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Analog Devices Inc. EV1HMC554ALC3B
- Part No.:
- EV1HMC554ALC3B
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
EV1HMC554ALC3B.pdf
- Description:
- MIXER
- Quantity:
- Payment:
- Shipping:
Inventory:2,456
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Product details
Overview
HMC554ALC3B from Analog Devices is a GaAs MMIC double-balanced mixer operating from 10 GHz to 20 GHz, supporting both upconversion and downconversion with 8.5 dB typical conversion loss, 37 dB LO-to-RF isolation, and +20 dBm input IP3. It functions as a passive RF front-end component in microwave transceivers requiring high-frequency signal translation without external matching.
For engineers reviewing the HMC554ALC3B datasheet, HMC554ALC3B pinout, HMC554ALC3B application, or HMC554ALC3B equivalent, this device is selected for its wide RF bandwidth, excellent port isolation, and surface-mount LCC package compatibility with high-volume RF assembly processes.
Technical Context
The HMC554ALC3B employs a GaAs MESFET-based double-balanced topology with integrated balun structures that enable simultaneous high LO-to-RF (37 dB typ) and LO-to-IF isolation while maintaining broadband operation across 10–20 GHz. Its passive architecture eliminates bias requirements and external matching networks.
It supports DC–6 GHz IF bandwidth in both upconverter and downconverter modes, with ac-coupled RF/LO ports and a dc-coupled IF port rated for ±3 mA current. Thermal design relies on the exposed pad connected to RF/dc ground, achieving θJC = 195°C/W in the E-12-41 package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 10 GHz to 20 GHz - enables direct use in X- and Ku-band radar, VSAT, and EW systems without frequency translation stages. |
| IF Frequency Range | DC to 6 GHz - supports baseband through low-SHF IF interfaces, including direct-coupled analog baseband and high-speed digital IF sampling. |
| Conversion Loss | 8.5 dB typ - defines signal attenuation between RF and IF ports; impacts system noise figure and gain budget planning. |
| LO to RF Isolation | 37 dB typ - suppresses LO leakage into antenna paths, reducing spurious emissions and receiver desensitization. |
| Input IP3 | +20 dBm typ - determines third-order intermodulation distortion performance in multi-tone RF environments such as dense spectrum EW. |
| P1dB | +10 dBm typ - sets maximum usable input power before compression; critical for dynamic range in high-signal test equipment. |
| Package | 2.90 mm × 2.90 mm, 12-terminal LCC (E-12-41) - RoHS-compliant leadless chip carrier compatible with standard SMT reflow and RF grounding via exposed pad. |
Pinout & Package
Package: 2.90 mm × 2.90 mm, 12-terminal leadless chip carrier (LCC), RoHS-compliant, with exposed thermal pad (EPAD) requiring RF/dc ground connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 7, 9 | GND | RF/dc ground terminals - must be soldered to solid ground plane; multiple pins reduce inductance for broadband return path. |
| 2 | LO | Local oscillator input - internally ac-coupled and 50 Ω matched; accepts +9 to +15 dBm LO drive without external matching. |
| 5 | IF | Intermediate frequency port - dc-coupled; supports operation to DC but limited to ±3 mA source/sink current to prevent die malfunction. |
| 8 | RF | Radiated frequency port - internally ac-coupled and 50 Ω matched; handles RF input up to +25 dBm absolute max rating. |
| 10, 11, 12 | NIC | Not internally connected - may be tied to ground for mechanical stability or EMI shielding; no electrical impact on performance. |
| EPAD | Exposed Pad | Thermal and RF ground interface - must be soldered to large copper area for thermal dissipation (θJC = 195°C/W) and optimal RF grounding. |
Key Features
| Feature | Design Value |
|---|---|
| Double-balanced GaAs MMIC architecture | Enables inherent suppression of LO×2, RF×2, and LO±RF spurs without external filtering or tuning. |
| No external components required | Reduces BOM count and layout complexity; eliminates discrete baluns, matching networks, or bias tees in RF signal chains. |
| 10–20 GHz RF bandwidth with DC–6 GHz IF | Supports flexible system partitioning - e.g., IF at 100 MHz for narrowband demodulation or 3 GHz for wideband digitization. |
| 37 dB LO-to-RF isolation | Minimizes LO radiation risk in transmit-receive shared-antenna systems and improves spectral purity in sensitive receivers. |
| RoHS-compliant LCC package | Enables automated high-volume SMT assembly and eliminates wire bonding; exposed pad ensures repeatable thermal performance. |
Applications
| Microwave VSAT Radios | Test & Measurement Equipment |
|---|---|
Use Scenario: Dual-polarized Ku-band satellite modems performing simultaneous uplink/downlink frequency translation. IC Role / Device Role / Timing Role: Downconverter for received 12.25–12.75 GHz signals to 1.2–1.7 GHz IF; upconverter for transmitted IF to 14.0–14.5 GHz band. Use Value: 8.5 dB conversion loss and 20 dBm IP3 maintain link margin and adjacent-channel interference rejection in multi-carrier environments. |
Use Scenario: Vector network analyzer (VNA) receiver front-end measuring S-parameters of millimeter-wave components. IC Role / Device Role / Timing Role: Downconverter translating 10–20 GHz DUT response to lower IF for digitization and analysis. Use Value: 37 dB LO-to-RF isolation prevents LO feedthrough from corrupting low-level reflected signal measurements. |
| Military Electronic Warfare | Radar Warning Receivers |
Use Scenario: Wideband digital RF memory (DRFM) jammer front-end capturing and retransmitting threat radar pulses. IC Role / Device Role / Timing Role: High-dynamic-range downconverter acquiring 10–20 GHz pulse trains with minimal distortion and spurious generation. Use Value: +10 dBm P1dB and +20 dBm IP3 preserve pulse fidelity and enable detection of low-power LPI waveforms amid strong interferers. |
Use Scenario: Airborne RWR detecting and classifying pulsed radar emitters across X/Ku bands. IC Role / Device Role / Timing Role: First-stage downconverter in channelized receiver architecture, translating RF to intermediate frequencies for parallel processing. Use Value: DC–6 GHz IF bandwidth allows direct digitization of wide instantaneous bandwidths without additional IF translation stages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC774ALC3 | Wider RF range (7–27 GHz), higher conversion loss (9.5 dB typ), same LCC package. | Better suited for Ka-band extension; less optimal for 10–15 GHz where HMC554ALC3B offers lower loss and better IP3. | Select HMC774ALC3 only when >20 GHz coverage is mandatory; otherwise HMC554ALC3B delivers superior linearity and efficiency in its native band. |
| QPC7522 | GaAs pHEMT process, 12–22 GHz RF range, 7.5 dB conversion loss, QFN-24 package (3.0 × 3.0 mm). | Lower conversion loss but narrower temperature range (−40°C to +70°C vs. +85°C); requires external matching for optimal port match. | Choose QPC7522 for cost-sensitive, lower-temperature commercial test gear; prefer HMC554ALC3B for military-grade thermal robustness and guaranteed broadband match. |
Compared with HMC774ALC3 and QPC7522, the HMC554ALC3B provides the best balance of conversion loss, IP3, and thermal reliability specifically within the 10–20 GHz band, with no external matching required and full industrial temperature support.
Availability
HMC554ALC3B is available at Aetrix Electronics and suitable for microwave VSAT radios, electronic warfare subsystems, and high-frequency test equipment requiring stable component supply, traceable sourcing, and long-term lifecycle management.
Supply support for HMC554ALC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving aerospace, defense, communications, and industrial markets with precision signal processing solutions.
The HMC554ALC3B belongs to Analog Devices' Hittite Microwave MMIC product line, designed specifically for broadband RF front-end applications demanding high isolation, wide dynamic range, and surface-mount manufacturability in defense and instrumentation systems.
FAQ
What is the recommended LO drive level for optimal performance of the HMC554ALC3B?
The HMC554ALC3B achieves best conversion loss, IP3, and isolation at +13 dBm LO drive. The datasheet specifies a nominal range of +9 to +15 dBm; operation below +9 dBm increases conversion loss, while exceeding +15 dBm risks reliability degradation. For the HMC554ALC3B, consistent +13 dBm drive ensures repeatable 8.5 dB conversion loss and 37 dB LO-to-RF isolation across temperature.
Can the HMC554ALC3B be used for DC-coupled IF applications?
Yes, the HMC554ALC3B IF port is dc-coupled and supports operation from DC. However, the absolute maximum IF source/sink current is ±3 mA - exceeding this may cause die malfunction or failure. For DC-coupled use, ensure external circuitry limits current to ≤3 mA; for AC-coupled operation above ~10 MHz, a series capacitor is recommended. This applies directly to the HMC554ALC3B's pin 5 (IF) terminal.
What is the thermal resistance (θJC) of the HMC554ALC3B and how should it be managed?
The HMC554ALC3B has a junction-to-case thermal resistance (θJC) of 195°C/W, measured per JEDEC JESD51-2. Effective thermal management requires soldering the exposed pad (EPAD) to a low-thermal-resistance PCB ground plane with ≥6 thermal vias. Without proper EPAD grounding, junction temperature rise exceeds specifications under 333 mW max dissipation, risking parametric shift or failure. This requirement is integral to the HMC554ALC3B's LCC package implementation.
Does the HMC554ALC3B require external matching components?
No, the HMC554ALC3B is fully matched internally: RF and LO ports are ac-coupled and 50 Ω matched across 10–20 GHz, and the IF port is dc-coupled with no external matching needed. The datasheet confirms zero external components are required for basic operation - a key differentiator of the HMC554ALC3B versus discrete mixer designs. Layout must still maintain controlled 50 Ω traces and solid ground referencing.
How does the HMC554ALC3B perform in upconverter versus downconverter mode?
The HMC554ALC3B delivers symmetric performance: downconversion shows 8.5 dB conversion loss (typ) at IF = 100 MHz, while upconversion achieves 7 dB loss under identical conditions. Input IP3 remains +19.5 dBm (up) and +20 dBm (down), confirming balanced linearity. Both modes operate across the full 10–20 GHz RF band and DC–6 GHz IF range - a core capability validated in the HMC554ALC3B datasheet's dedicated upconverter/downconverter characterization sections.
EV1HMC554ALC3B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Mixer
- Frequency:
- 10GHz ~ 20GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- HMC554ALC3B
EV1HMC554ALC3B FAQ
1.How can I place an order for EV1HMC554ALC3B through Aetrix?
Please submit a Request for Quotation (RFQ) for EV1HMC554ALC3B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for EV1HMC554ALC3B reliable?
The price and inventory of EV1HMC554ALC3B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for EV1HMC554ALC3B is usually 5 days.
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Once your EV1HMC554ALC3B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for EV1HMC554ALC3B?
For technical support, including EV1HMC554ALC3B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your EV1HMC554ALC3B requirements.
6.How does Aetrix verify that EV1HMC554ALC3B is sourced from the original manufacturer or authorized distributors?
All EV1HMC554ALC3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that EV1HMC554ALC3B meets industry standards.
7.What is the process for return or replacement of EV1HMC554ALC3B?
All EV1HMC554ALC3B units undergo pre-shipment inspection (PSI). If there is an issue with EV1HMC554ALC3B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The EV1HMC554ALC3B part is unused and in its original packaging.
Return procedure for EV1HMC554ALC3B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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