Diodes Incorporated DXTP03140BFG-7

Overview

DXTP03140BFG-7 from Diodes Incorporated is a PNP bipolar junction transistor in PowerDI3333-8 package, rated for -140V V_CEO, -4A continuous collector current, and -120mV V_CE(sat) at -1A. It features 72mΩ equivalent on-resistance, 175°C maximum junction temperature, and wettable flanks for automated optical inspection. It serves as a high-voltage, high-current high-side switch in motor drive circuits.

For engineers reviewing the DXTP03140BFG-7 datasheet, DXTP03140BFG-7 pinout, DXTP03140BFG-7 application, or DXTP03140BFG-7 equivalent, key selection criteria include verified V_CEO ≥ -140V, confirmed R_SAT = 72mΩ, thermal performance up to +175°C, and PowerDI3333-8 package compatibility with high-density PCB layouts.

Technical Context

This PNP transistor uses epitaxial base technology to achieve high gain (h_FE ≥ 45 at -3A) and low saturation voltage across its full operating range. Its breakdown ratings--180V V_CBO, -140V V_CEO, and -7V V_EBO-support robust operation in high-voltage line-switching topologies.

The device's thermal design centers on a low 6°C/W junction-to-leads resistance and supports derated power dissipation up to 3.4W with 50mm × 50mm 2oz copper. ESD ratings of 4kV HBM and 400V MM confirm suitability for industrial assembly environments.

Key Specifications

Pinout & Package

Package: PowerDI^®3333-8 (SWP, Type UX), surface-mount, thermally enhanced plastic case with wettable flanks and matte tin-plated leads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP high-voltage switching applications.

Compared with ZXTN25050DFH and MJD44H11T4G, DXTP03140BFG-7 uniquely balances -140V blocking, 72mΩ R_SAT, and 6°C/W R_θJL in a compact, AOI-friendly package-making it optimal for space-constrained, high-reliability 100V-class industrial switching.

Availability

DXTP03140BFG-7 is available at Aetrix Electronics and suitable for motor driving, line switching, and high-side switch applications requiring stable component supply, long-term manufacturability, and compliance with RoHS 3 and halogen-free standards.

Supply support for DXTP03140BFG-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, serving industrial, computing, consumer, and communications markets with high-reliability components.

This device belongs to Diodes' Power Transistor product line, engineered specifically for high-efficiency, high-voltage switching in compact industrial power systems where thermal density and assembly yield are critical.

FAQ

What is the maximum safe operating voltage for DXTP03140BFG-7 in continuous DC applications?

The absolute maximum collector-emitter voltage is -140V (V_CEO) under steady-state conditions at T_A = +25°C. Derating is required above +25°C ambient per the datasheet's thermal curves; at +100°C ambient, the usable V_CEO reduces to approximately -115V to maintain junction temperature ≤ +175°C with standard PCB copper.

Does DXTP03140BFG-7 require a heatsink in typical 2A switching applications?

No external heatsink is required when mounted on ≥25mm × 25mm 2oz copper, as R_θJA drops to 65°C/W and power dissipation remains ≤0.5W at 2A (V_CE(sat) ≈ -80mV). The exposed collector tab provides sufficient thermal conduction to the PCB; heatsinking is only needed for sustained >3A operation or in sealed, high-ambient enclosures.

Can DXTP03140BFG-7 be used in avalanche mode for inductive load clamping?

No-this device is not rated or characterized for repetitive avalanche operation. Its SOA curve does not specify avalanche energy limits, and the datasheet contains no avalanche test data. For inductive clamp applications, external flyback diodes or TVS devices must be used to limit V_CE to ≤ -140V during turn-off transients.

How does the wettable flank feature improve manufacturing yield?

The wettable flank design exposes solderable metal along the side walls of Pins 1–8, enabling automated optical inspection (AOI) systems to verify fillet formation and solder wetting quality. This eliminates reliance on X-ray for hidden-joint validation and reduces false-fail rates in high-volume SMT lines by confirming coplanarity and solder volume before reflow.