STMicroelectronics E-L6932D2.5

Overview

E-L6932D2.5 from STMicroelectronics is a 2A ultra-low-dropout linear regulator with fixed 2.5V output, 2V–14V input range, 200mΩ max R_DS(on), 1% voltage accuracy, and integrated enable and power-good functions. It delivers stable 2.5V supply to chipset I/O and RAM in mobile PCs and motherboards under high-current, low-headroom conditions.

For engineers reviewing the E-L6932D2.5 datasheet, E-L6932D2.5 pinout, E-L6932D2.5 application, or E-L6932D2.5 equivalent, key selection criteria include dropout performance at 2A, thermal behavior in SO-8 (4+4), quiescent current under light load, and PGOOD threshold tolerance for system sequencing.

Technical Context

The L6932D2.5 uses an internal 50mΩ N-channel MOSFET as the pass element, enabling ultra-low dropout operation-critical for converting 3.3V to 2.5V at 2A in portable systems. Its error amplifier references a 1.25V bandgap and compares feedback against a precision resistor divider or internal fixed tap.

Protection circuitry includes foldback current limiting (2.5A ±8%), thermal shutdown at 150°C with 20°C hysteresis, and open-drain PGOOD that asserts low when V_OUT drops below 90% of nominal. The EN pin supports logic-level control with 0.65V typical threshold.

Key Specifications

Pinout & Package

Supplied in SO-8 (4+4) package-8-pin small-outline with four GND pins (pins 5–8) for enhanced thermal and electrical performance. Package outline conforms to JEDEC MS-012AC, body size 4.9 × 3.9 × 1.75 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-output, high-current LDO applications.

Compared with TPS7A4700RGWR and NCP1117ST2.5T3G, E-L6932D2.5 uniquely combines 2A capability, SO-8 (4+4) thermal efficiency, integrated EN/PGOOD, and sub-400mV dropout-making it the only drop-in solution for space-limited, high-current digital rail applications requiring sequencing and fault reporting.

Availability

E-L6932D2.5 is available at Aetrix Electronics and suitable for motherboard chipset I/O supply, mobile PC core logic rails, and hand-held instrument digital core applications requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.

Supply support for E-L6932D2.5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and consumer markets since 1987.

The L6932 series was developed specifically for high-current, low-dropout power management in portable and embedded computing platforms-emphasizing thermal efficiency, sequencing control, and compatibility with dense PCB layouts.

FAQ

What is the minimum input voltage required to maintain 2.5V output at 2A?

The minimum input voltage is determined by dropout: V_IN(min) = V_OUT + (I_OUT × R_DS(on)). With R_DS(on) ≤200mΩ and I_OUT = 2A, V_IN(min) = 2.5V + 0.4V = 2.9V. Below this, regulation fails and output collapses. Datasheet confirms stable operation down to 2V-but only at lighter loads.

Can E-L6932D2.5 be used in adjustable mode?

No-E-L6932D2.5 is a fixed-output variant. Only the L6932D1.2 version includes functional ADJ pin routing. In D2.5, pin 3 is internally connected to the 2.5V reference and must remain unconnected or grounded per layout guidelines; using it as ADJ will cause regulation failure.

How does the PGOOD pin behave during startup and fault conditions?

PGOOD is open-drain and remains high-impedance until V_OUT reaches ≥90% of 2.5V (≥2.25V). It then pulls low only if V_OUT falls below that threshold. During startup, it transitions from high-Z to pulled-low after ~100µs delay once regulation is achieved-no external pull-up is required for basic monitoring.

What PCB layout practices maximize thermal performance in SO-8 (4+4)?

Maximize copper area connected to pins 5–8 (GND) using ≥2 oz. copper and multiple thermal vias to inner ground planes. Place input/output capacitors within 5mm of respective pins. Avoid routing high-current traces over sensitive analog sections. Datasheet specifies 62°C/W junction-to-ambient on demo board with 4 cm² copper-doubling copper area can reduce θ_JA by ~20%.