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STMicroelectronics ECMF02-2BF3
- Part No.:
- ECMF02-2BF3
- Manufacturer:
- STMicroelectronics
- Category:
- Common Mode Chokes
- Package:
- -
- Datasheet:
-
ECMF02-2BF3.pdf
- Description:
- CMC 2LN SMD ESD
- Quantity:
- Payment:
- Shipping:
Inventory:8,735
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Product details
Overview
ECMF02-2BF3 from STMicroelectronics is a dual-line integrated common mode filter with ESD protection for high-speed differential serial interfaces, featuring >5 GHz differential bandwidth, -23 dB common-mode attenuation at 900 MHz, and ±15 kV air-discharge ESD robustness. It filters one differential lane in MIPI D-PHY, USB2.0, MDDI, or HDMI applications while occupying <1.1 mm² PCB area.
For engineers reviewing the ECMF02-2BF3 datasheet, ECMF02-2BF3 pinout, ECMF02-2BF3 application, or ECMF02-2BF3 equivalent, key selection criteria include common-mode rejection bandwidth (800 MHz–2.2 GHz), ultra-low parasitic integration, flip-chip bump layout compatibility, and IEC 61000-4-2 Level 4 ESD rating for high-reliability interface protection.
Technical Context
The device integrates two matched LC sections per differential line to suppress common-mode noise without degrading differential signal integrity. Its flip-chip construction with five bumps minimizes bond wire inductance and package capacitance, enabling operation beyond 5 GHz differential bandwidth.
Common-mode attenuation exceeds -20 dB across 800 MHz–2.2 GHz and reaches -23 dB at 900 MHz, directly supporting EMI compliance in compact mobile interface designs. The monolithic IPAD™ structure replaces discrete ferrite beads and capacitors while maintaining low insertion loss for differential signals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Differential bandwidth | >5 GHz - preserves signal integrity for USB2.0 (480 Mbps), MIPI D-PHY (up to 1 Gbps), and HDMI TMDS lanes. |
| Common-mode attenuation | -23 dB at 900 MHz - suppresses RF interference coupling into shared ground paths in handheld PCBs. |
| ESD rating (IEC 61000-4-2) | ±15 kV air, ±8 kV contact - protects interface pins against user-handling and system-level ESD events. |
| Package footprint | <1.1 mm² - enables placement adjacent to connectors or SoC BGA pads in space-constrained mobile modules. |
| Max height after reflow | 0.50 mm - compatible with thin-profile stacking and shield-can clearance requirements. |
| Construction | Flip-chip with 5 bumps - eliminates bond wires to reduce parasitic inductance and improve high-frequency common-mode rejection. |
Pinout & Package
ECMF02-2BF3 uses a lead-free, ultra-thin flip-chip package with five solder bumps on the bottom side. The package measures 0.85 mm × 1.30 mm × 0.50 mm (L×W×H max) and is designed for reflow-only assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IN1) | Differential input positive | Accepts high-speed differential signal positive leg (e.g., USB DP, MIPI D+). |
| 2 (IN2) | Differential input negative | Accepts high-speed differential signal negative leg (e.g., USB DM, MIPI D−). |
| A (GND) | Common reference plane | Provides low-inductance return path for common-mode current and ESD discharge. |
| B (OUT1) | Differential output positive | Delivers filtered differential signal positive leg to downstream receiver (e.g., SoC PHY). |
| C (OUT2) | Differential output negative | Delivers filtered differential signal negative leg to downstream receiver with matched delay and impedance. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated common-mode choke + ESD diode array | Replaces ≥4 discrete components (two ferrite beads + two TVS diodes), reducing layout complexity and board area. |
| Ultra-low parasitic design | Flip-chip bump interconnects limit self-inductance to <0.3 nH and inter-pin capacitance to <0.1 pF per path. |
| High common-mode rejection over wide band | Maintains >20 dB attenuation from 800 MHz to 2.2 GHz - critical for LTE/Wi-Fi coexistence in smartphone RF front-end proximity. |
| Lead-free and RoHS-compliant | Meets JEDEC J-STD-020 moisture sensitivity level 1 (MSL1) and Pb-free reflow profile requirements. |
Applications
| Mobile Camera Interface | USB2.0 Host Port Protection |
|---|---|
Use Scenario: MIPI D-PHY camera module connected to application processor in smartphones and tablets. IC Role / Device Role / Timing Role: Common-mode noise filter and ESD protector placed between camera flex cable connector and SoC D-PHY receiver. Use Value: Prevents radiated emissions from D-PHY clock/data pairs from coupling into adjacent RF bands while surviving repeated connector hot-plug ESD events. | Use Scenario: USB2.0 upstream port on portable media players or docking stations exposed to frequent cable insertion/removal. IC Role / Device Role / Timing Role: Front-end filtering and transient suppression for DP/DM lines before USB transceiver PHY. Use Value: Maintains signal integrity up to 480 Mbps by minimizing common-mode jitter induced by ground bounce and external RFI. |
| HDMI Source Filtering | MDDI Display Interface |
Use Scenario: HDMI transmitter in set-top boxes or portable projectors driving short internal cables to display panels. IC Role / Device Role / Timing Role: Common-mode choke on TMDS data/clock pairs to meet FCC Class B radiated emission limits. Use Value: Achieves -23 dB common-mode attenuation at 900 MHz - directly reduces peak emissions near cellular receive bands without adding series resistance. | Use Scenario: MDDI interface between baseband processor and display driver IC in legacy feature phones and industrial HMIs. IC Role / Device Role / Timing Role: Single-lane EMI filter protecting high-speed forward channel (297 Mbps) from switching noise generated by display backlight drivers. Use Value: Enables reliable MDDI link operation in electrically noisy environments where discrete LC filters fail due to parasitic resonance above 1 GHz. |
Availability
ECMF02-2BF3 is available at Aetrix Electronics and suitable for mobile camera modules, USB2.0 host ports, HDMI source circuits, and MDDI display interfaces requiring stable component supply and guaranteed long-term availability.
Supply support for ECMF02-2BF3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MEMS, power, and microcontroller products for industrial, automotive, and consumer markets.
The ECMF series belongs to ST's IPAD™ (Integrated Passive and Active Devices) portfolio, developed specifically to replace discrete EMI filters and ESD protectors in high-speed serial interface routing for space-constrained portable electronics.
FAQ
What is the maximum data rate supported by ECMF02-2BF3?
The ECMF02-2BF3 supports differential signaling up to 480 Mbps (USB2.0 full-speed), 1 Gbps (MIPI D-PHY HS mode), and 1.65 Gbps (HDMI TMDS), validated by its >5 GHz differential bandwidth and <0.5 dB insertion loss at 2.5 GHz. Its performance is specified for use with NRZ-encoded high-speed serial protocols without equalization.
Can ECMF02-2BF3 be used for differential pairs other than USB or MIPI?
Yes - it is applicable to any high-speed differential interface operating below 2.5 GHz where common-mode noise suppression and ±15 kV ESD protection are required, including LVDS, sub-LVDS, and proprietary serdes links. Layout must maintain controlled 100 Ω differential impedance and minimize stub length to preserve signal integrity.
How does the flip-chip construction affect PCB layout?
The 5-bump flip-chip design requires precise stencil aperture definition and solder paste volume control to ensure uniform bump wetting. Recommended land pattern follows ST's AN4195 guidelines: 0.35 mm diameter circular pads with 0.5 mm pitch, no solder mask defined, and thermal relief isolation on GND pad to prevent tombstoning during reflow.
Is ECMF02-2BF3 compliant with automotive AEC-Q200?
No - ECMF02-2BF3 is not qualified to AEC-Q200. It is rated for commercial temperature range (-40°C to +85°C) and intended for consumer and industrial portable equipment. For automotive infotainment or ADAS camera links, ST recommends the AEC-Q200-qualified ECMF02-2AMX2 or ECMF04-2AMX2 variants with extended temperature and vibration testing.
ECMF02-2BF3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- -
- Filter Type:
- Signal Line
- Number of Lines:
- 2
- Impedance @ Frequency:
- -
- Current Rating (Max):
- -
- DC Resistance (DCR) (Max):
- -
- Voltage Rating - DC:
- 4Ohm
- Voltage Rating - AC:
- -
- Operating Temperature:
- -
- Ratings:
- -30°C ~ 85°C
- Approval Agency:
- -
- Features:
- -
- Mounting Type:
- TVS Diode ESD Protection
- Size / Dimension:
- -
- Height (Max):
- -
ECMF02-2BF3 FAQ
1.How can I place an order for ECMF02-2BF3 through Aetrix?
Please submit a Request for Quotation (RFQ) for ECMF02-2BF3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ECMF02-2BF3 reliable?
The price and inventory of ECMF02-2BF3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ECMF02-2BF3 is usually 5 days.
3.What payment methods are accepted for ECMF02-2BF3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ECMF02-2BF3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ECMF02-2BF3?
ECMF02-2BF3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ECMF02-2BF3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ECMF02-2BF3?
For technical support, including ECMF02-2BF3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ECMF02-2BF3 requirements.
6.How does Aetrix verify that ECMF02-2BF3 is sourced from the original manufacturer or authorized distributors?
All ECMF02-2BF3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ECMF02-2BF3 meets industry standards.
7.What is the process for return or replacement of ECMF02-2BF3?
All ECMF02-2BF3 units undergo pre-shipment inspection (PSI). If there is an issue with ECMF02-2BF3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ECMF02-2BF3 part is unused and in its original packaging.
Return procedure for ECMF02-2BF3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ECMF02-2BF3 Tags
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