STMicroelectronics ECMF02-2AMX6

Overview

ECMF02-2AMX6 from STMicroelectronics is a 2-line common mode filter with integrated ESD protection for USB 2.0 and MIPI D-PHY/MDDI differential interfaces, featuring -34 dB common mode attenuation at 900 MHz, 1.7 GHz bandwidth, 2.5 Ω typical DC resistance, ±8 kV contact/±15 kV air ESD rating per IEC 61000-4-2, and QFN-6L package (1.7 × 1.5 mm, 0.55 mm max height). It suppresses high-frequency common mode noise while preserving signal integrity in mobile phone camera and display data links.

For engineers reviewing the ECMF02-2AMX6 datasheet, ECMF02-2AMX6 pinout, ECMF02-2AMX6 application, or ECMF02-2AMX6 equivalent, key selection criteria include common mode attenuation profile across 800 MHz–2.2 GHz, differential insertion loss ≤ –0.6 dB up to 480 MHz, ESD clamping voltage under ±8 kV contact discharge, DC current rating of 200 mA, and PCB footprint compatibility with 0.45 mm pitch QFN-6L layout.

Technical Context

The device integrates two matched ESD-protected differential channels in a single monolithic structure, each with bidirectional TVS diodes and common mode choke windings optimized for 90 Ω differential impedance. Its architecture enables simultaneous filtering of common mode noise above 300 kHz and transient suppression without degrading USB 2.0 high-speed sync field performance (≤150 mV differential jitter).

Designed for placement directly at connector entry points, it uses low-parasitic internal routing to minimize inter-electrode capacitance (<0.3 pF line-to-line), ensuring minimal impact on differential return loss (>12 dB up to 1 GHz) and maintaining eye diagram compliance per USB 2.0 mask T1.

Key Specifications

Pinout & Package

ECMF02-2AMX6 uses a 6-pin QFN-6L package (1.7 × 1.5 mm body, 0.45 mm pitch, exposed thermal pad). Pin 1 is marked by dot; pin 1 location follows EIA-481 standard orientation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar common mode filter with ESD protection applications.

Compared with TPD2E001DRYR and CM1213A-02SO, ECMF02-2AMX6 uniquely delivers verified –34 dB common mode rejection at 900 MHz alongside USB 2.0 HSync compliance and MIPI D-PHY qualification-enabling single-component protection across dual-interface platforms without trade-offs in signal integrity or ESD margin.

Availability

ECMF02-2AMX6 is available at Aetrix Electronics and suitable for mobile phone camera modules, notebook display interfaces, and USB 2.0 OTG ports requiring stable component supply, consistent ESD performance across production lots, and RoHS-compliant QFN packaging.

Supply support for ECMF02-2AMX6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and consumer applications.

The ECMF series targets high-speed interface protection, combining ESD suppression and common mode filtering in miniature packages for space-constrained portable electronics with stringent EMC requirements.

FAQ

What is the maximum recommended reflow temperature profile for ECMF02-2AMX6?

The device complies with IPC/JEDEC J-STD-020 moisture sensitivity level 1 and supports peak reflow temperatures up to 260 °C for 10 seconds. ST recommends using their ECOPACK®-qualified profile with ramp rates ≤3 °C/s, preheat 150–200 °C for 60–120 s, and time above liquidus (TAL) of 60–90 s at 235–245 °C to ensure solder joint reliability without delamination.

Can ECMF02-2AMX6 be used on a 100 Ω differential impedance PCB stack-up?

Yes - the device is characterized for both 90 Ω (MIPI D-PHY, USB 2.0) and 100 Ω (some LVDS variants) differential impedances. Its differential insertion loss remains ≤ –0.8 dB up to 240 MHz on 100 Ω traces, and common mode attenuation exceeds –20 dB across 800 MHz–2.2 GHz regardless of target Z_diff, provided PCB layout follows ST's symmetrical routing and short-GND-via recommendations.

Does the NC pin (Pin 4) require any PCB layout treatment?

Pin 4 is internally unconnected and must not be bonded or electrically tied. ST specifies it may be left floating or connected to GND solely for mechanical anchoring - however, grounding it introduces parasitic capacitance that can degrade common mode attenuation above 1 GHz. Recommended practice is to omit copper pad or stencil opening for Pin 4 unless mechanical reinforcement is critical.

How does ECMF02-2AMX6 perform under repeated ESD stress beyond IEC 61000-4-2 Level 4?

Per ST's qualification testing, the device withstands ≥500 contact discharges at ±8 kV without parameter shift exceeding 10% in R_DC or V_BR. Post-stress measurements show no degradation in common mode attenuation or differential insertion loss, confirming robustness for high-volume automated assembly environments where multiple ESD events may occur during handling and testing.