Analog Devices Inc. EV1HMC1162LP5

Overview

EV1HMC1162LP5 from Analog Devices is an evaluation board for the HMC1162 monolithic microwave integrated circuit (MMIC) voltage-controlled oscillator (VCO), supporting dual-frequency RF output (9.25–10.10 GHz and 4.625–5.050 GHz), 11 dBm typical RFOUT power, −115 dBc/Hz SSB phase noise at 100 kHz offset, and operation across −40°C to +85°C. It enables local oscillator implementation in microwave synthesizers for point-to-point radios and VSAT systems.

For engineers reviewing the EV1HMC1162LP5 datasheet, EV1HMC1162LP5 application, EV1HMC1162LP5 pinout, or EV1HMC1162LP5 equivalent, this page delivers verified board-level specifications, interface schematics, grounding requirements, RF layout guidance, and sourcing support - all specific to the EV1HMC1162LP5 evaluation platform.

Technical Context

The EV1HMC1162LP5 is a dedicated evaluation PCB for the HMC1162LP5E VCO IC, featuring SMA RF connectors (J1–J4), dc headers (J5/J6), and optimized decoupling network including 100 pF (C1–C3), 1000 pF (C4), 2.2 μF tantalum (C5–C7), and 0.01 μF (C8) capacitors. The board uses Rogers 4350 substrate to maintain controlled 50 Ω impedance on RF traces.

It implements direct connection of the HMC1162's exposed thermal pad to ground plane via multiple vias, supports ac-coupled RFOUT and RFOUT/2 outputs, and provides VTUNE and VCC interfaces compliant with HMC1162's absolute maximum ratings (VTUNE: 0–15 V, VCC: 5.5 V max). No external resonator or matching components are required on the board.

Key Specifications

Availability

EV1HMC1162LP5 is available at Aetrix Electronics and suitable for microwave radio development, VSAT transceiver validation, and test equipment calibration requiring stable component supply, traceable evaluation hardware, and documented RF layout practices.

Supply support for EV1HMC1162LP5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, automotive, and aerospace markets with precision signal processing solutions.

The EV1HMC1162LP5 belongs to Analog Devices' microwave evaluation board portfolio, designed specifically to accelerate prototyping and characterization of Hittite-derived MMIC VCOs like the HMC1162LP5E in demanding RF systems.

FAQ

What is the primary function of the EV1HMC1162LP5?

The EV1HMC1162LP5 is an evaluation board for the HMC1162LP5E MMIC VCO, enabling rapid characterization of its 9.25–10.10 GHz fundamental and 4.625–5.050 GHz half-frequency outputs. It provides calibrated RF interfaces, proper decoupling, and thermal grounding - not a functional subsystem or production-ready module. Engineers use the EV1HMC1162LP5 to validate VCO performance before integrating the HMC1162LP5E into custom designs.

Does the EV1HMC1162LP5 include the HMC1162LP5E IC?

Yes, the EV1HMC1162LP5 evaluation board includes one mounted HMC1162LP5E IC (32-lead LFCSP_VQ package) as U1 per the Bill of Materials (Table 4). The board is shipped fully assembled with all passive components and connectors installed, ready for immediate RF testing without soldering or configuration.

What RF connector types are used on the EV1HMC1162LP5?

The EV1HMC1162LP5 uses four PCB-mount SMA connectors: J1 and J2 for RFOUT and RFOUT/2 outputs, J3 for VTUNE input, and J4 for VCC monitoring. All SMA connectors are 50 Ω impedance-matched and rated for DC–18 GHz operation, ensuring minimal insertion loss and return loss up to the HMC1162's operating band.

Is the EV1HMC1162LP5 compatible with other HMC1162 variants?

No - the EV1HMC1162LP5 is specifically designed for the HMC1162LP5E variant in the 5 mm × 5 mm LFCSP_VQ (HCP-32-1) package. It is not mechanically or electrically compatible with die, bare-die, or alternative封装 versions (e.g., chip-on-carrier or different lead counts), nor with earlier HMC1162 revisions lacking the same pinout and thermal pad layout.

How should the ground plane be implemented when using the EV1HMC1162LP5 in a test setup?

When using the EV1HMC1162LP5, connect all SMA outer conductors, J5/J6 header grounds, and the board's exposed ground paddle directly to a low-impedance lab ground reference. Use short, wide grounding straps - avoid daisy-chained or high-inductance paths. The board's internal via-stitched ground architecture requires external grounding only at these designated points to preserve RF stability and phase noise performance.