NXP Semiconductors DSP56311VL150

Overview

DSP56311VL150 from Freescale Semiconductor is a 24-bit fixed-point digital signal processor (DSP) with a 150 MHz core clock, 1.8 V core supply, and 3.3 V I/O. It integrates a DSP56300-compatible engine, 128 K × 24-bit on-chip RAM (configurable as 32 K program RAM + 48 K X/Y data RAM), 1024 × 24-bit instruction cache, and an Enhanced Filter Coprocessor (EFCOP) delivering up to 300 MMACS for echo cancellation in multi-channel IP telephony infrastructure.

For engineers reviewing the DSP56311VL150 datasheet, DSP56311VL150 pinout, DSP56311VL150 application, or DSP56311VL150 equivalent, key selection criteria include EFCOP-accelerated FIR/IIR filtering capability, MAP-BGA-256 package compatibility, 150 MHz real-time processing performance, and support for glueless DRAM/SRAM expansion in wireless baseband subsystems.

Technical Context

The DSP56311VL150 implements a fully pipelined 24 × 24-bit MAC with dual 56-bit accumulators and a 56-bit barrel shifter, enabling single-cycle multiply-accumulate operations. Its instruction set is object-code compatible with the DSP56000 core and supports position-independent code, nested DO loops, and fast auto-return interrupts.

It features a six-channel DMA controller supporting 1D/2D/3D transfers and circular buffering, plus an integrated PLL with skew-eliminated CLKOUT and asynchronous bus arbitration (ABE bit) for operation above 100 MHz. The EFCOP executes real/complex FIR and DF-I/DF-II IIR filters in parallel with the core at full 150 MHz clock rate.

Key Specifications

Pinout & Package

Molded Array Plastic Ball Grid Array (MAP-BGA) package with 256 solder balls, 17 mm × 17 mm body, 1.0 mm ball pitch, and lead-free or lead-bearing options per Rev. 8 documentation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital signal processing applications.

Compared with ADSP-21161NKCAZ-150 and TMS320C6713BZDHA, the DSP56311VL150 delivers superior real-time echo cancellation throughput per watt due to its tightly coupled EFCOP, making it optimal for cost-sensitive, high-channel-density telecom infrastructure where fixed-point efficiency and deterministic latency are mandatory.

Availability

DSP56311VL150 is available at Aetrix Electronics and suitable for wireless infrastructure, IP telephony gateways, and DSL modem banks requiring stable component supply across extended production lifecycles.

Supply support for DSP56311VL150 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The DSP56311VL150 belongs to the DSP56300 family designed specifically for high-throughput, low-latency signal processing in communications infrastructure-emphasizing integrated memory, parallel coprocessing, and glueless external memory expansion.

FAQ

What is the maximum operating frequency of the DSP56311VL150 core?

The DSP56311VL150 operates with a 150 MHz internal core clock, achieving up to 150 million multiply-accumulates per second (MMACS) in standard operation. When the Enhanced Filter Coprocessor (EFCOP) is active, peak performance reaches 300 MMACS due to parallel execution of filtering operations alongside the main core. This frequency is sustained under 1.8 V core supply and specified thermal conditions per Rev. 8 datasheet.

Does the DSP56311VL150 support external memory expansion, and what interfaces are available?

Yes, the DSP56311VL150 supports external memory expansion through its Port A interface: an 18-bit address bus (A[0–17]), 24-bit data bus (D[0–23]), and dedicated control signals including RD, WR, AA/RAS, CAS, and DRAM-specific timing. It includes a built-in DRAM controller for glueless interface to DRAM up to 100 MHz, and chip select logic for static RAM. Operation above 100 MHz requires enabling asynchronous bus arbitration (ABE bit) to relax CLKOUT timing constraints.

How does the Enhanced Filter Coprocessor (EFCOP) function in the DSP56311VL150?

The EFCOP in the DSP56311VL150 is a dedicated hardware accelerator that runs filter algorithms-including real/complex FIR, DF-I/DF-II IIR, and adaptive LMS-in parallel with the main DSP56300 core at the full 150 MHz clock rate. It uses 10 K × 24-bit shared memory for coefficient and data exchange, enabling up to 300 MMACS total throughput without impacting core instruction execution or channel count. Its decimation capability (up to 16×) and four IIR scaling factors optimize resource usage in echo cancellation and channel equalization.

What package type and pin count does the DSP56311VL150 use?

The DSP56311VL150 is packaged in a Molded Array Plastic Ball Grid Array (MAP-BGA) with 256 solder balls arranged in a 17 mm × 17 mm body and 1.0 mm pitch. This package supports both lead-free and lead-bearing assembly options per Rev. 8 documentation and includes dedicated power/ground ball assignments (e.g., VCCP/GNDP for PLL, VCCQL for quiet core) to meet stringent signal integrity requirements in high-speed telecom designs.

Is the DSP56311VL150 pin-compatible with other members of the DSP56300 family?

The DSP56311VL150 shares the same MAP-BGA-256 footprint and core signal definitions (e.g., A[0–17], D[0–23], MODx, RESET) with other DSP563xx devices like the DSP56303 and DSP56309, enabling board-level reuse in family-based designs. However, peripheral signal mappings (e.g., ESSI0/ESSI1 pin assignments, HI08 multiplexing) and memory configuration registers differ; therefore, PCB layout may require minor routing adjustments and firmware updates for full functional equivalence.