Analog Devices Inc. EV1HMC560ALM3

Overview

EV1HMC560ALM3 from Analog Devices is an evaluation PCB assembly designed to characterize the HMC560ALM3 GaAs MMIC double-balanced mixer, operating from 22 GHz to 38 GHz as either upconverter or downconverter, with dc–18 GHz IF bandwidth, no DC bias required, and validated RF/LO/IF port matching to 50 Ω for test and development of point-to-point radios and military microwave systems.

For engineers reviewing the EV1HMC560ALM3 datasheet, EV1HMC560ALM3 evaluation board layout, EV1HMC560ALM3 application circuit, or EV1HMC560ALM3 pinout compatibility, this PCB provides grounded coplanar waveguide (GCPW) transitions, 400 µm probe pitch support, direct-exposed-pad grounding, and full RF signal integrity validation for the HMC560ALM3 die in production-grade test environments.

Technical Context

The EV1HMC560ALM3 is a dedicated evaluation platform-not a semiconductor device-built around the HMC560ALM3 bare die in CE-6-3 LGA_CAV package (5.08 mm × 5.08 mm, 1.01 mm height), featuring GSG-probe-compatible RF/LO/IF ports, 50 Ω controlled-impedance CPWG routing, and thermally optimized exposed-pad grounding per Analog Devices' recommended layout practices.

It implements no active circuitry or external components: the HMC560ALM3 die operates passively, requiring only ≥9 dBm LO drive, and the PCB enables measurement of conversion loss (10–11 dB typ.), LO–RF isolation (34–38 dB typ.), IP3 (19.5–20 dBm typ.), and IF bandwidth (dc–18 GHz) across temperature (−40°C to +85°C) and frequency bands.

Key Specifications

Availability

EV1HMC560ALM3 is available at Aetrix Electronics and suitable for microwave test equipment development, military radar front-end prototyping, point-to-point radio system validation, and high-frequency component characterization requiring stable component supply and traceable evaluation hardware.

Supply support for EV1HMC560ALM3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, automotive, and defense markets with precision signal processing solutions.

The EV1HMC560ALM3 belongs to Analog Devices' RF & Microwave Evaluation Platform product line, engineered specifically to accelerate design-in and performance verification of GaAs MMIC mixers in millimeter-wave infrastructure and defense applications.

FAQ

What is the primary function of the EV1HMC560ALM3 evaluation board?

The EV1HMC560ALM3 evaluation board is a dedicated test platform for the HMC560ALM3 GaAs double-balanced mixer die. It provides fully characterized 50 Ω CPWG routing, GSG probe access, and thermal grounding to enable accurate measurement of conversion loss, isolation, IP3, and IF bandwidth across 22–38 GHz. The EV1HMC560ALM3 itself contains no active circuitry-it is strictly a passive interconnect and mechanical interface for the HMC560ALM3 die.

Does the EV1HMC560ALM3 require external power or biasing?

No. The EV1HMC560ALM3 evaluation board requires no external power or DC bias because the underlying HMC560ALM3 is a passive double-balanced mixer. Only RF, LO, and IF signal sources are needed during testing. The board's design ensures proper RF grounding and thermal dissipation via its soldered exposed pad, but no voltage rails or control logic are present on the EV1HMC560ALM3 PCB.

Can the EV1HMC560ALM3 be used for both upconversion and downconversion testing?

Yes. The EV1HMC560ALM3 supports full bidirectional operation of the HMC560ALM3 die: it validates downconversion (22–38 GHz RF → dc–18 GHz IF) and upconversion (dc–18 GHz IF → 22–38 GHz RF) with identical port routing and impedance control. Performance data-including conversion loss (9–11 dB), IP3 (13.5–16.5 dBm), and isolation (LO–RF >34 dB)-is measurable in both modes using the same EV1HMC560ALM3 board layout and probe setup.

What probe pitch and interface does the EV1HMC560ALM3 support?

The EV1HMC560ALM3 features grounded coplanar waveguide (GCPW) transitions optimized for ground-signal-ground (GSG) probing at 400 µm (16 mil) pitch. This matches standard RF wafer probe stations and allows direct, low-parasitic connection to the HMC560ALM3's RF, LO, and IF ports without soldering or fixtures-enabling rapid parametric characterization across temperature and frequency without degrading signal integrity.

Is the EV1HMC560ALM3 RoHS compliant and available for production use?

Yes. The EV1HMC560ALM3 evaluation board is supplied as a RoHS-compliant assembly by Analog Devices and is intended for engineering validation, not end-product integration. While not a production component, it is qualified for repeated lab use, supports JEDEC MSL3 reflow (260°C peak), and serves as the reference design for integrating the HMC560ALM3 into customer PCBs-ensuring design fidelity from evaluation to volume manufacturing.