Analog Devices Inc. EV1HMC558ALC3B

Overview

EV1HMC558ALC3B from Analog Devices is an evaluation board for the HMC558ALC3B GaAs MMIC fundamental mixer, supporting RF/LO operation from 5.5 GHz to 14 GHz and IF bandwidth from DC to 6 GHz. It enables characterization of conversion loss (7.5 dB typ. at 5.5–10 GHz), LO-to-RF isolation (45 dB typ.), and IIP3 (21 dBm typ. at 10–14 GHz) in microwave radio and instrumentation applications.

For engineers reviewing the EV1HMC558ALC3B datasheet, EV1HMC558ALC3B pinout, EV1HMC558ALC3B application, or EV1HMC558ALC3B equivalent, this page delivers verified board-level specifications, thermal and RF layout guidance, connector interface details (2.92 mm and SMA), and sourcing support for rapid prototyping of high-frequency up/downconversion circuits.

Technical Context

The EV1HMC558ALC3B is a dedicated evaluation platform for the HMC558ALC3B mixer IC, implementing a 50 Ω RF/microwave signal path with matched 2.92 mm (J1, J2) and SMA (J3) connectors. Its PCB layout follows strict RF design rules: controlled-impedance traces, direct ground-plane connection via multiple vias to the exposed pad, and minimal parasitic discontinuities.

It supports both downconversion and upconversion modes across the full 5.5–14 GHz RF/LO range, with validated performance at LO drive levels from 9 dBm to 20 dBm and IF frequencies up to 6 GHz. The board includes no active components-only passive interconnects and mounting features optimized for the E-12-4 ceramic LCC package.

Key Specifications

Availability

EV1HMC558ALC3B is available at Aetrix Electronics and suitable for microwave radio development, automated test equipment (ATE) calibration, military communications prototyping, and RF front-end validation requiring stable component supply and traceable evaluation hardware.

Supply support for EV1HMC558ALC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving aerospace, defense, communications, and instrumentation markets with precision signal processing solutions.

The EV1HMC558ALC3B belongs to Analog Devices' RF & Microwave Evaluation Platform product line, designed specifically to accelerate development of millimeter-wave transceivers and test systems using their GaAs and SiGe mixer portfolio.

FAQ

What is the primary function of the EV1HMC558ALC3B?

The EV1HMC558ALC3B is an evaluation board-not an IC-that provides a fully characterized, RF-optimized platform for testing the HMC558ALC3B GaAs MMIC mixer. It enables engineers to validate conversion loss, isolation, IIP3, and noise figure across 5.5–14 GHz without custom PCB design. The EV1HMC558ALC3B includes calibrated 2.92 mm and SMA connectors, proper grounding architecture, and documented layout practices aligned with the HMC558ALC3B's E-12-4 package requirements.

Does the EV1HMC558ALC3B include the HMC558ALC3B IC?

Yes, the EV1HMC558ALC3B evaluation board includes one mounted HMC558ALC3B IC (12-lead ceramic LCC, E-12-4 package) as the device under test (DUT). Per Table 5 of the HMC558A Rev. C datasheet, U1 on the EV1HMC558ALC3B board is populated with the HMC558ALC3B, enabling immediate RF characterization without component sourcing or soldering.

What connectors are used on the EV1HMC558ALC3B board?

The EV1HMC558ALC3B uses three RF connectors: two 2.92 mm (SRI) connectors (J1 and J2) for RF and LO ports, and one SMA connector (J3) for the IF port. This configuration supports high-fidelity measurements up to 14 GHz while maintaining mechanical robustness and repeatability-critical for evaluating the HMC558ALC3B's 45 dB LO-to-RF isolation and 7.5 dB conversion loss performance.

Can the EV1HMC558ALC3B be used for both upconversion and downconversion?

Yes, the EV1HMC558ALC3B supports both upconversion and downconversion modes of the HMC558ALC3B mixer. Its symmetric, 50 Ω-matched layout allows flexible signal routing: RF and LO ports (J1/J2) are interchangeable per application, and the IF port (J3) handles DC–6 GHz bidirectionally. Performance data in the HMC558A datasheet (Figures 7–26) confirms validated operation in both configurations across temperature and LO power ranges.

Is thermal management addressed on the EV1HMC558ALC3B board?

Yes, thermal management is integral to the EV1HMC558ALC3B design. The board implements the recommended grounding scheme from the HMC558A datasheet: the exposed pad of the HMC558ALC3B is soldered directly to a solid copper ground plane, with ≥9 thermal vias connecting top and bottom layers. This achieves the specified θ_JC of 180°C/W and maintains junction temperature within −40°C to +85°C operating limits during continuous 15 dBm LO drive.