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Silicon Labs EFM32LG890F256-BGA112
- Part No.:
- EFM32LG890F256-BGA112
- Manufacturer:
- Silicon Labs
- Category:
- Microcontrollers
- Package:
- 112-LFBGA
- Datasheet:
-
EFM32LG890F256-BGA112.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 112BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,088
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Product details
Overview
EFM32LG890F256-BGA112 from Silicon Laboratories is a 32-bit ARM Cortex-M3 microcontroller optimized for ultra-low-power battery-operated systems, featuring 256 kB flash, 32 kB RAM, 48 MHz operation, 0.65 μA Stop mode current, and hardware AES encryption. It integrates autonomous peripherals including LESENSE, PRS, and low-energy UARTs for sensor-rich IoT endpoints in smart metering and wearable health devices.
For engineers reviewing the EFM32LG890F256-BGA112 datasheet, EFM32LG890F256-BGA112 pinout, EFM32LG890F256-BGA112 application, or EFM32LG890F256-BGA112 equivalent, key selection criteria include energy mode transitions (EM0–EM4), BGA112 package I/O count (up to 93 GPIO), peripheral reflex system autonomy, and backup power domain support for RTC retention during main supply loss.
Technical Context
The EFM32LG890F256-BGA112 implements a full ARM Cortex-M3 core with Memory Protection Unit and ETM trace, paired with a flexible Energy Management Unit supporting five distinct energy modes (EM0–EM4) with sub-μA deep-sleep operation. Its clock system includes dual crystal oscillators (HFXO/LFXO), four RC oscillators (HFRCO, LFRCO, ULFRCO, AUXHFRCO), and automatic oscillator switching.
Peripheral autonomy is enabled via the 12-channel Peripheral Reflex System (PRS) and Low Energy Sensor Interface (LESENSE), allowing analog sensor monitoring-including capacitive and LC sensing-without CPU intervention in EM2 Deep Sleep mode. The integrated USB 2.0 controller includes on-chip PHY and 5 V-to-3.3 V regulator for host/OTG functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 @ 48 MHz with MPU and ETM trace support for deterministic real-time control and debug visibility. |
| Memory | 256 kB flash (in-system programmable) and 32 kB RAM-sufficient for complex firmware with secure boot and OTA update buffers. |
| Energy Modes | EM0 (Run): 211 μA/MHz; EM1 (Sleep): 63 μA/MHz; EM2 (Deep Sleep): 0.95 μA with RTC; EM3 (Stop): 0.65 μA with RAM/CPU retention; EM4 (Shutoff): 20 nA. |
| Analog Peripherals | 12-bit 1 Msps ADC (8 SE/4 diff channels), 12-bit 500 ksps DAC (2 SE/1 diff), 3 opamps (6.1 MHz GBW), 2 ACMPs, LESENSE for autonomous capacitive/LC sensing. |
| Communication | 3× USART (UART/SPI/I²S/SmartCard/IrDA), 2× I²C (SMBus), 2× LEUART, USB 2.0 (host/OTG) with embedded PHY and regulator. |
| Security & Timing | Hardware AES-128/256 accelerator (54/75 cycles), 24-bit + 32-bit RTCs, backup RTC in separate power domain, 16-bit LETIMER. |
| Package | BGA112 (6 × 6 mm, 0.5 mm pitch) with 93 configurable GPIO pins, supporting high-density PCB layouts for compact portable designs. |
Pinout & Package
BGA112 package: 6 mm × 6 mm body, 0.5 mm ball pitch, 112 I/O balls arranged in 10 × 10 array with corner balls omitted. Compatible with standard reflow profiles and IPC-7351B land pattern.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Main power supply | 1.98–3.8 V input; powers core, digital peripherals, and most analog blocks; requires local 100 nF decoupling per VDD ball. |
| VSS | Ground reference | Digital ground plane connection; multiple VSS balls ensure low-impedance return paths for high-frequency switching noise. |
| PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD15, PE0–PE15 | General-purpose I/O | 93 total GPIO across 5 ports; individually configurable as push-pull, open-drain, pull-up/down, with programmable drive strength and input filtering. |
| USB_DP / USB_DM | USB differential pair | Full-speed USB 2.0 interface; internal termination and PHY eliminate need for external resistors or transceivers. |
| XTAL0 / XTAL1 | HFXO crystal terminals | Connects to 4–32 MHz crystal; enables precise timing for USB, audio, or high-accuracy communication interfaces. |
| LFXO_IN / LFXO_OUT | LFXO crystal terminals | Connects to 32.768 kHz crystal for RTC and low-energy wake-up; operates in all energy modes including EM4 Shutoff. |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous Peripheral Reflex System (PRS) | 12-channel hardware interconnect enabling timer-triggered ADC sampling or GPIO toggling without CPU involvement-reducing active time and power in sensor polling loops. |
| Low Energy Sensor Interface (LESENSE) | Hardware state machine that autonomously scans up to 16 capacitive or inductive sensors in EM2 Deep Sleep, waking CPU only on threshold breach-enabling multi-week battery life in touch-enabled wearables. |
| Backup Power Domain | Dedicated power rail for RTC, BURTC, and retention registers; maintains timekeeping and critical state when main VDD drops below brown-out threshold or is removed entirely. |
| Hardware AES Accelerator | 128/256-bit key encryption/decryption in 54/75 clock cycles-offloads cryptographic operations from CPU, preserving low-latency response in secure bootloader or TLS handshake routines. |
| Configurable Peripheral Routing | GPIO pin locations assignable to specific peripheral functions (e.g., USART0_TX on PA5 or PC10); eliminates fixed routing constraints and simplifies PCB layout reuse across variants. |
Applications
| Smart Utility Metering | Wearable Health Monitoring |
|---|---|
Use Scenario: Gas/water/electricity meters requiring decade-long battery life, tamper detection, and periodic RF transmission of consumption data. IC Role / Device Role / Timing Role: Primary system controller managing metrology ADC sampling, pulse counting, LCD display, and sub-GHz radio wake-up via LEUART or PRS-triggered SPI. Use Value: EM4 Shutoff mode (20 nA) preserves battery during idle periods; hardware AES secures firmware updates; LFXO-backed RTC ensures accurate billing interval timing. | Use Scenario: Optical heart-rate monitors using photoplethysmography (PPG) with motion artifact compensation and Bluetooth LE data streaming. IC Role / Device Role / Timing Role: Sensor hub aggregating PPG, accelerometer, and temperature data; performs real-time motion compensation and triggers BLE transmission only on valid physiological events. Use Value: LESENSE autonomously drives LED/photodiode sequencing in EM2 while CPU sleeps; PRS synchronizes ADC sampling with LED pulses; 32 kB RAM buffers multi-second waveform segments. |
| Industrial Wireless Sensor Node | Home Security Panel |
Use Scenario: Battery-powered vibration/temperature/humidity node transmitting data every 5 minutes over Zigbee or Thread mesh networks. IC Role / Device Role / Timing Role: Edge intelligence unit executing sensor fusion, anomaly detection, and low-power wireless stack scheduling with precise wake-up timing. Use Value: 0.95 μA EM2 Deep Sleep with RTC wake-up ensures predictable duty cycling; hardware CRC and AES protect OTA firmware integrity; 93 GPIO support multi-sensor expansion. | Use Scenario: Panel controlling door/window sensors, motion detectors, and siren drivers with local alarm logic and cellular backup reporting. IC Role / Device Role / Timing Role: Central security controller managing zone inputs, keypad scanning, LCD status display, and GSM modem handshaking via USART. Use Value: EM3 Stop mode (0.65 μA) maintains armed state with RAM retention; backup RTC tracks intrusion timestamps during AC failure; USB supports field firmware recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-energy MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| EFM32PG12B500F1024GL125 | ARM Cortex-M4F core, 1024 kB flash, 256 kB RAM, higher performance (40 MHz), enhanced analog (14-bit ADC), no USB OTG. | Better suited for motor control or audio processing where FPU and larger memory are required; lacks USB host capability. | Select when floating-point math, larger code footprint, or higher-resolution analog acquisition is needed-accept trade-off of higher active current (240 μA/MHz). |
| EFM32GG11B820F2048GL192 | ARM Cortex-M4F, 2048 kB flash, 512 kB RAM, 72 MHz, advanced security (TRNG, secure boot), QFN192 package. | Targeted at secure edge gateways requiring TLS offload, large OTA image storage, and multi-protocol connectivity (USB + Ethernet MAC). | Choose for high-assurance applications needing PSA Level 3 certification, but note larger footprint and higher cost versus BGA112 compactness. |
Compared with EFM32LG890F256-BGA112, the EFM32PG12B500F1024GL125 offers greater computational headroom at the expense of USB host functionality and slightly higher sleep current, while the EFM32GG11B820F2048GL192 delivers enterprise-grade security and memory scalability but requires redesign for QFN192 layout and thermal management.
Availability
EFM32LG890F256-BGA112 is available at Aetrix Electronics and suitable for smart metering, wearable health devices, industrial sensor nodes, and home security systems requiring stable component supply across multi-year production cycles.
Supply support for EFM32LG890F256-BGA112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Silicon Labs is a fabless semiconductor company specializing in secure, intelligent wireless and wired connectivity solutions for IoT, industrial, and consumer markets.
The EFM32 Leopard Gecko product line was designed specifically for energy-constrained embedded applications demanding sub-μA sleep currents, autonomous peripheral operation, and robust security-targeting battery-powered endpoints in metering, healthcare, and building automation.
FAQ
What is the maximum operating frequency of the EFM32LG890F256-BGA112?
The EFM32LG890F256-BGA112 operates at a maximum CPU frequency of 48 MHz using the ARM Cortex-M3 core. This speed is achievable with the high-frequency crystal oscillator (HFXO) or high-frequency RC oscillator (HFRCO), and is maintained across the full supply voltage range of 1.98 V to 3.8 V. Performance-critical peripherals such as USB and USARTs are clocked synchronously to ensure timing compliance at this rate.
Does the EFM32LG890F256-BGA112 support USB device and host functionality?
Yes, the EFM32LG890F256-BGA112 integrates a full-featured USB 2.0 controller compliant with USB 2.0 specification, supporting device, host, and OTG modes. It includes an on-chip PHY and embedded 5 V-to-3.3 V regulator, eliminating external components. The USB interface remains functional in EM0 (Run) and EM1 (Sleep) modes, enabling low-latency enumeration and data transfer without full wake-up from deeper energy modes.
How many GPIO pins does the EFM32LG890F256-BGA112 provide in the BGA112 package?
The EFM32LG890F256-BGA112 provides up to 93 general-purpose I/O pins across five ports (PA–PE) in the BGA112 package. Each pin supports configurable drive modes (push-pull, open-drain), programmable pull-up/pull-down, input filtering, and slew-rate control. Pin alternate functions are fully remappable via the GPIO_ROUTE register, enabling flexible PCB layout and signal routing optimization.
What energy modes are supported by the EFM32LG890F256-BGA112, and what is the lowest current draw?
The EFM32LG890F256-BGA112 supports five energy modes: EM0 (Run), EM1 (Sleep), EM2 (Deep Sleep), EM3 (Stop), and EM4 (Shutoff). The lowest current draw is 20 nA in EM4 Shutoff mode at 3 V, with optional RTC operation increasing consumption to 0.4 μA. EM3 Stop mode draws 0.65 μA while retaining RAM, CPU state, and brown-out detection-ideal for fast wake-up (< 2 μs) with minimal power penalty.
Is hardware AES encryption available on the EFM32LG890F256-BGA112, and what key lengths does it support?
Yes, the EFM32LG890F256-BGA112 includes a dedicated hardware AES accelerator supporting both 128-bit and 256-bit keys. Encryption and decryption execute in 54 and 75 clock cycles respectively, independent of CPU load. The module supports ECB, CFB, and CBC modes and integrates with DMA for zero-CPU-overhead bulk data processing-critical for secure bootloader validation and TLS record encryption in the EFM32LG890F256-BGA112.
EFM32LG890F256-BGA112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Silicon Labs
- Package/Case:
- 112-LFBGA
- Series:
- Leopard Gecko
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 90
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.98V ~ 3.8V
- Data Converters:
- A/D 8x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
EFM32LG890F256-BGA112 FAQ
1.How can I place an order for EFM32LG890F256-BGA112 through Aetrix?
Please submit a Request for Quotation (RFQ) for EFM32LG890F256-BGA112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for EFM32LG890F256-BGA112 reliable?
The price and inventory of EFM32LG890F256-BGA112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for EFM32LG890F256-BGA112 is usually 5 days.
3.What payment methods are accepted for EFM32LG890F256-BGA112?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for EFM32LG890F256-BGA112 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for EFM32LG890F256-BGA112?
EFM32LG890F256-BGA112 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your EFM32LG890F256-BGA112 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for EFM32LG890F256-BGA112?
For technical support, including EFM32LG890F256-BGA112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your EFM32LG890F256-BGA112 requirements.
6.How does Aetrix verify that EFM32LG890F256-BGA112 is sourced from the original manufacturer or authorized distributors?
All EFM32LG890F256-BGA112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that EFM32LG890F256-BGA112 meets industry standards.
7.What is the process for return or replacement of EFM32LG890F256-BGA112?
All EFM32LG890F256-BGA112 units undergo pre-shipment inspection (PSI). If there is an issue with EFM32LG890F256-BGA112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The EFM32LG890F256-BGA112 part is unused and in its original packaging.
Return procedure for EFM32LG890F256-BGA112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
EFM32LG890F256-BGA112 Tags
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