STMicroelectronics ECMF4-40A100N10

Overview

ECMF4-40A100N10 from STMicroelectronics is a highly integrated common mode filter with ESD protection for dual-lane high-speed differential interfaces. It supports HDMI 2.1 (12 Gbps), USB4 (20 Gbps), USB 3.2 Gen2 (10 Gbps), MIPI M-PHY Gear 4 (11.66 Gbps), and DisplayPort 2.0, featuring 10.7 GHz differential bandwidth, ±10 kV contact/±25 kV air ESD rating per IEC 61000-4-2, and 3.0 Ω DC serial resistance. Used in compact portable devices to preserve signal integrity while suppressing common-mode noise.

For engineers reviewing the ECMF4-40A100N10 datasheet, ECMF4-40A100N10 pinout, ECMF4-40A100N10 application, or ECMF4-40A100N10 equivalent, this page delivers verified electrical specs, validated μQFN-10L package layout, real-world eye diagram performance data across HDMI/USB/MIPI standards, and precise ESD clamping behavior under TLP and IEC 61000-4-2 stress.

Technical Context

This device integrates four bidirectional ESD-protected common-mode chokes-two independent differential lanes (D1+, D1−, D2+, D2−)-in a single μQFN-10L package. Each lane provides simultaneous differential-mode signal pass-through and common-mode noise attenuation up to −21 dB at 5.0 GHz, with low parasitic capacitance (0.25–0.40 pF) and dynamic resistance of 0.8 Ω under 16 A TLP pulse.

It operates over −55 °C to +125 °C, supports 5 V reverse working voltage per line, and maintains <50 nA leakage at 3.6 V. Its 10.7 GHz differential cutoff frequency ensures minimal insertion loss for 12–20 Gbps signaling, while its symmetric internal layout preserves differential impedance (100 Ω) and minimizes skew between lanes.

Key Specifications

Pinout & Package

ECMF4-40A100N10 uses a 2.20 mm × 1.35 mm × 0.50 mm μQFN-10L package with wettable flanks, 0.4 mm pitch, and exposed thermal pad (Pin 3 and Pin 8 are GND). The package supports fine-pitch SMT assembly with recommended stencil opening of 1.710 mm × 0.660 mm and 100 µm thickness.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-lane high-speed ESD filtering applications.

Compared with ECMF2-40A100N6, the ECMF4-40A100N10 adds a second protected lane and +1 kV ESD margin, enabling compact dual-interface designs; versus TPD4S012DR, it delivers integrated common-mode rejection essential for HDMI/USB4 signal integrity-not just ESD survival.

Availability

ECMF4-40A100N10 is available at Aetrix Electronics and suitable for HDMI 2.1 source designs, USB4 host ports, and MIPI M-PHY Gear 4 camera interfaces requiring stable component supply, consistent RoHS-compliant manufacturing, and guaranteed tape-and-reel delivery for SMT production.

Supply support for ECMF4-40A100N10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.

This device belongs to ST's ECOPACK®-qualified ESD protection portfolio, engineered specifically for high-speed serial interface integrity-balancing ultra-wide bandwidth, low parasitics, and certified IEC 61000-4-2 immunity in minimal footprints.

FAQ

What is the maximum differential data rate supported by ECMF4-40A100N10?

ECMF4-40A100N10 supports differential signaling up to 20 Gbps, validated with USB4 (20.0 Gbps), HDMI 2.1 (12 Gbps), and MIPI M-PHY Gear 4 (11.66 Gbps) eye diagrams showing full compliance and >30% eye height improvement over unprotected layouts. Its 10.7 GHz differential bandwidth ensures negligible insertion loss at these rates.

Can ECMF4-40A100N10 be used for single-lane applications like USB 3.2 Gen2?

Yes-it can protect a single differential lane (e.g., USB 3.2 Gen2) by using only Pins 1/2/9/10 (D1+/- to connector/IC) and grounding Pins 3 and 8, leaving Pins 4/5/6/7 unused. This retains full ±10 kV ESD rating and 10.7 GHz bandwidth for that lane, though board layout should avoid stubs on unused pins.

How does the common-mode attenuation performance vary across frequency bands?

Per DS13913 Rev 4 Figure 5, common-mode attenuation is −15 dB at 2.4 GHz, −21 dB at 5.0 GHz, and −17 dB at 6.0 GHz-optimized to suppress Wi-Fi 2.4/5 GHz and Bluetooth interference on high-speed lanes. Attenuation remains >−10 dB up to 10 GHz, ensuring broadband noise suppression without affecting differential signal integrity.

What PCB layout practices are critical for optimal ESD and signal performance?

Key practices include: (1) connecting both GND pins (3 and 8) to a solid, low-inductance ground plane; (2) matching trace lengths between D1+/D1− and D2+/D2− to within 50 µm; (3) avoiding vias or splits under the package; and (4) using the recommended 1.710 mm × 0.660 mm stencil opening to control solder volume and prevent bridging on 0.4 mm pitch.