Analog Devices Inc. EV1HMC260ALC3B

Overview

EV1HMC260ALC3B from Analog Devices is an evaluation board for the HMC260ALC3B GaAs MMIC double-balanced mixer, supporting RF/LO operation from 10 GHz to 26 GHz and IF bandwidth from dc to 8 GHz. It enables rapid characterization of conversion loss (8–9 dB), LO-to-RF isolation (40 dB), and input IP3 (19 dBm typical) in upconverter or downconverter configurations without external matching components.

For engineers reviewing the EV1HMC260ALC3B datasheet, EV1HMC260ALC3B pinout, EV1HMC260ALC3B application, or EV1HMC260ALC3B equivalent, this board provides a validated RF layout with SRI 2.92 mm (RF/LO) and SMA (IF) connectors, 50 Ω impedance control, and direct-exposed-pad grounding-critical for millimeter-wave mixer evaluation in point-to-point radios, test equipment, and military systems.

Technical Context

The EV1HMC260ALC3B implements the HMC260ALC3B die in a Rogers 4350-based PCB with controlled-impedance RF paths, optimized via-stitched ground planes, and connectorized I/O ports. Its design enforces strict 50 Ω termination at RF (J1), LO (J2), and IF (J3) interfaces while maintaining thermal integrity via direct connection of the LCC's exposed pad to the internal ground plane.

This evaluation platform supports both upconversion (IF dc–8 GHz → RF 10–26 GHz) and downconversion (RF 10–26 GHz → IF dc–8 GHz) with LO drive levels from 9 dBm to 15 dBm. Performance validation includes measured conversion loss, IIP3, P1dB, and isolation across temperature (−40°C to +85°C) and LO power sweeps.

Key Specifications

Availability

EV1HMC260ALC3B is available at Aetrix Electronics and suitable for millimeter-wave radio development, automated test equipment calibration, and defense-grade RF subsystem validation requiring stable, traceable evaluation hardware supply.

Supply support for EV1HMC260ALC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, automotive, and defense markets with precision signal processing solutions.

The EV1HMC260ALC3B belongs to Analog Devices' microwave evaluation platform family, designed specifically to accelerate time-to-test for GaAs and GaN MMIC mixers, amplifiers, and switches operating above 10 GHz.

FAQ

What is the EV1HMC260ALC3B used for?

The EV1HMC260ALC3B is an evaluation PCB for the HMC260ALC3B double-balanced mixer IC. It allows engineers to characterize RF performance-including conversion loss, isolation, and linearity-in real-world 10–26 GHz upconverter/downconverter applications without custom PCB design. The board includes calibrated SRI 2.92 mm and SMA connectors, making it ideal for lab validation and system integration testing of the EV1HMC260ALC3B's underlying mixer functionality.

Does the EV1HMC260ALC3B require external bias or matching components?

No. The EV1HMC260ALC3B hosts the passive HMC260ALC3B mixer die, which requires no DC bias and operates without external matching networks. All RF, LO, and IF ports are pre-matched to 50 Ω on the evaluation board. The only user requirements are proper RF cabling, calibrated signal sources, and adherence to the recommended LO drive level (9–15 dBm) specified for the HMC260ALC3B IC integrated on the EV1HMC260ALC3B.

What connectors are fitted on the EV1HMC260ALC3B?

The EV1HMC260ALC3B features two SRI 2.92 mm connectors (J1 for RF, J2 for LO) rated to 40 GHz and one Johnson SMA connector (J3 for IF) rated to 18 GHz. These provide low-reflection, repeatable connections essential for accurate mmWave mixer measurements. Connector placement follows RF best practices, including ground-plane continuity and minimal stub length-critical for reliable data acquisition on the EV1HMC260ALC3B.

Can the EV1HMC260ALC3B be used for both upconversion and downconversion?

Yes. The EV1HMC260ALC3B supports full bidirectional operation as specified for the HMC260ALC3B IC: downconversion (RF 10–26 GHz → IF dc–8 GHz) and upconversion (IF dc–8 GHz → RF 10–26 GHz). Its symmetric, broadband layout preserves balun performance across both modes, and published test data-including Figures 7–22 in the HMC260ALC3B datasheet-was generated using the EV1HMC260ALC3B platform.

Is thermal management addressed on the EV1HMC260ALC3B?

Yes. The EV1HMC260ALC3B implements robust thermal design per the HMC260ALC3B's θ_JA = 120°C/W specification: the LCC's exposed pad is soldered directly to a solid internal ground plane, reinforced with a 3×3 array of thermal vias connecting to outer ground layers. This ensures effective heat dissipation during sustained LO drive (up to 15 dBm) and maintains junction temperature within −40°C to +85°C limits on the EV1HMC260ALC3B.