/control buses with chip select logic - enables simultaneous access to multiple memory banks or peripherals.
Low-Power Operation Wait/Stop modes with full register retention; static design supports 0 Hz operation - reduces idle power in burst-traffic systems.
OnCE™ Debug Interface JTAG-compliant on-chip emulation - enables non-intrusive breakpointing, real-time trace, and memory inspection without halting core.

Applications

Wireless Base Station Transceiver IP Telephony Gateway

Use Scenario: Real-time echo cancellation and uplink/downlink channel equalization in multi-carrier GSM/UMTS BTS hardware.

IC Role / Device Role / Timing Role: Primary baseband DSP handling 32+ concurrent voice channels with sub-100 µs latency constraints.

Use Value: EFCOP executes adaptive LMS filters at 300 MMACS while core manages TDMA frame scheduling and protocol stack - no channel throughput degradation.

Use Scenario: Voice packetization, jitter buffering, and G.711/G.729 codec acceleration in carrier-grade VoIP media gateways.

IC Role / Device Role / Timing Role: Dedicated DSP co-processor for real-time audio processing, isolated from host CPU via HI08 interface.

Use Value: On-chip 48 K × 24-bit X/Y RAM stores coefficient tables and sample buffers - eliminates external SDRAM latency for 8 kHz sampling.

DSLAM Line Card High-Speed Modem Bank

Use Scenario: Multi-line DSL line card performing DMT symbol processing, bit-loading, and SNR estimation across 24+ copper pairs.

IC Role / Device Role / Timing Role: Per-line DSP engine executing FFT, inverse FFT, and adaptive filtering in pipeline stages.

Use Value: 150 MHz core clock ensures <125 µs symbol period compliance for ADSL2+ Annex M; EFCOP handles per-tone gain calibration.

Use Scenario: Central office modem bank supporting V.92/V.90 analog modem termination for legacy PSTN access.

IC Role / Device Role / Timing Role: High-throughput signal conditioning DSP managing QAM demodulation, trellis decoding, and echo suppression.

Use Value: Dual 48 K × 24-bit data RAM banks enable ping-pong buffering for continuous 56 kbps data streams without DMA stalls.

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital signal processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
ADSP-21161NKCAZ-150 SHARC architecture; 150 MHz; 32-bit floating-point; 2 Mbit on-chip SRAM; no integrated EFCOP Better suited for floating-point FFTs and spectral analysis; lacks hardware-accelerated FIR/IIR coprocessor Select when algorithm requires dynamic range beyond 24-bit fixed-point or when floating-point math dominates compute load.
TMS320C6416TGLZA8 C6000 VLIW core; 800 MHz; 16-bit fixed-point; 1 MB L2 RAM; no dedicated filter coprocessor Higher raw MIPS but requires software-managed loop unrolling and memory banking for equivalent filter throughput Select when system demands high instruction-level parallelism across non-filtering tasks (e.g., TCP/IP stack, encryption).

Compared with ADSP-21161NKCAZ-150 and TMS320C6416TGLZA8, the DSP56311VF150 uniquely delivers deterministic 300 MMACS filtering performance with zero software overhead via EFCOP - critical for latency-constrained echo cancellation where core cycles must remain available for real-time control.

Availability

DSP56311VF150 is available at Aetrix Electronics and suitable for wireless infrastructure, IP telephony gateways, and DSLAM line cards requiring stable component supply across extended product lifecycles.

Supply support for DSP56311VF150 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) designed high-performance mixed-signal and digital processors for automotive, industrial, and networking markets.

The DSP56311VF150 belongs to the DSP56300 family - engineered specifically for cost-sensitive, high-channel-count wireless infrastructure applications demanding integrated memory and hardware-accelerated filtering.

FAQ

What is the maximum operating frequency of the DSP56311VF150 core?

The DSP56311VF150 operates with a 150 MHz internal core clock, achieved via its integrated PLL using an external crystal or clock source on EXTAL/XTAL. This yields a 6.67 ns instruction cycle time, and the EFCOP runs synchronously at the same 150 MHz rate to deliver 300 MMACS for filtering operations. The device is not rated for operation above 150 MHz.

Does the DSP56311VF150 support external memory expansion, and what interfaces are available?

Yes, the DSP56311VF150 supports external memory expansion through its Port A interface, providing an 18-bit address bus (A[0–17]), 24-bit data bus (D[0–23]), and dedicated control signals (RD, WR, AA[0–3], CAS, RAS[0–3]). It enables glueless connection to SRAM and DRAM up to 100 MHz, with chip select logic and an internal DRAM controller included.

How does the Enhanced Filter Coprocessor (EFCOP) in the DSP56311VF150 improve system performance?

The EFCOP in the DSP56311VF150 executes FIR, IIR, and adaptive filtering algorithms in parallel with the main DSP core - delivering up to 300 MMACS without consuming core cycles. This allows the DSP56311VF150 to maintain full 150 MMACS for control, protocol, and supervisory tasks while accelerating echo cancellation or channel equalization in real time.

What power supply requirements must be met for reliable operation of the DSP56311VF150?

The DSP56311VF150 requires seven isolated power domains: 1.8 V for core logic (VCCQL), 3.3 V for I/O (VCCQH), and separate 3.3 V supplies for address (VCCA), data (VCCD), bus control (VCCC), host interface (VCCH), and peripherals (VCCS). Each domain needs local decoupling capacitors, and VCCP/GNDP for the PLL must be ultra-low-impedance.

Is the DSP56311VF150 pin-compatible with other members of the DSP56300 family?

The DSP56311VF150 shares the same MAP-BGA package footprint and core signal definitions (e.g., A[0–17], D[0–23], EXTAL, RESET) with other DSP56300 family devices like the DSP56303 and DSP56309. However, peripheral signal assignments (e.g., ESSI, HI08, timer pins) and memory map configurations differ - board-level compatibility requires verification against specific variant datasheets.

DSP56311VF150 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
DSP56K/Symphony
Package/Case:
196-LBGA
Packaging:
Tray
Product Status:
Obsolete
Type:
Fixed Point
Interface:
Host Interface, SSI, SCI
Clock Rate:
150MHz
Non-Volatile Memory:
ROM (576B)
On-Chip RAM:
384kB
Voltage - I/O:
3.30V
Voltage - Core:
1.80V
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15x15)

DSP56311VF150 FAQ

1.How can I place an order for DSP56311VF150 through Aetrix?

Please submit a Request for Quotation (RFQ) for DSP56311VF150 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DSP56311VF150 reliable?

The price and inventory of DSP56311VF150 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DSP56311VF150 is usually 5 days.

3.What payment methods are accepted for DSP56311VF150?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DSP56311VF150 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DSP56311VF150?

DSP56311VF150 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DSP56311VF150 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DSP56311VF150?

For technical support, including DSP56311VF150 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DSP56311VF150 requirements.

6.How does Aetrix verify that DSP56311VF150 is sourced from the original manufacturer or authorized distributors?

All DSP56311VF150 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DSP56311VF150 meets industry standards.

7.What is the process for return or replacement of DSP56311VF150?

All DSP56311VF150 units undergo pre-shipment inspection (PSI). If there is an issue with DSP56311VF150, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DSP56311VF150 part is unused and in its original packaging.

Return procedure for DSP56311VF150:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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