Analog Devices Inc. EV1HMC553ALC3B
- Part No.:
- EV1HMC553ALC3B
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
EV1HMC553ALC3B.pdf
- Description:
- EVALUATION PCB ASSEMBLY
- Quantity:
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Product details
Overview
HMC553ALC3B from Analog Devices is a GaAs MMIC double-balanced mixer operating from 6 GHz to 14 GHz RF/LO, with dc–5 GHz IF bandwidth, 7 dB typical conversion loss (6–11 GHz), 18 dBm typical input IP3, and 36 dB typical LO-to-RF isolation. It serves as a passive upconverter/downconverter in microwave radios and EW systems without requiring DC bias or external matching.
For engineers reviewing the HMC553ALC3B datasheet, HMC553ALC3B pinout, HMC553ALC3B application, or HMC553ALC3B equivalent, this page delivers verified RF performance specs, terminal-level interface guidance, thermal and isolation behavior across temperature and LO drive, and validated alternatives for Ka-band transceiver design.
Technical Context
The HMC553ALC3B uses optimized on-die balun structures to achieve high LO-to-RF (30–37 dB) and LO-to-IF (28–33 dB) suppression across its full 6–14 GHz range. Its passive architecture eliminates DC bias requirements and enables surface-mount assembly without wire bonding.
It supports both upper- and lower-sideband operation in downconversion (RF = LO ± IF) and upconversion (RF = LO ± IFIN), with stable conversion loss (7–10 dB), P1dB (8–11.5 dBm), and IP3 (15–22 dBm) over −40°C to +85°C ambient, under LO drive of 9–15 dBm.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 6 GHz to 14 GHz - enables direct use in X- and Ku-band radar, VSAT, and point-to-point links without frequency translation stages. |
| IF Bandwidth | DC to 5 GHz - supports baseband I/Q sampling and wide instantaneous bandwidth signal processing. |
| Conversion Loss | 7 dB typical (6–11 GHz), 8–10 dB (11–14 GHz) - defines minimum gain budget required in receiver chain or driver stage in transmitter. |
| Input IP3 | 18 dBm typical (6–11 GHz), 19–22 dBm (11–14 GHz) - determines third-order intermodulation headroom in multi-carrier or dense-spectrum environments. |
| LO-to-RF Isolation | 30–37 dB - reduces LO leakage into antenna path, easing filtering requirements and improving transmit spectral purity. |
| Operating Temp | −40°C to +85°C - qualified for outdoor microwave radios, military EW platforms, and industrial test equipment enclosures. |
| Package | 12-terminal, 2.90 mm × 2.90 mm LCC, RoHS-compliant - surface-mount compatible with standard reflow profiles (260°C peak). |
Pinout & Package
12-terminal leadless ceramic chip carrier (LCC) package with exposed ground pad (EPAD); requires RF/dc grounding of all GND pins (1, 3, 4, 6, 7, 9) and EPAD for optimal isolation and thermal performance. NIC pins (10, 11, 12) may be grounded without affecting operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 7, 9 | GND | RF/dc ground reference; mandatory connection to minimize LO leakage and ensure return loss <−15 dB across band. |
| 2 | LO | 50 Ω ac-coupled local oscillator port; accepts 9–15 dBm drive; no DC bias required. |
| 5 | IF | dc-coupled intermediate frequency port; supports dc–5 GHz; must not source/sink >3 mA to prevent die malfunction. |
| 8 | RF | 50 Ω ac-coupled radio frequency port; matched for −10 dBm input; used for either RF input (downconv.) or output (upconv.). |
| 10, 11, 12 | NIC | Not internally connected; may be tied to ground to improve mechanical stability or EMI shielding without electrical impact. |
| EPAD | Exposed Pad | Thermal and RF ground path; must be soldered to solid ground plane via ≥9 thermal vias (3×3 array) per JEDEC JESD51-2. |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Eliminates external bias networks and decoupling components, reducing BOM count and PCB area in high-frequency layouts. |
| Double-balanced topology | Provides inherent rejection of LO×2, RF×2, and LO±RF spurs, simplifying post-mixer filtering in sensitive receive chains. |
| Wide IF bandwidth (dc–5 GHz) | Enables direct sampling of complex waveforms including OFDM, QAM, and pulsed radar signals without IF amplification stages. |
| High LO-to-RF isolation (36 dB typ.) | Reduces need for external LO suppression filters, lowering insertion loss and system noise figure in compact front-end designs. |
| RoHS-compliant LCC package | Supports automated SMT assembly with standard reflow profiles and ensures compatibility with lead-free manufacturing requirements. |
Applications
| Microwave VSAT Radios | Electronic Warfare Receivers |
|---|---|
|
Use Scenario: Downconverting 12.25–12.75 GHz satellite downlink signals to 70–500 MHz IF for digitization and demodulation. IC Role / Device Role / Timing Role: Passive double-balanced mixer acting as first-stage frequency translator in LNB subsystem. Use Value: 7 dB conversion loss and 36 dB LO-to-RF isolation enable high dynamic range without active gain before ADC, preserving SNR. |
Use Scenario: Wideband intercept receiver scanning 6–14 GHz spectrum for threat signal detection and analysis. IC Role / Device Role / Timing Role: Core downconverter in channelized or tunable superheterodyne front end. Use Value: dc–5 GHz IF bandwidth supports real-time FFT-based signal classification across full Ku-band span. |
| Point-to-Point Backhaul | Military ECM Transmitters |
|
Use Scenario: Upconverting 100–2000 MHz baseband data to 10.7–11.7 GHz licensed band for high-capacity wireless links. IC Role / Device Role / Timing Role: Transmit-side mixer driven by synthesizer LO and DAC-generated IF. Use Value: 19 dBm input IP3 and 8 dB conversion loss maintain EVM <3% at 256-QAM under multi-tone excitation. |
Use Scenario: Jammer front end generating deceptive signals across 6–14 GHz using fast-tuned LO sources. IC Role / Device Role / Timing Role: High-linearity upconverter enabling broadband noise or pulse-modulated jamming waveforms. Use Value: 11.5 dBm P1dB and 22 dBm IP3 at 13 GHz allow clean high-power output without compression-induced spectral regrowth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC774ALC3 | Wider RF/LO range (4–16 GHz), higher LO drive (13–17 dBm), 0.5 dB higher conversion loss at 12 GHz. | Better suited for wideband test equipment requiring coverage below 6 GHz; less optimal for fixed 10–12 GHz VSAT due to higher LO power demand. | Select when extended low-end frequency coverage or higher LO tolerance is required; verify thermal derating at 17 dBm LO. |
| QPC1006 | GaN-based, 5–15 GHz, 22 dBm P1dB, 28 dBm IP3, but requires +5 V bias and external matching networks. | Higher power handling enables saturated jammer output; unsuitable for battery-powered or bias-sensitive receivers. | Choose for high-power ECM transmitters where DC bias and layout complexity are acceptable trade-offs for linearity. |
Compared with HMC774ALC3 and QPC1006, the HMC553ALC3B offers lowest system integration effort-no DC bias, no external matching, and industry-standard LO drive-making it optimal for cost- and size-constrained Ku-band radios where 11.5 dBm P1dB suffices.
Availability
HMC553ALC3B is available at Aetrix Electronics and suitable for microwave VSAT radios, electronic warfare receivers, point-to-point backhaul systems, and military ECM transmitters requiring stable component supply across extended temperature and high-frequency performance.
Supply support for HMC553ALC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving aerospace, defense, communications, and instrumentation markets with precision signal processing solutions.
The HMC553ALC3B belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for broadband, high-linearity microwave mixing in defense and test equipment where passive reliability and minimal external circuitry are critical.
FAQ
What is the recommended LO drive level for optimal performance of the HMC553ALC3B?
The HMC553ALC3B operates optimally with LO drive between 11 dBm and 13 dBm. At 13 dBm, it achieves 7 dB typical conversion loss and 18 dBm IP3 in the 6–11 GHz band. Drive below 9 dBm increases conversion loss; above 15 dBm risks exceeding absolute maximum ratings. The HMC553ALC3B datasheet specifies 9–15 dBm as the functional range, with 13 dBm delivering best linearity vs. loss trade-off.
Can the HMC553ALC3B be used for both upconversion and downconversion?
Yes, the HMC553ALC3B is fully bidirectional: it functions as a downconverter (RF → IF) or upconverter (IF → RF) across its entire 6–14 GHz RF/LO range. Performance data in the datasheet confirms stable conversion loss, IP3, and isolation in both modes, including upper- and lower-sideband configurations. No hardware change is needed-only LO and signal port assignments differ.
Does the HMC553ALC3B require external DC blocking or matching components?
No. The HMC553ALC3B integrates internal DC blocking on LO and RF ports and requires no external matching networks. Its 50 Ω ac-coupled LO and RF ports and dc-coupled IF port are impedance-matched across band. Only proper RF grounding of all GND pins and the EPAD is required-no baluns, bias tees, or LC networks are necessary for basic operation.
What is the thermal management requirement for continuous operation of the HMC553ALC3B?
The HMC553ALC3B has a junction-to-ambient thermal resistance (θJA) of 120°C/W. To maintain junction temperature ≤125°C at +85°C ambient, the PCB must provide ≥9 thermal vias under the EPAD connected to an internal ground plane, per JEDEC JESD51-2. Derating begins above 85°C ambient at 4.6 mW/°C; max continuous dissipation is 414 mW at TA = 85°C.
How does the HMC553ALC3B perform at extreme temperatures?
The HMC553ALC3B maintains specified performance from −40°C to +85°C. Conversion loss varies by ≤0.5 dB, IP3 by ≤1.5 dB, and P1dB by ≤0.8 dB across this range at 13 dBm LO drive. Figures 7–14 and 15–24 in the datasheet confirm stable operation at all three temperature extremes, making it suitable for uncontrolled outdoor and airborne environments.
EV1HMC553ALC3B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Mixer
- Frequency:
- 6GHz ~ 14GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC553ALC3B
EV1HMC553ALC3B FAQ
1.How can I place an order for EV1HMC553ALC3B through Aetrix?
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6.How does Aetrix verify that EV1HMC553ALC3B is sourced from the original manufacturer or authorized distributors?
All EV1HMC553ALC3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that EV1HMC553ALC3B meets industry standards.
7.What is the process for return or replacement of EV1HMC553ALC3B?
All EV1HMC553ALC3B units undergo pre-shipment inspection (PSI). If there is an issue with EV1HMC553ALC3B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The EV1HMC553ALC3B part is unused and in its original packaging.
Return procedure for EV1HMC553ALC3B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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