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NXP Semiconductors DSP56311VF150B1

Part No.:
DSP56311VF150B1
Manufacturer:
NXP Semiconductors
Category:
DSP (Digital Signal Processors)
Package:
196-LBGA
Datasheet:
AetrixDSP56311VF150B1.pdf
Description:
IC DSP 24BIT 150MHZ 196-BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,334

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Product details

Overview

DSP56311VF150B1 from Freescale Semiconductor is a 24-bit fixed-point digital signal processor (DSP) with a 150 MHz core clock, 1.8 V core supply, and 3.3 V I/O voltage. It integrates a 24 × 24-bit MAC unit, dual 56-bit accumulators, 56-bit barrel shifter, six-channel DMA, and an on-chip Enhanced Filter Coprocessor (EFCOP) for parallel FIR/IIR filtering. It targets multi-channel echo cancellation in IP telephony infrastructure.

For engineers reviewing the DSP56311VF150B1 datasheet, DSP56311VF150B1 pinout, DSP56311VF150B1 application, or DSP56311VF150B1 equivalent, key selection criteria include EFCOP acceleration capability, internal memory configuration flexibility (e.g., 48 K × 24-bit X/Y RAM), MAP-BGA package thermal performance, and support for asynchronous bus arbitration above 100 MHz.

Technical Context

The DSP56311VF150B1 implements a fully static, single-cycle-per-instruction DSP56000-compatible core with position-independent code support, nested hardware DO loops, and fast auto-return interrupts. Its instruction cache (1024 × 24-bit) and programmable memory mapping enable optimized execution of real-time filtering kernels.

EFCOP operates synchronously with the core at up to 150 MHz and supports adaptive LMS coefficient updates, complex FIR with decimation ratios up to 16, and DF-I/DF-II IIR filters with four selectable output scaling factors (1×, 4×, 8×, 16×). The EFCOP shares 10 K × 24-bit memory with the core.

Key Specifications

Parameter Value and Actual Design Meaning
Core Clock Speed150 MHz internal clock - enables deterministic 150 MMACS core throughput and 300 MMACS with EFCOP-assisted filtering.
MAC Architecture24 × 24-bit parallel multiplier + 56-bit accumulator - supports full-precision intermediate results for telecom-grade filter stability.
Internal RAM128 K × 24-bit total (program + X/Y data + instruction cache) - configurable memory partitioning allows optimization for echo-cancellation buffer depth and coefficient storage.
EFCOP ThroughputReal-time parallel filtering at core frequency - offloads convolution-based algorithms without pipeline stalls or channel throughput degradation.
Power Supply1.8 V core / 3.3 V I/O - enables low-power operation while maintaining compatibility with standard 3.3 V peripheral interfaces.
Package TypeMAP-BGA (Molded Array Plastic Ball Grid Array) - provides high I/O density and thermal performance required for sustained DSP compute loads.
Bus InterfaceAsynchronous bus arbitration mode (ABE bit enabled) - eliminates CLKOUT setup/hold timing constraints for external memory access above 100 MHz.

Pinout & Package

The DSP56311VF150B1 is housed in a lead-free MAP-BGA package with 256 balls (16 × 16 array), compliant with JEDEC MO-251. Pin assignment follows functional port grouping: Port A (external memory interface), Port B (HI08 host interface/GPIO), Ports C/D (dual ESSI), Port E (SCI), and dedicated PLL/clock/power pins.

Pin/Terminal Circuit Role Design Meaning
A[0–17]External Address Bus Output18-bit multiplexed address lines for accessing up to 256 K × 24-bit external program/data memory spaces.
D[0–23]External Data Bus I/O24-bit bidirectional data path supporting glueless SRAM/DRAM interfacing with weak-keeper retention during tri-state.
RD / WRActive-Low Bus Control OutputsStandard read/write strobes synchronized to CLKOUT; timing adjustable via bus control register (BCR) and TA input.
MODA–MODDMode Configuration InputsFour-pin strap inputs sampled at reset to configure boot mode, PLL enable (PEN), and memory mapping defaults.
EXTAL / XTALCrystal Oscillator InterfaceExternal clock input (EXTAL) and crystal output (XTAL); supports fundamental-mode crystals or buffered clock sources.
VCCP / GNDPPLL Power/GroundDedicated low-noise power and ground pair for PLL stability - requires 0.47 µF capacitor placed adjacent to package.

Key Features

Feature Design Value
EFCOP Parallel FilteringHardware-accelerated FIR/IIR execution concurrent with core operations - preserves real-time channel count in multi-channel voice processing systems.
Programmable Memory MappingConfigurable split of 128 K × 24-bit RAM among program, X/Y data, and instruction cache - enables tuning for specific algorithm memory access patterns.
Six-Channel DMASupports 1D/2D/3D transfers with circular buffering and peripheral-triggered transfers - minimizes CPU overhead for audio frame streaming and coefficient updates.
OnCE™ Debug InterfaceJTAG-compliant on-chip emulation module - enables non-intrusive real-time debugging, breakpoint insertion, and memory inspection without halting core execution.
Asynchronous Bus ArbitrationABE bit disables CLKOUT-relative timing constraints on BG/BB - simplifies external bus design for >100 MHz operation without external clock domain synchronization.

Applications

IP Telephony Gateways Wireless Base Station Units

Use Scenario: Real-time echo cancellation across 32+ VoIP channels in carrier-class session border controllers.

IC Role / Device Role / Timing Role: Primary DSP executing adaptive LMS algorithms via EFCOP while managing packetized audio I/O through dual ESSI and SCI.

Use Value: Achieves 300 MMACS aggregate filtering throughput without degrading call setup latency or jitter buffer management.

Use Scenario: Multi-carrier baseband processing in CDMA2000 femtocell units requiring simultaneous channel estimation and interference suppression.

IC Role / Device Role / Timing Role: Baseband signal processor handling correlation, convolution, and decimation tasks using EFCOP's complex FIR modes and 4× decimation capability.

Use Value: Reduces external memory bandwidth demand by performing 16× decimation on-chip before transferring downsampled data to host controller.

DSP Resource Boards High-Speed Modem Banks

Use Scenario: Plug-in DSP acceleration card for legacy telecom switching platforms needing field-upgradable filtering capability.

IC Role / Device Role / Timing Role: Standalone programmable DSP with HI08 host interface enabling glueless integration into ISA/PCI-based backplanes.

Use Value: Eliminates need for external glue logic via HI08's configurable bus polarity, double HR/DS modes, and GPIO remapping.

Use Scenario: V.92/V.90 modem bank supporting 256 concurrent analog line connections in DSLAM edge devices.

IC Role / Device Role / Timing Role: Channelized DSP executing QAM demodulation, trellis decoding, and line probing using programmable X/Y RAM for per-line coefficient storage.

Use Value: Leverages 48 K × 24-bit X/Y RAM partitions to maintain independent filter states for all active lines without external memory contention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital signal processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
ADSP-21161NKBZ-160SHARC architecture; 160 MHz; 32-bit floating-point; no integrated EFCOP; 2 Mbit on-chip RAMBetter suited for floating-point FFT/audio synthesis; lacks hardware-accelerated echo cancellation coprocessorSelect when algorithm requires IEEE-754 precision or large FFT sizes exceeding 1024 points.
TMS320C6713BZDPA200C6000 VLIW core; 200 MHz; 32-bit floating-point; EMIF interface; no EFCOP; 256 KB L2 RAMHigher raw MFLOPS but higher power; requires external memory for large coefficient tables; no native 24-bit fixed-point optimizationSelect for mixed-precision applications where floating-point math dominates and EFCOP acceleration is not required.

Compared with ADSP-21161NKBZ-160 and TMS320C6713BZDPA200, the DSP56311VF150B1 delivers superior energy efficiency and deterministic latency for fixed-point echo cancellation, due to its dedicated EFCOP, 24-bit datapath alignment with telecom standards, and lower 1.8 V core voltage.

Availability

DSP56311VF150B1 is available at Aetrix Electronics and suitable for IP telephony gateways, wireless infrastructure units, DSP resource boards, high-speed modem banks, and industrial signal conditioning systems requiring stable component supply and long-term lifecycle support.

Supply support for DSP56311VF150B1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of high-performance embedded processors, analog and mixed-signal ICs, and connectivity solutions for automotive, industrial, and communications markets.

The DSP56311VF150B1 belongs to the DSP56300 family, engineered specifically for network infrastructure applications demanding high channel density, low-latency filtering, and integrated memory - targeting echo cancellation, correlation, and convolution-based signal processing.

FAQ

What is the maximum operating frequency of the DSP56311VF150B1 core?

The DSP56311VF150B1 operates with an internal 150 MHz clock, delivering up to 150 MMACS in core-only mode and 300 MMACS when the Enhanced Filter Coprocessor (EFCOP) is engaged. This frequency is sustained under specified 1.8 V core and 3.3 V I/O supply conditions per the Rev. 8 datasheet.

Does the DSP56311VF150B1 support external DRAM interfacing?

Yes, the DSP56311VF150B1 includes an internal DRAM controller supporting glueless interface to DRAMs up to 100 MHz. However, DRAM access is explicitly unsupported above 100 MHz - RAS, CAS, and related signals are only valid within that frequency limit per Section 1.5.3 of the datasheet.

How does the EFCOP in the DSP56311VF150B1 accelerate filtering tasks?

The EFCOP executes FIR and IIR filtering in parallel with the main DSP core at the same 150 MHz clock rate. It supports adaptive LMS coefficient updates, complex FIR with up to 16× decimation, and DF-I/DF-II IIR filters with selectable output scaling - enabling real-time echo cancellation without consuming core cycles or degrading channel throughput.

What package type is used for the DSP56311VF150B1?

The DSP56311VF150B1 uses a lead-free Molded Array Plastic Ball Grid Array (MAP-BGA) package with 256 balls in a 16 × 16 configuration. Mechanical drawings and land pattern recommendations are provided in Chapter 3 of the Rev. 8 technical data document.

Can the DSP56311VF150B1 operate without an external crystal?

Yes - the DSP56311VF150B1 accepts either a fundamental-mode crystal connected between EXTAL and XTAL, or an external buffered clock applied to the EXTAL pin alone (with XTAL left unconnected). The PLL can be disabled via the PINIT pin at reset to use EXTAL directly as the system clock source.

DSP56311VF150B1 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
DSP56K/Symphony
Package/Case:
196-LBGA
Packaging:
Tray
Product Status:
Obsolete
Type:
Fixed Point
Interface:
Host Interface, SSI, SCI
Clock Rate:
150MHz
Non-Volatile Memory:
ROM (576B)
On-Chip RAM:
384kB
Voltage - I/O:
3.30V
Voltage - Core:
1.80V
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15x15)

DSP56311VF150B1 FAQ

1.How can I place an order for DSP56311VF150B1 through Aetrix?

Please submit a Request for Quotation (RFQ) for DSP56311VF150B1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DSP56311VF150B1 reliable?

The price and inventory of DSP56311VF150B1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DSP56311VF150B1 is usually 5 days.

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DSP56311VF150B1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DSP56311VF150B1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DSP56311VF150B1?

For technical support, including DSP56311VF150B1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DSP56311VF150B1 requirements.

6.How does Aetrix verify that DSP56311VF150B1 is sourced from the original manufacturer or authorized distributors?

All DSP56311VF150B1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DSP56311VF150B1 meets industry standards.

7.What is the process for return or replacement of DSP56311VF150B1?

All DSP56311VF150B1 units undergo pre-shipment inspection (PSI). If there is an issue with DSP56311VF150B1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DSP56311VF150B1 part is unused and in its original packaging.

Return procedure for DSP56311VF150B1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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