Analog Devices Inc. EV1HMCAD5831LP9B

Overview

EV1HMCAD5831LP9B from Analog Devices (formerly Hittite Microwave) is a 3-bit, 26 GSPS ultra-wideband analog-to-digital converter with over/under range detection, data inhibit, XOR modulation, and integrated 1:2 demultiplexer. It features 20 GHz analog input bandwidth, CML-compatible differential outputs, and operates from -5 V and -3.3 V supplies in a 64-lead 9 × 9 mm LFCSP package. It is used in radio astronomy front-ends requiring sub-nanosecond latency and broadband digitization.

For engineers reviewing the EV1HMCAD5831LP9B datasheet, EV1HMCAD5831LP9B pinout, EV1HMCAD5831LP9B application, or EV1HMCAD5831LP9B equivalent, key selection considerations include full-flash architecture latency (1.5 clock cycles), user-programmable reference ladder for DC-coupled input swing adjustment, and CML output swing control via external VREF resistors - critical for SERDES interface alignment in phased array receivers.

Technical Context

The EV1HMCAD5831LP9B implements a full-flash ADC architecture with no pipeline or successive-approximation stages, delivering deterministic 1.5-cycle latency plus fixed subcycle delay. Its internal emitter-follower RF input stage centers nominally at -936 mV relative to AGND, enabling DC-coupled operation when RTF/RBF are externally set.

It integrates a 1:2 demux that splits 26 GSPS data into two 13 GSPS parallel CML buses (X and Y), each with binary-weighted 3-bit outputs plus overrange bit; OCLK provides half-rate clock synchronized to the demux output edges. The XOR function retimes external modulation onto all data bits prior to demux, supporting AC-coupled FPGA SERDES interfacing.

Key Specifications

Pinout & Package

EV1HMCAD5831LP9B is housed in a RoHS-compliant 64-lead Lead Frame Chip Scale Package (LFCSP), 9 × 9 mm body, 0.90 mm height, with exposed thermal pad on bottom. Pin 1 indicator located at top-left corner; thermal pad must be soldered to PCB ground plane using multiple vias for thermal conduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-high-speed ADC applications.

Compared with HMCAD5831LP9BE, the EV1HMCAD5831LP9B variant adds calibrated clock distribution and FPGA-ready interfaces but shares identical core ADC performance; versus AD9689-2600, it trades resolution and digital features for 10× higher sample rate and deterministic latency - making it irreplaceable in real-time wideband signal capture.

Availability

EV1HMCAD5831LP9B is available at Aetrix Electronics and suitable for ultra-wideband phased arrays, radio astronomy receivers, and high-speed serial link diagnostics requiring stable component supply and traceable evaluation hardware.

Supply support for EV1HMCAD5831LP9B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing technologies, serving aerospace, defense, communications, and instrumentation markets.

The EV1HMCAD5831LP9B belongs to Analog Devices' ultra-high-speed data converter product line, designed specifically for direct RF sampling in defense EW systems, next-generation radar, and scientific instrumentation demanding >20 GHz bandwidth and sub-ns timing fidelity.

FAQ

What is the primary function of the EV1HMCAD5831LP9B in a signal chain?

The EV1HMCAD5831LP9B serves as an ultra-high-speed analog-to-digital converter that digitizes RF signals up to 20 GHz bandwidth at 26 GSPS. Its full-flash architecture delivers deterministic 1.5-cycle latency, making EV1HMCAD5831LP9B ideal for real-time beamforming and wideband spectrum analysis where timing predictability is critical.

Does the EV1HMCAD5831LP9B support DC-coupled analog inputs?

Yes, the EV1HMCAD5831LP9B supports DC-coupled inputs via its user-programmable reference ladder. Pins RTF and RBF allow external setting of top and bottom reference voltages, enabling precise control of input common-mode and full-scale swing - a capability confirmed in the Application Information section for EV1HMCAD5831LP9B.

How does the 1:2 demultiplexer in the EV1HMCAD5831LP9B affect data handling?

The EV1HMCAD5831LP9B's integrated 1:2 demux splits the 26 GSPS output stream into two parallel 13 GSPS CML buses (X and Y), each carrying 3-bit data plus overrange. This reduces per-lane data rates for FPGA capture while preserving inter-channel timing correlation - a key design feature of EV1HMCAD5831LP9B for coherent multi-channel systems.

What thermal management is required for reliable operation of the EV1HMCAD5831LP9B?

EV1HMCAD5831LP9B dissipates 4.2 W and requires mandatory thermal pad soldering to a PCB ground plane with multiple vias, plus attachment of a ≥25 cm² heatsink to the underside metal pad. Without this, junction temperature exceeds 125 °C even at ambient 25 °C - a requirement explicitly stated in the Thermal Information table for EV1HMCAD5831LP9B.

Can the EV1HMCAD5831LP9B be used with standard FPGA transceivers?

Yes, EV1HMCAD5831LP9B outputs differential CML signals compatible with FPGA high-speed transceivers. Its XOR modulation function enables AC coupling to SERDES lanes, and the OCLK half-rate clock provides timing reference for capture - all verified in the Evaluation Board Description and Timing Diagram sections of the EV1HMCAD5831LP9B documentation.