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Analog Devices Inc. EV1HMC774ALC3B

Part No.:
EV1HMC774ALC3B
Manufacturer:
Analog Devices Inc.
Category:
RF, RFID, Wireless Evaluation Boards
Package:
Datasheet:
AetrixEV1HMC774ALC3B.pdf
Description:
EVAL BOARD
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,666

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Product details

Overview

HMC774ALC3B from Analog Devices is a passive, double-balanced MMIC mixer operating from 7 GHz to 34 GHz, usable as both upconverter and downconverter with no DC bias required. It delivers 15 dB typical conversion loss, 20 dBm input IP3 (downconverter), and 30 dB typical LO-to-RF isolation. Its 12-terminal ceramic LCC package enables surface-mount integration in high-frequency radio front-ends.

For engineers reviewing the HMC774ALC3B datasheet, HMC774ALC3B pinout, HMC774ALC3B application, or HMC774ALC3B equivalent, key selection criteria include RF/LO frequency coverage (7–34 GHz), IF bandwidth (DC–8 GHz), passive operation, thermal limits (−40°C to +85°C), and 12-pin LCC mechanical compatibility.

Technical Context

The HMC774ALC3B employs optimized balun structures to achieve high LO-to-RF (30 dB typ.) and LO-to-IF (23 dB typ.) isolation, enabling clean signal translation without external matching networks. Its passive diode-based architecture eliminates DC power requirements and simplifies biasing in wideband RF systems.

It supports both upper and lower sideband operation across multiple IF frequencies (500 MHz, 3 GHz, 8 GHz) and RF bands (7–20 GHz and 20–34 GHz), with consistent performance over temperature (−40°C to +85°C) and LO drive (11–17 dBm).

Key Specifications

Parameter Value and Actual Design Meaning
RF Frequency Range 7–34 GHz - covers E-band and Ka-band for point-to-point and military radios.
IF Bandwidth DC to 8 GHz - supports baseband through millimeter-wave IF processing without external filtering.
LO Drive Level +15 dBm typical - matches standard RF synthesizer output levels; operates reliably from +11 to +17 dBm.
Conversion Loss 10–15.5 dB - low insertion loss preserves system noise figure and dynamic range in receiver chains.
Input IP3 (Downconv.) 20 dBm typical - enables handling of strong interferers in dense spectral environments.
LO-to-RF Isolation 30 dB typical - minimizes LO leakage into antenna paths, easing filter design and EMC compliance.
Operating Temp. −40°C to +85°C - qualified for outdoor wireless infrastructure and harsh-environment military use.

Pinout & Package

Package: 12-terminal, RoHS-compliant, leadless ceramic LCC (2.90 mm × 2.90 mm), with exposed thermal pad requiring RF/dc ground connection per JEDEC E-12-4 standard.

Pin/Terminal Circuit Role Design Meaning
1, 3, 4, 6, 7, 9, 10, 12 GND RF and DC ground terminals - must be connected to PCB ground plane via multiple vias for optimal RF return and thermal dissipation.
2 LO Local oscillator port - 50 Ω dc-coupled input; accepts +11 to +17 dBm drive; max 55 mA dc current.
5 IF Intermediate frequency port - dc-coupled; supports DC–8 GHz; limited to ±3 mA dc current to prevent malfunction.
8 RF Radio frequency port - 50 Ω dc-coupled input/output; handles up to +21 dBm RF input when LO = +18 dBm.
11 NIC Not internally connected - may be tied to ground without affecting RF performance or thermal path.
EPAD Exposed Pad Thermal and electrical ground - must be soldered to solid PCB ground plane with ≥90% coverage and ≥3×3 thermal vias.

Key Features

Feature Design Value
No DC bias required Eliminates external bias tees, regulators, and decoupling networks - reduces BOM count and layout complexity.
Wide IF bandwidth (DC–8 GHz) Enables direct sampling of baseband I/Q signals and high-IF architectures without IF amplification or filtering stages.
High LO-to-RF isolation (30 dB typ.) Reduces need for external LO suppression filters, lowering insertion loss and board space in transceiver modules.
Surface-mount LCC package Supports automated reflow assembly; eliminates wire bonding; compatible with standard RF PCB processes and test fixtures.
Robust thermal rating (θJC = 274°C/W) Allows continuous operation at full RF/LO power within −40°C to +85°C ambient when properly mounted on thermally optimized PCB.

Applications

Point-to-Point Radios Test & Measurement Equipment

Use Scenario: High-capacity backhaul links operating in 24–32 GHz licensed bands with adaptive modulation.

IC Role / Device Role / Timing Role: Downconverter translating received 28 GHz RF to 2–4 GHz IF for digitization and demodulation.

Use Value: 20 dBm IP3 and 30 dB LO–RF isolation maintain adjacent-channel rejection and EVM under multi-tone interference.

Use Scenario: Vector network analyzer (VNA) receiver front-end requiring broadband, calibrated mixing.

IC Role / Device Role / Timing Role: Passive double-balanced mixer in VNA's internal LO/RF/IF signal path for phase-coherent measurement.

Use Value: DC–8 GHz IF bandwidth enables single-sweep characterization from baseband to 8 GHz without hardware switching.

Military Radar Sensors V-SAT Terminals

Use Scenario: Compact active electronically scanned array (AESA) radar transceivers needing low-SWA, high-isolation mixing.

IC Role / Device Role / Timing Role: Upconverter modulating 2–4 GHz IF waveforms onto 30 GHz carrier for transmit beamforming.

Use Value: 15 dB conversion loss and 17 dBm IP3 ensure sufficient output power and spurious-free dynamic range in pulsed radar modes.

Use Scenario: Ku/Ka-band satellite terminal with dual-polarized feed and integrated modem.

IC Role / Device Role / Timing Role: Downconverter in LNB module translating 29.5–30.0 GHz downlink to 0.5–1.0 GHz IF for demodulation.

Use Value: 7–34 GHz RF coverage and 500 MHz IF operation support both legacy and next-gen VSAT standards with minimal external components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar double-balanced mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC1048LC3B Wider RF range (6–40 GHz), higher LO drive (+17 dBm min), but 13 dB higher conversion loss (28 dB typ.) Better suited for ultra-wideband test equipment where frequency coverage outweighs loss sensitivity Select HMC1048LC3B only if >34 GHz operation is required and system can tolerate ~13 dB extra loss.
QPC1006 Active GaN-based mixer; requires +5 V bias; offers 22 dBm P1dB but narrower IF BW (DC–3 GHz) Preferred in high-power transmit chains where gain and compression headroom are critical Choose QPC1006 when active gain and >20 dBm output power are needed; avoid if passive operation or DC–8 GHz IF is mandatory.

Compared with HMC774ALC3B, HMC1048LC3B extends frequency reach at the cost of conversion efficiency, while QPC1006 adds bias complexity and sacrifices IF bandwidth for higher output linearity-making HMC774ALC3B optimal for balanced, bias-free, wide-IF mmWave receivers.

Availability

HMC774ALC3B is available at Aetrix Electronics and suitable for point-to-point radios, military radar sensors, and test equipment requiring stable component supply, full traceability, and guaranteed long-term availability.

Supply support for HMC774ALC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, defense, instrumentation, and industrial markets since 1965.

The HMC774ALC3B belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for millimeter-wave infrastructure and defense systems demanding wide bandwidth, high isolation, and surface-mount reliability.

FAQ

What is the recommended LO drive level for optimal performance of the HMC774ALC3B?

The HMC774ALC3B achieves best conversion loss and IP3 performance at +15 dBm LO drive, with functional operation supported from +11 dBm to +17 dBm. Deviating below +11 dBm increases conversion loss; exceeding +17 dBm risks permanent damage per Absolute Maximum Ratings.

Can the HMC774ALC3B operate with DC-coupled IF signals?

Yes, the HMC774ALC3B IF port is DC-coupled and supports operation from DC to 8 GHz. However, the IF pin must not source or sink more than ±3 mA of DC current to prevent die malfunction or failure - external current limiting may be required in DC-coupled designs.

Is the HMC774ALC3B suitable for both upconversion and downconversion?

Yes, the HMC774ALC3B is a bidirectional double-balanced mixer fully characterized for both upconversion and downconversion modes across its 7–34 GHz RF range, with published data for USB and LSB operation at IF frequencies of 500 MHz, 3 GHz, and 8 GHz.

What is the thermal management requirement for the HMC774ALC3B exposed pad?

The exposed pad (EPAD) of the HMC774ALC3B must be soldered to a solid RF/dc ground plane with ≥90% solder coverage and ≥9 thermal vias (3×3 array) to achieve specified θJC = 274°C/W and ensure reliable operation at full RF/LO power within −40°C to +85°C ambient.

Does the HMC774ALC3B require external matching components?

No, the HMC774ALC3B is fully matched to 50 Ω on all ports (RF, LO, IF) and requires no external matching networks, baluns, or bias tees - enabling direct integration into RF layouts with minimal supporting circuitry.

EV1HMC774ALC3B Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Packaging:
Box
Product Status:
Active
Type:
Mixer
Frequency:
7GHz ~ 34GHz
Contents:
Board(s)
Utilized IC / Part:
HMC774ALC3B

EV1HMC774ALC3B FAQ

1.How can I place an order for EV1HMC774ALC3B through Aetrix?

Please submit a Request for Quotation (RFQ) for EV1HMC774ALC3B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for EV1HMC774ALC3B reliable?

The price and inventory of EV1HMC774ALC3B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for EV1HMC774ALC3B is usually 5 days.

3.What payment methods are accepted for EV1HMC774ALC3B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for EV1HMC774ALC3B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for EV1HMC774ALC3B?

EV1HMC774ALC3B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your EV1HMC774ALC3B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for EV1HMC774ALC3B?

For technical support, including EV1HMC774ALC3B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your EV1HMC774ALC3B requirements.

6.How does Aetrix verify that EV1HMC774ALC3B is sourced from the original manufacturer or authorized distributors?

All EV1HMC774ALC3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that EV1HMC774ALC3B meets industry standards.

7.What is the process for return or replacement of EV1HMC774ALC3B?

All EV1HMC774ALC3B units undergo pre-shipment inspection (PSI). If there is an issue with EV1HMC774ALC3B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The EV1HMC774ALC3B part is unused and in its original packaging.

Return procedure for EV1HMC774ALC3B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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