STMicroelectronics ECMF04-4HSWM10Y
- Part No.:
- ECMF04-4HSWM10Y
- Manufacturer:
- STMicroelectronics
- Category:
- Common Mode Chokes
- Package:
- 10-WFDFN
- Datasheet:
-
ECMF04-4HSWM10Y.pdf
- Description:
- CMC 100MA 4LN SMD ESD AEC-Q200
- Quantity:
- Payment:

- Shipping:

Inventory:6,589
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ECMF04-4HSWM10Y from STMicroelectronics is an AEC-Q101-qualified integrated common mode filter with integrated ESD protection, designed for HDMI 2.0/1.4, USB 3.1, MIPI, and LVDS differential buses. It delivers 3.5 GHz differential bandwidth, -24 dB common-mode attenuation at 1.5 GHz, and clamps to 27 V under 8 kV ISO 10605 contact discharge.
For engineers reviewing the ECMF04-4HSWM10Y datasheet, ECMF04-4HSWM10Y pinout, ECMF04-4HSWM10Y application, or ECMF04-4HSWM10Y equivalent, key selection criteria include differential bandwidth compliance with HDMI 2.0 (5.94 Gbps), common-mode noise suppression across LTE/GPS bands, wettable flank QFN-10L package compatibility with AOI, and integrated ±15 kV air/±8 kV contact ESD protection per ISO 10605.
Technical Context
This device integrates two independent common-mode chokes (D1+/D1− and D2+/D2− paths) with bidirectional ESD protection diodes on both connector-side terminals. Its differential impedance is matched to 100 Ω, and common-mode impedance is tuned for 50 Ω systems, enabling clean signal integrity in high-speed serial links without degrading eye diagrams.
The QFN-10L package features wettable flanks for solder joint inspection and supports reflow per J-STD-020 MSL Level 1. Electrical behavior is characterized up to 3.5 GHz (SDD21 = −3 dB), with DC resistance ≤5.5 Ω per differential path and leakage current ≤100 nA at 3 V standoff voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Differential Bandwidth | 3.5 GHz (SDD21 = −3 dB): ensures full compliance with HDMI 2.0 (5.94 Gbps) and USB 3.1 (5 Gbps) data rates |
| Common-Mode Attenuation | −24 dB at 1.5 GHz: suppresses GPS band interference without affecting differential signal integrity |
| ESD Clamping Voltage | 27 V at 8 kV contact discharge (ISO 10605, 150 pF/330 Ω): limits downstream IC stress during transient events |
| DC Resistance | 5.5 Ω max per differential pair: minimizes insertion loss and power dissipation in 100 mA RMS operation |
| Operating Temperature | −55 °C to +125 °C: supports automotive under-hood and infotainment module deployment |
| Package | QFN-10L, 2.6 mm × 1.35 mm × 0.75 mm: enables compact routing in space-constrained PCBs with AOI-compatible wettable flanks |
Pinout & Package
ECMF04-4HSWM10Y is housed in a 10-pin QFN package (QFN-10L) with wettable flank terminations for automated optical inspection. The exposed thermal pad is connected to GND internally and must be soldered to a PCB ground plane for optimal EMI performance and thermal stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (D1+ Con) | Connector-side positive terminal of Channel 1 | Input for differential signal pair 1 from external interface (e.g., HDMI source connector) |
| 2 (D1− Con) | Connector-side negative terminal of Channel 1 | Completes differential path for Channel 1; carries equal-magnitude opposite-phase signal |
| 3 (GND) | Common ground reference | Provides return path for ESD current and common-mode noise; ties internal choke shields and thermal pad |
| 4 (D2+ Con) | Connector-side positive terminal of Channel 2 | Input for second differential signal pair (e.g., USB 3.1 TX or MIPI DSI clock) |
| 5 (D2− Con) | Connector-side negative terminal of Channel 2 | Second connector-side differential input; electrically isolated from Channel 1 |
| 6 (D2− IC) | IC-side negative terminal of Channel 2 | Output to SoC or controller; maintains signal polarity and impedance continuity |
| 7 (D2+ IC) | IC-side positive terminal of Channel 2 | IC-side output for Channel 2; routed directly to host processor or PHY |
| 8 (GND) | Secondary ground terminal | Redundant GND connection to improve grounding symmetry and reduce ground loop inductance |
| 9 (D1− IC) | IC-side negative terminal of Channel 1 | Delivers filtered differential signal to host IC while preserving phase alignment |
| 10 (D1+ IC) | IC-side positive terminal of Channel 1 | Final output node for Channel 1; requires controlled 100 Ω differential trace routing |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive applications including infotainment, ADAS camera links, and telematics modules |
| Integrated ESD protection | Meets ISO 10605 Level 4 (±8 kV contact / ±15 kV air) without external TVS diodes |
| Wettable flank QFN-10L | Enables 100% automated optical inspection of solder joints-critical for automotive manufacturing traceability |
| Low PCB footprint | 3.5 mm² area (2.6 mm × 1.35 mm) reduces layout congestion in multi-lane high-speed interfaces |
| Thin profile | 0.75 mm height allows stacking under connectors or beneath low-profile shields in slim devices |
Applications
| HDMI 2.0 Interface Filtering | USB 3.1 Gen 1 Signal Conditioning |
|---|---|
Use Scenario: HDMI 2.0 video transmission from automotive head unit to digital dashboard display over 15 cm flex cable. IC Role / Device Role / Timing Role: Common-mode noise filter placed between connector and HDMI receiver PHY to suppress radiated emissions from differential pairs. Use Value: Maintains >80% eye opening at 5.94 Gbps even with worst-case cable and equalizer, per DS12859 Figure 9–10. | Use Scenario: USB 3.1 Gen 1 (5 Gbps) host-to-peripheral link in industrial docking station with hot-plug cycles. IC Role / Device Role / Timing Role: EMI/ESD front-end protection for Type-A receptacle, filtering common-mode noise induced by nearby switching regulators. Use Value: Prevents bit errors during sustained 5 Gbps operation while surviving repeated ±8 kV contact discharges per IEC 61000-4-2. |
| MIPI D-PHY Camera Link | LVDS Automotive Display Interface |
Use Scenario: 5.83 Gbps MIPI D-PHY v2.1 connection from image sensor to SoC in rear-view camera module. IC Role / Device Role / Timing Role: Dual-channel common-mode choke with ESD protection on both data lanes (CLK+/CLK−, DATA+/DATA−). Use Value: Reduces jitter-induced pixel corruption by attenuating 1.5–2.4 GHz cellular noise (−24 to −30 dB), verified in eye diagram testing (DS12859 Fig. 11–12). | Use Scenario: LVDS-based TFT display interface in instrument cluster operating at 1.2 Gbps with ambient temperature up to 105 °C. IC Role / Device Role / Timing Role: High-reliability common-mode filter ensuring EMC compliance in safety-critical driver information systems. Use Value: Sustains stable operation across −40 °C to +105 °C with <1% signal degradation, validated per AEC-Q101 thermal cycling and HTOL tests. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar common mode filter with integrated ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDK MEM2012W121RT001 | Single-channel, 1.2 GHz bandwidth, no integrated ESD diodes; requires external TVS | Limited to lower-speed interfaces (≤1.5 Gbps); unsuitable for HDMI 2.0 or USB 3.1 | Select only when cost sensitivity outweighs integration needs and speed requirements are ≤1 Gbps |
| ON Semiconductor NUF4310MUTAG | Quad-channel ESD array only; no common-mode choke function; RDC = 0.5 Ω but no CMRR specification | Provides ESD protection only; cannot replace common-mode filtering function-requires separate choke | Use only as supplemental ESD protection alongside discrete CM chokes, not as drop-in replacement |
Compared with MEM2012W121RT001 and NUF4310MUTAG, ECMF04-4HSWM10Y uniquely combines dual-channel 3.5 GHz common-mode filtering, integrated ±8 kV ESD protection, and automotive-grade reliability in one QFN-10L package-eliminating board space, BOM count, and layout complexity for HDMI/USB/MIPI designs.
Availability
ECMF04-4HSWM10Y is available at Aetrix Electronics and suitable for automotive infotainment, industrial camera interfaces, and high-speed embedded display systems requiring stable component supply, AEC-Q101 qualification, and RoHS-compliant packaging.
Supply support for ECMF04-4HSWM10Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering intelligent power, sensing, and control solutions for automotive, industrial, and consumer markets.
This device belongs to ST's ECMF series of integrated EMI filters, engineered specifically for high-speed serial interfaces in automotive and industrial environments where space, reliability, and EMC compliance are critical.
FAQ
What is the maximum differential data rate supported by ECMF04-4HSWM10Y?
The device supports differential data rates up to 5.94 Gbps, as validated by HDMI 2.0 eye diagram testing (DS12859 Figures 9–10). Its 3.5 GHz differential bandwidth (SDD21 = −3 dB) ensures minimal intersymbol interference and meets USB 3.1 Gen 1 and MIPI D-PHY v2.1 timing budgets without equalization.
Does ECMF04-4HSWM10Y require external ESD protection components?
No. The device integrates bidirectional ESD protection diodes on all connector-side pins (D1+/D1−/D2+/D2−), certified to ISO 10605 Level 4 (±8 kV contact, ±15 kV air) and IEC 61000-4-2. External TVS devices are unnecessary unless system-level surge requirements exceed these ratings.
How should the exposed thermal pad be handled during PCB layout?
The exposed pad (Pin 3 and Pin 8 GND connections) must be soldered to a solid PCB ground plane using at least nine thermal vias (0.3 mm diameter, spaced ≤1 mm apart) to ensure low-inductance grounding, effective heat dissipation, and optimal common-mode noise shunting. Stencil opening per DS12859 Figure 16 is recommended.
Is ECMF04-4HSWM10Y compatible with lead-free reflow profiles?
Yes. It is qualified for lead-free reflow per J-STD-020 MSL Level 1, with peak temperature up to 245 °C (see DS12859 Figure 25). The recommended profile includes ramp-up ≤3 °C/s, soak at 150–200 °C for 60–120 s, and time above liquidus (217 °C) of 60–90 s-fully compatible with standard Pb-free SAC305 processes.
ECMF04-4HSWM10Y Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 10-WFDFN
- Filter Type:
- Signal Line
- Number of Lines:
- 4
- Impedance @ Frequency:
- -
- Current Rating (Max):
- -
- DC Resistance (DCR) (Max):
- 100mA
- Voltage Rating - DC:
- 5.5Ohm (Typ)
- Voltage Rating - AC:
- -
- Operating Temperature:
- -
- Ratings:
- -55°C ~ 125°C
- Approval Agency:
- AEC-Q200
- Features:
- -
- Mounting Type:
- TVS Diode ESD Protection
- Size / Dimension:
- -
- Height (Max):
- -
ECMF04-4HSWM10Y FAQ
1.How can I place an order for ECMF04-4HSWM10Y through Aetrix?
Please submit a Request for Quotation (RFQ) for ECMF04-4HSWM10Y on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ECMF04-4HSWM10Y reliable?
The price and inventory of ECMF04-4HSWM10Y are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ECMF04-4HSWM10Y is usually 5 days.
3.What payment methods are accepted for ECMF04-4HSWM10Y?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ECMF04-4HSWM10Y transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ECMF04-4HSWM10Y?
ECMF04-4HSWM10Y orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ECMF04-4HSWM10Y order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ECMF04-4HSWM10Y?
For technical support, including ECMF04-4HSWM10Y datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ECMF04-4HSWM10Y requirements.
6.How does Aetrix verify that ECMF04-4HSWM10Y is sourced from the original manufacturer or authorized distributors?
All ECMF04-4HSWM10Y products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ECMF04-4HSWM10Y meets industry standards.
7.What is the process for return or replacement of ECMF04-4HSWM10Y?
All ECMF04-4HSWM10Y units undergo pre-shipment inspection (PSI). If there is an issue with ECMF04-4HSWM10Y, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ECMF04-4HSWM10Y part is unused and in its original packaging.
Return procedure for ECMF04-4HSWM10Y:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ECMF04-4HSWM10Y Tags
-4-Lead.jpg)
-
DLM0NSN900HY2D
Murata Electronics
-4-Lead.jpg)
-
DLM0NSM900HY2D
Murata Electronics

-
DLM0QSN900HY2D
Murata Electronics

-
TCM0605M-900-2P-T201
TDK Corporation

-
LCFE121002A900TG
Littelfuse Inc.

-
DLM11SN900HZ2L
Murata Electronics

-
ACM2012H-381-2P-T05
TDK Corporation

-
SRF2012-900YA
Bourns Inc.

-
ACM2012-900-2P-T002
TDK Corporation

-
ACM2012-361-2P-T002
TDK Corporation

-
ACM2012-121-2P-T002
TDK Corporation

-
ACM2012D-900-2P-T00
TDK Corporation
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
