NXP Semiconductors DSP56311VF150R2
- Part No.:
- DSP56311VF150R2
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 196-LBGA
- Datasheet:
-
DSP56311VF150R2.pdf
- Description:
- IC DSP 24BIT 150MHZ 196-BGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,161
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DSP56311VF150R2 from Freescale Semiconductor is a 24-bit fixed-point digital signal processor (DSP) with an integrated Enhanced Filter Coprocessor (EFCOP), operating at 150 MHz core clock, delivering up to 300 MMACS in filtering tasks, featuring 128 K × 24-bit on-chip RAM (configurable as 32 K program RAM + 1024-word instruction cache + 48 K X/Y data RAM), and supporting wireless infrastructure and echo-cancellation applications.
For engineers reviewing the DSP56311VF150R2 datasheet, DSP56311VF150R2 pinout, DSP56311VF150R2 application, or DSP56311VF150R2 equivalent, key selection criteria include EFCOP-accelerated FIR/IIR filter throughput, 1.8 V core / 3.3 V I/O power domains, MAP-BGA-256 package compatibility, and support for glueless DRAM/SRAM expansion up to 256 K words.
Technical Context
The DSP56311VF150R2 implements a fully pipelined DSP56300 core with 24 × 24-bit MAC, dual 56-bit accumulators, and 56-bit barrel shifter, executing one instruction per clock cycle and maintaining object-code compatibility with the DSP56000 architecture. Its six-channel DMA supports 1D/2D/3D transfers with circular buffering and peripheral-triggered transfers.
The EFCOP operates in parallel with the core at full 150 MHz, supporting real/complex FIR, DF-I/DF-II IIR, adaptive LMS filters, and 4-bit decimation - all with dedicated 24 × 24-bit datapath and independent memory access. Internal peripherals include HI08 host interface, dual ESSI ports (6-channel audio capable), SCI, triple timer, and JTAG/OnCE™ debug interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | DSP56300 24-bit fixed-point core, single-cycle instruction execution, DSP56000 code-compatible |
| Performance | 150 MMACS (core only); 300 MMACS when EFCOP accelerates filtering - enables real-time multi-channel echo cancellation |
| Internal Memory | 128 K × 24-bit RAM total: configurable split between program RAM (32 K), instruction cache (1024 × 24-bit), X/Y data RAM (48 K each) |
| Clock & Power | 150 MHz internal core clock; 1.8 V core supply (VCCQL), 3.3 V I/O supplies (VCCQH/VCCA/VCCD/VCCC/VCCH/VCCS) |
| Filter Acceleration | EFCOP supports real/complex FIR, DF-I/DF-II IIR, adaptive LMS, and 4-bit decimation - offloads core for sustained channel density |
| Peripheral Integration | HI08 8-bit host interface, dual ESSI (12-pin total), SCI, triple timer, 34 GPIO (multiplexed), JTAG/OnCE™ debug |
| Memory Expansion | Glueless external interface: 256 K × 24-bit program space + two 256 K × 24-bit data spaces; integrated DRAM controller (≤100 MHz) |
Pinout & Package
Molded Array Plastic Ball Grid Array (MAP-BGA) package with 256 balls, RoHS-compliant lead-free finish, 17 mm × 17 mm body, 1.0 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[0–17] | External Address Bus Output | 18-bit multiplexed address lines for program/data memory expansion; tri-stated during Stop/Wait modes |
| D[0–23] | External Data Bus I/O | 24-bit bidirectional data path with weak keepers; supports SRAM/DRAM interfacing up to 256 K words |
| RD / WR | Active-Low Bus Control | Asynchronous read/write strobes; timing controlled via Bus Control Register and TA handshake |
| MODA–MODD / IRQA–IRQD | Mode Select & Interrupt Inputs | Five-mode configuration pins (MODx) set boot mode and PLL behavior; four IRQ inputs support prioritized interrupt handling |
| EXTAL / XTAL | Crystal Oscillator Interface | EXTAL accepts 1–100 MHz external clock or crystal; XTAL output drives crystal; PLL generates internal 150 MHz core clock |
| PCAP | PLL Filter Capacitor Input | Connects external capacitor to stabilize PLL loop; required for stable 150 MHz operation; tied to VCCP if PLL disabled |
| CLKOUT | Core-Clock Synchronized Output | Provides phase-aligned 150 MHz (or ½ EXTAL if PLL disabled); usable ≤100 MHz; asynchronous arbitration required above 100 MHz |
| PB[0–15] / PC[0–5] / PD[0–5] / PE[0–2] | Multiplexed GPIO & Peripheral Pins | HI08 (Port B), ESSI0/ESSI1 (Ports C/D), SCI (Port E) share pins with GPIO; configured via control registers |
Key Features
| Feature | Design Value |
|---|---|
| EFCOP Parallel Filtering | Executes FIR/IIR/LMS algorithms concurrently with core - eliminates MAC contention and preserves 300 MMACS throughput in voice processing |
| Configurable Memory Map | Four RAM allocation modes via MSW1/MSW0 bits - enables optimization for cache-heavy (e.g., FFT) or data-RAM-heavy (e.g., multi-channel buffer) workloads |
| Glueless DRAM Interface | Integrated DRAM controller supports up to 100 MHz operation with RAS/CAS/AA[0–3] outputs - reduces external logic for base station memory subsystems |
| Low-Power Operation | Wait/Stop modes with bus release and I/O tri-state; static design operable down to 0 Hz - suitable for burst-mode wireless infrastructure |
| Multi-Protocol Serial I/O | Dual ESSI ports (12 pins) support TDM, I²S, or custom framing; SCI with baud-rate generator enables modem control link |
Applications
| Wireless Base Station Transceiver | VoIP Echo Cancellation Engine |
|---|---|
|
Use Scenario: Real-time multi-carrier signal conditioning in cellular BTS RF front-end, including channelization, interpolation, and digital predistortion. IC Role / Device Role / Timing Role: Primary DSP engine executing EFCOP-accelerated complex FIR filters and adaptive IIR equalizers at 150 MHz sample rate. Use Value: 300 MMACS EFCOP throughput enables simultaneous processing of 16+ WCDMA carriers without external coprocessors. |
Use Scenario: Full-duplex acoustic echo cancellation in IP PBX gateways, suppressing room reverberation and line echo across 32 concurrent VoIP channels. IC Role / Device Role / Timing Role: Dedicated echo canceller running adaptive LMS algorithm in EFCOP while core handles SIP signaling and packet buffering. Use Value: On-chip 48 K × 24-bit X/Y RAM stores long impulse responses (≥256 ms), eliminating external SDRAM latency bottlenecks. |
| DSL Modem Bank Controller | Home Theater Audio Processor |
|
Use Scenario: Line card DSP in high-density DSLAM systems performing DMT symbol processing, bit-loading, and SNR estimation for 64+ ADSL2+ lines. IC Role / Device Role / Timing Role: High-throughput filter bank processor using EFCOP for time-domain equalization and core for Reed-Solomon decoding. Use Value: Dual ESSI interfaces feed/receive 24-bit I²S streams from eight analog front-ends, enabling single-chip 64-line aggregation. |
Use Scenario: Multi-channel surround sound preprocessing in AV receivers, including Dolby Digital decoding, bass management, and speaker delay compensation. IC Role / Device Role / Timing Role: Audio-specific coprocessor executing convolution-based room correction and dynamic range compression in real time. Use Value: Six-channel ESSI (3 transmitters per port) drives discrete DACs for 7.1-channel output without external serializer chips. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital signal processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-21161NKCAZ-150 | SHARC architecture; 32-bit floating-point; 150 MFLOPS; no integrated filter coprocessor; 2 Mbit on-chip SRAM | Better suited for floating-point FFT/audio synthesis; lacks EFCOP-level acceleration for fixed-point echo cancellation | Select when algorithm requires IEEE-754 precision or large on-chip memory; not drop-in for EFCOP-dependent firmware |
| TMS320C6713BZDPA200 | VLIW C6000 core; 2000 MIPS / 1200 MFLOPS; no dedicated filter accelerator; 256 K × 16-bit RAM; 3.3 V only | Higher raw throughput but higher power (1.2 W vs. 0.9 W typical); requires external memory for large FIR buffers | Choose for compute-intensive floating-point tasks; avoid when low-power, integrated-memory filtering is critical |
Compared with ADSP-21161NKCAZ-150 and TMS320C6713BZDPA200, the DSP56311VF150R2 uniquely combines fixed-point efficiency, on-chip EFCOP acceleration, and 128 K × 24-bit RAM in a single 17 mm × 17 mm BGA - making it optimal for cost-sensitive, high-channel-density telecom edge nodes where deterministic filter latency matters.
Availability
DSP56311VF150R2 is available at Aetrix Electronics and suitable for wireless infrastructure, VoIP gateway, and DSLAM applications requiring stable component supply, long-lifecycle support, and traceable sourcing for industrial deployment.
Supply support for DSP56311VF150R2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) designed high-performance, low-power embedded processors for automotive, industrial, and communications markets before its 2015 acquisition.
The DSP56311VF150R2 belongs to the DSP56300 family - engineered specifically for network infrastructure requiring deterministic real-time filtering, large on-chip memory, and glueless memory expansion in compact BGA packages.
FAQ
What is the maximum operating frequency and power supply configuration for the DSP56311VF150R2?
The DSP56311VF150R2 operates at a maximum internal core frequency of 150 MHz, derived from an external 1–100 MHz crystal or clock applied to EXTAL. It requires separate 1.8 V for the core logic (VCCQL) and 3.3 V for all I/O domains (VCCQH, VCCA, VCCD, VCCC, VCCH, VCCS). The PLL generates the internal 150 MHz clock, and PCAP must be connected to a stable external capacitor for lock stability. This dual-voltage scheme minimizes dynamic power while maintaining interface compatibility with 3.3 V peripherals.
How does the Enhanced Filter Coprocessor (EFCOP) in the DSP56311VF150R2 improve filtering performance?
The EFCOP in the DSP56311VF150R2 executes FIR, IIR, and adaptive LMS filtering algorithms in parallel with the main DSP core - enabling true 300 MMACS throughput without stalling the core pipeline. It features a dedicated 24 × 24-bit datapath, independent memory access to shared RAM, and hardware support for decimation, complex arithmetic, and coefficient update scheduling. This allows the DSP56311VF150R2 to sustain real-time echo cancellation across 16+ voice channels while the core handles protocol stack and memory management.
What memory configurations are supported by the DSP56311VF150R2, and how are they selected?
The DSP56311VF150R2 provides 128 K × 24-bit on-chip RAM, partitioned dynamically via MSW1/MSW0 bits in the memory switch register. Configurations include: (1) 32 K program RAM + 1024-word instruction cache + 48 K X/Y RAM; (2) 95 K program RAM + cache + 16 K X/Y RAM; (3) 63 K program RAM + cache + 32 K X/Y RAM; and others. These modes let designers optimize for instruction cache hit rate (e.g., FFT kernels) or data buffer depth (e.g., long echo tails), all without external memory access penalties.
Does the DSP56311VF150R2 support external memory expansion, and what interfaces are available?
Yes, the DSP56311VF150R2 supports glueless expansion via its Port A interface: one 256 K × 24-bit program space and two 256 K × 24-bit data spaces using A[0–17], D[0–23], RD/WR, and AA[0–3]/RAS[0–3]. It integrates a DRAM controller supporting SDRAM up to 100 MHz, plus chip-select logic for SRAM. External access uses programmable wait states (via BCR) and optional TA handshake for variable-latency devices - enabling direct connection to commodity memory without address latches or glue logic.
What debug and development interfaces are integrated into the DSP56311VF150R2?
The DSP56311VF150R2 integrates JTAG Test Access Port (TAP) and OnCE™ (On-Chip Emulation) module for non-intrusive real-time debugging. OnCE™ supports breakpoints, watchpoints, register/memory inspection, and trace via the JTAG port - eliminating need for ICE pods. The device also includes a bootstrap ROM for initial code loading and supports serial boot from SCI or parallel boot via HI08. These capabilities enable rapid firmware validation for telecom DSP applications without modifying target hardware.
DSP56311VF150R2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- DSP56K/Symphony
- Package/Case:
- 196-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, SSI, SCI
- Clock Rate:
- 150MHz
- Non-Volatile Memory:
- ROM (576B)
- On-Chip RAM:
- 384kB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.80V
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 196-LBGA (15x15)
DSP56311VF150R2 FAQ
1.How can I place an order for DSP56311VF150R2 through Aetrix?
Please submit a Request for Quotation (RFQ) for DSP56311VF150R2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DSP56311VF150R2 reliable?
The price and inventory of DSP56311VF150R2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DSP56311VF150R2 is usually 5 days.
3.What payment methods are accepted for DSP56311VF150R2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DSP56311VF150R2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DSP56311VF150R2?
DSP56311VF150R2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DSP56311VF150R2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DSP56311VF150R2?
For technical support, including DSP56311VF150R2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DSP56311VF150R2 requirements.
6.How does Aetrix verify that DSP56311VF150R2 is sourced from the original manufacturer or authorized distributors?
All DSP56311VF150R2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DSP56311VF150R2 meets industry standards.
7.What is the process for return or replacement of DSP56311VF150R2?
All DSP56311VF150R2 units undergo pre-shipment inspection (PSI). If there is an issue with DSP56311VF150R2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DSP56311VF150R2 part is unused and in its original packaging.
Return procedure for DSP56311VF150R2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DSP56311VF150R2 Tags
-
TMS320C5535AZAY10
Texas Instruments

-
TMS320VC5501PGF300
Texas Instruments

-
ADSP-BF592KCPZ
Analog Devices Inc.

-
ADAU1463WBCPZ150
Analog Devices Inc.

-
TMS320VC5402PGE100
Texas Instruments

-
ADAU1701JSTZ-RL
Analog Devices Inc.

-
ADAU1701JSTZ
Analog Devices Inc.

-
TMS320VC5502PGF300
Texas Instruments

-
ADAU1462WBCPZ300RL
Analog Devices Inc.

-
ADAU1452KCPZRL
Analog Devices Inc.

-
ADAU1452WBCPZ-RL
Analog Devices Inc.

-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

