NXP Semiconductors DSP56311VL150B1
- Part No.:
- DSP56311VL150B1
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 196-LBGA
- Datasheet:
-
DSP56311VL150B1.pdf
- Description:
- IC DSP 24BIT 150MHZ 196-MAPBGA
- Quantity:
- Payment:

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Product details
Overview
DSP56311VL150B1 from Freescale Semiconductor is a 24-bit fixed-point digital signal processor (DSP) with a 150 MHz internal core clock, 1.8 V core supply, and 3.3 V I/O supply. It integrates a 24 × 24-bit MAC unit, dual 48 KB data RAM banks (X/Y), 32 KB program RAM, and a dedicated Enhanced Filter Coprocessor (EFCOP) for parallel FIR/IIR filtering. It targets multi-channel echo cancellation in IP telephony infrastructure.
For engineers reviewing the DSP56311VL150B1 datasheet, DSP56311VL150B1 pinout, DSP56311VL150B1 application, or DSP56311VL150B1 equivalent, key selection criteria include EFCOP-accelerated filtering throughput (300 MMACS), MAP-BGA-256 package compatibility, 24-bit external data bus width, and support for glueless DRAM/SRAM expansion up to 256 K words.
Technical Context
The DSP56311VL150B1 implements a fully pipelined DSP56000-compatible instruction set with single-cycle execution, 56-bit barrel shifter, and two 56-bit accumulators. Its EFCOP executes real/complex FIR and direct-form IIR filters concurrently with the main core at full 150 MHz clock rate.
It features six-channel DMA with 1D/2D/3D transfers and circular buffering, programmable memory mapping (e.g., 32 KB PRAM + 1024-word instruction cache), and asynchronous bus arbitration support above 100 MHz via ABE bit control. Power management includes Wait/Stop modes and per-peripheral clock gating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Clock Speed | 150 MHz internal - enables 150 MMACS base performance and deterministic real-time signal processing latency. |
| EFCOP Throughput | 300 MMACS - doubles effective filtering throughput by offloading FIR/IIR operations from main core without bus contention. |
| Internal Memory | 128 KB × 24-bit RAM total - configurable as 32 KB PRAM + 48 KB X-RAM + 48 KB Y-RAM + 10 KB shared EFCOP memory. |
| External Bus Width | 24-bit data bus (D[0–23]) + 18-bit address bus (A[0–17]) - supports 256 K-word program/data memory expansion with glueless SRAM/DRAM interface. |
| Power Supply | 1.8 V core / 3.3 V I/O - enables low-power operation while maintaining compatibility with standard 3.3 V peripheral interfaces. |
| Filter Acceleration | EFCOP supports adaptive LMS, decimation ratios up to 16, and four IIR output scaling factors (1×–16×) - eliminates need for external coprocessors in echo-cancellation systems. |
| Package Type | MAP-BGA-256 (17 mm × 17 mm, 1.0 mm pitch) - provides high I/O density and thermal performance for compact telecom board layouts. |
Pinout & Package
Molded Array Plastic Ball Grid Array (MAP-BGA) package with 256 solder balls, 17 mm × 17 mm body, 1.0 mm ball pitch, and lead-free RoHS-compliant construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[0–17] | External Address Bus Output | 18-bit multiplexed address lines for accessing up to 256 K-word external program/data memory spaces. |
| D[0–23] | External Data Bus I/O | 24-bit bidirectional data path supporting byte/word access and weak-keeper retention during tri-state. |
| RD / WR | Active-Low Bus Control Outputs | Asynchronous read/write strobes with programmable timing; compatible with standard SRAM/DRAM timing requirements. |
| MODA–MODD | Mode Configuration Inputs | Four pins sampled at reset to configure boot mode, PLL enable, and memory mapping options. |
| EXTAL / XTAL | Crystal Oscillator Interface | Supports external crystal (1–50 MHz) or clock source; XTAL is output-only and must be left floating when using external clock. |
| PINIT / RESET | PLL Initialization / Reset Input | PINIT latches PLL enable state during reset; RESET is active-low, synchronous to CLKOUT, and initiates hardware initialization sequence. |
Key Features
| Feature | Design Value |
|---|---|
| EFCOP Parallel Filtering | Executes real/complex FIR and DF-I/DF-II IIR filters concurrently with core at 150 MHz - enables real-time echo cancellation across ≥32 voice channels. |
| Configurable Memory Map | Eight PRAM/X-RAM/Y-RAM allocation modes via MSW1/MSW0 bits - allows optimization for algorithm code size vs. data buffer depth in fixed-point implementations. |
| Glueless DRAM Interface | Integrated DRAM controller supports RAS/CAS multiplexing and burst refresh up to 100 MHz - eliminates external DRAM controller IC in base station resource boards. |
| HI08 Host Interface | 8-bit parallel interface with programmable polarity, double HR/DS modes, and GPIO remapping - enables direct connection to x86 ISA or ARM host processors without address latching logic. |
| OnCE™ Debug Architecture | JTAG-based on-chip emulation with real-time trace and breakpoint support - permits non-intrusive debugging of time-critical filter routines without halting EFCOP operation. |
Applications
| IP Telephony Gateways | Wireless Base Station Resource Boards |
|---|---|
|
Use Scenario: Multi-channel VoIP gateways performing simultaneous G.168 echo cancellation, DTMF detection, and transcoding. IC Role / Device Role / Timing Role: Primary DSP executing real-time voice processing algorithms with EFCOP accelerating convolution-based echo suppression. Use Value: Achieves 32+ concurrent voice channels with sub-10 ms end-to-end latency using on-chip memory and parallel EFCOP acceleration. |
Use Scenario: Modular DSP resource cards in 3G Node B base stations handling channel coding, equalization, and interference mitigation. IC Role / Device Role / Timing Role: Dedicated signal processing engine managing multiple RF channel paths with deterministic cycle-accurate timing via PLL-synchronized peripherals. Use Value: Eliminates external filter ASICs through EFCOP's adaptive LMS and complex FIR support, reducing BOM cost and board area. |
| High-Speed Modem Banks | DSP-Based Wireless Local Loop Systems |
|
Use Scenario: Central office DSLAMs supporting V.92/V.90 modem termination across hundreds of subscriber lines. IC Role / Device Role / Timing Role: Core signal processor running QAM demodulation, trellis decoding, and line probing algorithms with DMA-managed data flow. Use Value: Leverages 24-bit precision and 150 MMACS throughput to meet stringent ITU-T spectral mask and BER requirements at 56 kbps. |
Use Scenario: Point-to-multipoint wireless access systems delivering PSTN-grade voice over licensed 2.4 GHz spectrum. IC Role / Device Role / Timing Role: Real-time baseband processor implementing TDMA frame synchronization, FEC, and adaptive modulation switching. Use Value: Uses EFCOP's 4× decimation capability and programmable IIR scaling to maintain SNR > 35 dB under fading channel conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-21161NKCAZ-150 | SHARC architecture; 32-bit floating-point; 150 MHz; 2 MB on-chip RAM; no integrated EFCOP. | Better suited for floating-point FFT/audio synthesis; lacks hardware-accelerated echo cancellation logic. | Select when algorithm requires IEEE-754 precision or large on-chip memory, not for cost-sensitive fixed-point telecom filtering. |
| TMS320C6713BZDUA200 | VLIW C6000 core; 200 MHz; 256 KB L2 RAM; no dedicated filter coprocessor; uses EDMA for data movement. | Higher raw MIPS but requires software-managed filtering loops; greater power consumption (1.4 W typical). | Prefer for general-purpose DSP tasks with custom algorithm porting; avoid when EFCOP's zero-overhead filtering is required. |
Compared with ADSP-21161NKCAZ-150 and TMS320C6713BZDUA200, the DSP56311VL150B1 delivers superior energy efficiency (0.85 W typical) and deterministic filtering latency due to its tightly coupled EFCOP, making it optimal for high-channel-count echo cancellation where fixed-point determinism is critical.
Availability
DSP56311VL150B1 is available at Aetrix Electronics and suitable for IP telephony gateways, wireless base station resource boards, and high-speed modem banks requiring stable component supply and long-term lifecycle support.
Supply support for DSP56311VL150B1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of high-performance embedded processors and analog/mixed-signal ICs for automotive, industrial, and communications markets.
The DSP56311VL150B1 belongs to the DSP56300 family, engineered specifically for network infrastructure applications demanding high internal memory bandwidth, low-latency filtering acceleration, and glueless memory expansion.
FAQ
What is the maximum operating frequency of the DSP56311VL150B1 core?
The DSP56311VL150B1 operates with a 150 MHz internal core clock, delivering up to 150 million multiply-accumulates per second (MMACS) in standard operation. When the Enhanced Filter Coprocessor (EFCOP) is active, peak throughput reaches 300 MMACS due to parallel execution of filtering algorithms alongside the main core instructions. This frequency is sustained under 1.8 V core supply with proper thermal management.
Does the DSP56311VL150B1 support external memory expansion, and what interfaces are available?
Yes, the DSP56311VL150B1 supports external memory expansion via its Port A interface, providing an 18-bit address bus (A[0–17]) and 24-bit data bus (D[0–23]). It enables glueless connection to SRAM and DRAM up to 100 MHz, with dedicated RAS/CAS signals and built-in DRAM controller logic. The device supports expansion to two 256 K × 24-bit data memory spaces and one 256 K × 24-bit program memory space.
How does the Enhanced Filter Coprocessor (EFCOP) in the DSP56311VL150B1 improve system-level performance?
The EFCOP in the DSP56311VL150B1 executes real/complex FIR and direct-form IIR filters in parallel with the main DSP core at full 150 MHz clock speed. It supports adaptive LMS coefficient updates, 4× decimation, and four programmable IIR output scaling factors - enabling real-time echo cancellation across 32+ voice channels without consuming core cycles or external memory bandwidth. This architecture reduces overall system latency and eliminates need for discrete filter ASICs.
What package type and pin count does the DSP56311VL150B1 use?
The DSP56311VL150B1 is housed in a Molded Array Plastic Ball Grid Array (MAP-BGA) package with 256 solder balls, measuring 17 mm × 17 mm with 1.0 mm ball pitch. This RoHS-compliant, lead-free package provides high I/O density and thermal dissipation suitable for compact telecom and infrastructure PCB layouts requiring signal integrity and thermal reliability.
Can the DSP56311VL150B1 operate in low-power modes, and how is power managed?
Yes, the DSP56311VL150B1 supports Wait and Stop low-power standby modes with full static design operation down to 0 Hz. Power management is instruction-dependent, peripheral-dependent, and mode-dependent - including clock gating for unused peripherals and dynamic voltage scaling for core/I/O domains. Decoupling capacitors are required on all eight dedicated power rails (VCCP, VCCQL, VCCQH, etc.) to maintain noise isolation between analog (PLL) and digital sections.
DSP56311VL150B1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- DSP56K/Symphony
- Package/Case:
- 196-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, SSI, SCI
- Clock Rate:
- 150MHz
- Non-Volatile Memory:
- ROM (576B)
- On-Chip RAM:
- 384kB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.80V
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 196-LBGA (15x15)
DSP56311VL150B1 FAQ
1.How can I place an order for DSP56311VL150B1 through Aetrix?
Please submit a Request for Quotation (RFQ) for DSP56311VL150B1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DSP56311VL150B1 reliable?
The price and inventory of DSP56311VL150B1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DSP56311VL150B1 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DSP56311VL150B1?
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6.How does Aetrix verify that DSP56311VL150B1 is sourced from the original manufacturer or authorized distributors?
All DSP56311VL150B1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DSP56311VL150B1 meets industry standards.
7.What is the process for return or replacement of DSP56311VL150B1?
All DSP56311VL150B1 units undergo pre-shipment inspection (PSI). If there is an issue with DSP56311VL150B1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DSP56311VL150B1 part is unused and in its original packaging.
Return procedure for DSP56311VL150B1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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