Renesas EL7554IRE
- Part No.:
- EL7554IRE
- Manufacturer:
- Renesas
- Package:
- 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Datasheet:
-
EL7554IRE.pdf
- Description:
- IC REG BUCK ADJ 4A 28HTSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,354
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Product details
Overview
EL7554IRE from Intersil is a monolithic synchronous 4A step-down DC/DC regulator with integrated CMOS power FETs, operating from 3V to 6V input and delivering adjustable output down to 0.8V. It achieves up to 96% efficiency at 4A continuous load, supports 1MHz switching frequency, and includes junction temperature monitoring and ±5% voltage margining for manufacturing test validation. It is used in FPGA core/I/O power supplies requiring compact, thermally robust point-of-load regulation.
For engineers reviewing the EL7554IRE datasheet, EL7554IRE pinout, EL7554IRE application, or EL7554IRE equivalent, this page delivers verified technical context, package-validated pin functions, real-world start-up control configurations, thermal design guidance for HTSSOP-28, and confirmed alternative regulators for PoL supply redesigns.
Technical Context
The EL7554IRE implements constant-frequency PWM control with patented resistorless current sensing for fast transient response and over-current protection. Its dual CMOS power stage (PMOS high-side + NMOS low-side) enables true 100% duty cycle operation and eliminates boot capacitor requirements.
It integrates full start-up sequencing via STP/STN tracking inputs, soft-start with programmable delay, power-good indication with ±10% window, and on-die thermal shutdown at 135°C with 20°C hysteresis. The VTJ pin provides linear voltage output (1.2V @ 75°C) calibrated to junction temperature per TJ = (VTJ − 1.2)/0.00384 + 75.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | 4A continuous - supports FPGA core rails and multi-rail DSP/CPU I/O supplies without external current sharing. |
| Input Voltage Range | 3V to 6V - compatible with single-cell Li-ion, 3.3V/5V intermediate bus, and industrial 5V systems. |
| Switching Frequency | Up to 1MHz - enables use of ≤2.2µH inductors and ceramic capacitors, achieving <0.58 in² PCB footprint with one-side component placement. |
| Efficiency | Up to 96% - minimizes thermal dissipation in space-constrained embedded and portable applications. |
| Output Voltage Range | 0.8V to near VIN - supports low-voltage logic rails (e.g., 0.8V, 1.2V, 1.8V) and dynamic margining for system-level burn-in testing. |
| Thermal Protection | 135°C shutdown / 110°C restart - ensures safe operation under sustained overload or poor airflow conditions. |
| Package | 28 Ld HTSSOP (MDP0048) with exposed thermal pad - achieves θJA as low as 26°C/W on 2-layer PCB with proper via layout and copper area. |
Pinout & Package
The EL7554IRE is housed in a thermally efficient 28-lead HTSSOP package (MDP0048) with an exposed thermal pad requiring solder connection to PCB ground plane for optimal heat dissipation. Layout guidelines mandate ≥13–25 mil thermal vias under the pad, no thermal reliefs, and separation of PGND (power ground) and SGND (signal ground) with single-point connection at SGND pin.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (COMP) | Error amplifier output | Connect loop compensation network (RC/CC); sets converter bandwidth and stability. |
| 3 (FB) | Voltage feedback input | Connects to resistor divider (R1/R2) to set output voltage; also accepts speed-up capacitor for transient response enhancement. |
| 8–13 (LX) | Inductor drive node | High-current switched node; average voltage equals VOUT; requires low-inductance routing to minimize EMI and ringing. |
| 16–18 (PGND) | Power ground return | Low-side FET source connection; must be tied directly to thermal pad and large copper pour for minimal IR drop. |
| 19–21 (VIN) | Main input supply | Drain connection of high-side PMOS; requires local 2×10µF ceramic input capacitance placed adjacent to pins. |
| 22 (VDD) | Internal bias supply | Powered via internal 20Ω resistor from VIN; bypassed externally only if noise sensitivity demands it. |
| 23 (PG) | Power-good indicator | Open-drain output active-high when VOUT is within ±10% of target; used for sequencing multiple regulators or system enable. |
| 24 (EN) | Enable input | Active-high with 2.5µA internal pull-up; adding capacitor delays startup; threshold is 2.6V (HI) / 1V (LO). |
| 25 (STP), 26 (STN) | Tracking inputs | Enable synchronized startup with auxiliary supply; STP tied to master VOUT, STN to slave VOUT for linear ramp alignment. |
| 27 (COSC) | Oscillator timing | Connects to capacitor (220pF typical) to set switching frequency; supports external sync via AC-coupled signal. |
| 28 (SGND) | Signal ground reference | Control circuit ground; must connect to PGND at single point near SGND pin to avoid noise coupling into feedback path. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CMOS power FETs | Eliminates external MOSFETs and boot capacitor; reduces BOM count and layout complexity for compact PoL designs. |
| ±5% voltage margining | Enabled via TM/SEL pins; allows rapid functional validation of downstream ICs during production test without hardware changes. |
| Junction temperature monitor (VTJ) | Provides analog voltage proportional to die temperature (1.2V @ 75°C); replaces external thermal sensors and simplifies thermal characterization. |
| Full start-up control | Supports four modes - adjustable soft-start, cascade, linear tracking, and offset tracking - enabling precise multi-rail sequencing in complex systems. |
| All-ceramic capacitor support | Enables use of X5R/X7R MLCCs for input/output filtering; avoids electrolytic/Polymer caps, improving reliability and lifetime in harsh environments. |
Applications
| FPGA Core Power Supply | DSP/CPU I/O Supply |
|---|---|
|
Use Scenario: Providing stable 1.2V/1.8V rail to FPGA core logic under dynamic load transients up to 4A. IC Role / Device Role / Timing Role: Primary step-down regulator delivering regulated voltage with fast transient response and margining capability for pre-silicon validation. Use Value: 96% efficiency and 1MHz operation reduce thermal load and board area; VTJ monitoring enables real-time die temperature logging during stress testing. |
Use Scenario: Generating 3.3V I/O supply for multi-core DSPs with tight voltage tolerance and sequencing requirements relative to core rail. IC Role / Device Role / Timing Role: Synchronized secondary regulator using STP/STN inputs to track core rail startup and ensure correct power-on order. Use Value: Built-in tracking eliminates need for external sequencer ICs; ±10% PG window ensures reliable system enable signaling across temperature. |
| Logic/Bus Voltage Regulation | Portable Equipment Power Management |
|
Use Scenario: Delivering 2.5V/3.3V to high-speed parallel buses (e.g., DDR memory interface, PCIe control logic) with low noise and ripple. IC Role / Device Role / Timing Role: Low-noise, fixed-frequency PWM regulator with all-ceramic filtering to meet stringent EMI and voltage ripple specs. Use Value: Constant-frequency operation simplifies EMI filter design; 0.58 in² footprint enables integration into dense handheld PCB layouts. |
Use Scenario: Regulating battery-derived 3.7V–4.2V input to 1.8V system rail in battery-powered instrumentation or medical devices. IC Role / Device Role / Timing Role: High-efficiency buck converter with UVLO (2.5V shutdown) and thermal protection to maximize runtime and safety. Use Value: 96% peak efficiency extends battery life; HTSSOP-28 thermal pad enables passive cooling without heatsinks in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS544B20RTWR | 4A, 4.5–18V input, 600kHz max fSW, integrated FETs, but lacks VTJ pin and voltage margining. | Targets higher-input industrial systems; not suitable for 3V–6V battery-fed designs or margining-based production test. | Choose TPS544B20RTWR only when input exceeds 6V or when TI's WEBENCH ecosystem is required for design support. |
| MP2315GJ-Z | 4A, 4.5–28V input, 1.2MHz fSW, no thermal monitor or margining; smaller QFN-10 package but lower thermal performance. | Better suited for cost-sensitive consumer applications where thermal monitoring and manufacturing test features are unnecessary. | Select MP2315GJ-Z if board space is critical and thermal management can be handled externally; avoid for FPGA/DSP PoL where VTJ and margining add value. |
Compared with TPS544B20RTWR and MP2315GJ-Z, the EL7554IRE uniquely combines 3–6V input compatibility, junction temperature monitoring, ±5% voltage margining, and HTSSOP-28 thermal performance-making it the only option validated for FPGA core rail validation and thermally constrained portable designs.
Availability
EL7554IRE is available at Aetrix Electronics and suitable for FPGA core power supplies, DSP/CPU I/O regulation, logic/bus voltage conversion, and portable equipment power management requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for EL7554IRE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Intersil Corporation (now part of Renesas Electronics) is a U.S.-based analog and power management IC designer known for high-performance DC/DC regulators, precision amplifiers, and interface solutions.
The EL7554IRE belongs to Intersil's monolithic synchronous buck regulator product line, engineered specifically for high-density point-of-load applications in FPGA, DSP, and CPU subsystems where thermal efficiency, sequencing control, and manufacturing testability are critical.
FAQ
What is the maximum continuous output current supported by the EL7554IRE?
The EL7554IRE supports 4A continuous output current under specified thermal conditions (TA = −40°C to +85°C, proper PCB layout with thermal vias). Peak current limit is 6A, but sustained operation above 4A requires derating based on ambient temperature and copper area - see Figure 10 in the FN7360 datasheet for allowable power dissipation curves. The EL7554IRE's 28-lead HTSSOP package with exposed thermal pad enables this rating without external heatsinking.
Does the EL7554IRE require an external boot capacitor?
No, the EL7554IRE does not require an external boot capacitor because it uses a PMOS high-side switch instead of an NMOS. This architecture eliminates the need for charge-pump or bootstrap circuitry, simplifying layout and reducing component count. The EL7554IRE's integrated CMOS power stage (PMOS + NMOS) enables true 100% duty cycle operation and inherent bootstrap-free operation - a key differentiator from many competing buck controllers.
How is the junction temperature monitored on the EL7554IRE?
The EL7554IRE provides junction temperature monitoring via the VTJ pin, which outputs a linear analog voltage: VTJ = 1.2V − 0.00384 × (TJ − 75). Measuring VTJ with a precision ADC allows direct calculation of die temperature TJ. This feature replaces external thermal sensors and accelerates thermal characterization - especially valuable during FPGA/DSP system validation. The EL7554IRE's VTJ pin is internally calibrated and requires only a 0.01–0.047µF capacitor to SGND for noise filtering.
Can the EL7554IRE synchronize its switching frequency to an external clock?
Yes, the EL7554IRE supports external synchronization via the COSC pin. An AC-coupled external clock signal (with amplitude >1.2Vpp and frequency 20% higher than the internal oscillator setting) can be injected through a series capacitor. To avoid beat frequencies, the internal switching frequency should be set ~20% lower than the sync source - e.g., configure COSC for 800kHz when syncing to a 1MHz master clock. This capability is documented in Figure 20 of the EL7554IRE datasheet FN7360.
What are the recommended layout practices for the EL7554IRE's thermal pad?
The EL7554IRE's exposed thermal pad must be soldered to a solid PCB ground plane using ≥6 thermal vias (13–25 mil diameter) placed directly beneath the pad, with no thermal reliefs. Copper area should extend beyond the package outline, and PGND traces must be wide and short. Per Figure 25 in FN7360, this layout achieves θJA ≈ 26°C/W on a 2-layer board. Failure to follow these guidelines risks thermal shutdown under 4A load - the EL7554IRE's performance is layout-dependent, not just datasheet-guaranteed.
EL7554IRE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 3V
- Voltage - Input (Max):
- 6V
- Voltage - Output (Min/Fixed):
- 0.8V
- Voltage - Output (Max):
- 6V
- Current - Output:
- 4A
- Frequency - Switching:
- 200kHz ~ 1MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-HTSSOP
EL7554IRE FAQ
1.How can I place an order for EL7554IRE through Aetrix?
Please submit a Request for Quotation (RFQ) for EL7554IRE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for EL7554IRE reliable?
The price and inventory of EL7554IRE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for EL7554IRE is usually 5 days.
3.What payment methods are accepted for EL7554IRE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for EL7554IRE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for EL7554IRE?
EL7554IRE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your EL7554IRE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for EL7554IRE?
For technical support, including EL7554IRE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your EL7554IRE requirements.
6.How does Aetrix verify that EL7554IRE is sourced from the original manufacturer or authorized distributors?
All EL7554IRE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that EL7554IRE meets industry standards.
7.What is the process for return or replacement of EL7554IRE?
All EL7554IRE units undergo pre-shipment inspection (PSI). If there is an issue with EL7554IRE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The EL7554IRE part is unused and in its original packaging.
Return procedure for EL7554IRE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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