Analog Devices Inc. EV1HMC787ALC3B

Overview

EV1HMC787ALC3B from Analog Devices is an evaluation PCB assembly designed to characterize the HMC787ALC3B GaAs MMIC double-balanced mixer, supporting RF/LO operation from 3 GHz to 10 GHz and IF bandwidth from DC to 4 GHz. It enables upconversion and downconversion with 9 dB typical conversion loss, 43 dB LO-to-IF isolation, and 24 dBm input IP3 - validated for microwave radio and test equipment applications.

For engineers reviewing the EV1HMC787ALC3B datasheet, EV1HMC787ALC3B pinout, EV1HMC787ALC3B application, or EV1HMC787ALC3B equivalent, this page provides verified board-level specifications, thermal layout guidance, connector interface details (2.92 mm and SMA), and integration notes for RF design validation of the HMC787ALC3B mixer IC.

Technical Context

The EV1HMC787ALC3B is a dedicated evaluation platform for the HMC787ALC3B mixer, featuring controlled-impedance 50 Ω RF/LO/IF signal paths, optimized grounding via multiple vias to internal ground planes, and direct connection of the device's exposed pad to RF/dc ground per datasheet Figure 50. Its layout implements the recommended GND interface schematic (Figure 3) and RF/LO/IF ac-coupling topologies specified in Figures 4–6.

It integrates two 2.92 mm SRI connectors (J1–J2) for RF and LO ports and one SMA connector (J3) for IF, all mounted on a PCB with precise dimensional alignment to the E-12-4 LCC package footprint. The board supports full characterization across temperature (−40°C to +85°C) and LO drive levels (13–21 dBm), matching the HMC787ALC3B's absolute maximum ratings and thermal resistance (θ_JA = 120°C/W).

Key Specifications

Availability

EV1HMC787ALC3B is available at Aetrix Electronics and suitable for microwave radio development, RF test instrumentation prototyping, and military communications system validation requiring stable component supply and traceable evaluation hardware.

Supply support for EV1HMC787ALC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF integrated circuits, headquartered in Norwood, MA, with expertise in precision signal processing and microwave solutions.

The EV1HMC787ALC3B belongs to Analog Devices' RF & Microwave Evaluation Platform product line, engineered specifically to accelerate time-to-test for GaAs MMIC mixers and validate real-world RF performance under controlled lab conditions.

FAQ

What is the primary function of the EV1HMC787ALC3B evaluation board?

The EV1HMC787ALC3B is a dedicated evaluation PCB for the HMC787ALC3B GaAs MMIC double-balanced mixer. It provides a calibrated RF/LO/IF interface using 2.92 mm and SMA connectors, enabling accurate measurement of conversion loss, isolation, IP3, and noise figure across 3–10 GHz. It is not a standalone IC but a test vehicle for the HMC787ALC3B device.

Does the EV1HMC787ALC3B include the HMC787ALC3B mixer IC?

Yes - the EV1HMC787ALC3B evaluation PCB assembly includes one HMC787ALC3B device (U1) mounted in its native E-12-4 ceramic LCC package. The board is shipped fully assembled with the IC soldered and tested, as confirmed in Table 6 of the HMC787A Rev. C datasheet.

Which RF connectors are used on the EV1HMC787ALC3B board?

The EV1HMC787ALC3B uses two 2.92 mm SRI connectors (J1 and J2) for RF and LO ports, and one SMA connector (J3) for the IF port. This configuration supports high-frequency operation up to 40 GHz on RF/LO paths and maintains impedance control critical for mixer characterization.

How is grounding implemented on the EV1HMC787ALC3B to ensure RF performance?

The EV1HMC787ALC3B implements grounding per Analog Devices' recommended layout: the HMC787ALC3B's exposed pad and all GND terminals (pins 1, 3, 4, 6, 7, 9) are connected directly to a solid top-layer ground plane, which is then tied to internal ground layers using ≥9 thermal vias (3×3 array). This satisfies the θ_JA = 120°C/W thermal requirement and minimizes RF return path inductance.

Can the EV1HMC787ALC3B be used for both upconversion and downconversion testing?

Yes - the EV1HMC787ALC3B supports both upconversion and downconversion modes of the HMC787ALC3B mixer. Its symmetric 50 Ω signal routing, low-parasitic connector interfaces, and validated thermal layout enable accurate measurement of conversion gain, IP3, and isolation across both configurations, as documented in Figures 30–41 of the HMC787A Rev. C datasheet.