Analog Devices Inc. EV2HMC1122LP4M

Overview

EV2HMC1122LP4M from Analog Devices is an evaluation board for the HMC1122 6-bit silicon digital attenuator, supporting RF operation from 0.1 GHz to 6.0 GHz with 0.5 dB LSB resolution and 31.5 dB total attenuation range. It enables rapid characterization of serial/parallel control, settling time (250 ns to 0.05 dB), and high-linearity performance (IP3 = 55 dBm, P0.1dB = 30 dBm) in microwave radios, cellular infrastructure, and test equipment.

For engineers reviewing the EV2HMC1122LP4M datasheet, EV2HMC1122LP4M pinout, EV2HMC1122LP4M application, or EV2HMC1122LP4M equivalent, this board provides validated RF layout (coplanar waveguide, 50 Ω), integrated SMA interfaces (J1/J2), decoupling network (C1–C4), manual DIP switch control (SW1/SW2), and thermal vias under the LFCSP exposed pad - all optimized for repeatable RF measurement and system integration validation.

Technical Context

The EV2HMC1122LP4M implements a 4-layer PCB with RO4350 top dielectric (10 mil) and FR-4 core, featuring coplanar waveguide traces (18 mil width, 13 mil spacing) for 50 Ω impedance control at RF ports ATTIN and ATTOUT. It supports both serial (SERIN/CLK/LE) and parallel (D0–D5) control modes of the HMC1122 IC, with dedicated header J3 for digital signal routing and RC filter provisions.

Thermal management includes dense via arrays under the HMC1122's 4 mm × 4 mm LFCSP exposed pad and grounded inner/outer planes. The board integrates a thru-calibration line (J4–J5) for de-embedding PCB loss and ships with populated decoupling capacitors (100 pF, 1 nF, 10 μF) and zero-ohm series resistors on supply/digital lines.

Key Specifications

Availability

EV2HMC1122LP4M is available at Aetrix Electronics and suitable for microwave radio development, cellular infrastructure prototyping, and RF test equipment validation requiring stable component supply and production-ready evaluation reference designs.

Supply support for EV2HMC1122LP4M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving precision instrumentation, communications, and industrial markets since 1965.

The EV2HMC1122LP4M belongs to Analog Devices' RF & Microwave Evaluation Platform family, designed specifically to accelerate design-in of high-frequency attenuators, switches, and gain blocks by providing fully characterized, layout-optimized reference hardware.

FAQ

What is the primary function of the EV2HMC1122LP4M evaluation board?

The EV2HMC1122LP4M evaluation board is a fully populated, 4-layer RF reference platform for the HMC1122 6-bit digital attenuator. It enables engineers to validate RF performance (0.1–6.0 GHz), control interface timing (serial/parallel), linearity (IP3 = 55 dBm), and thermal behavior in real-world layouts - without designing custom PCBs. The board includes SMA ports, decoupling, calibration traces, and manual DIP switches to streamline lab testing of the EV2HMC1122LP4M's target IC.

Does the EV2HMC1122LP4M support both serial and parallel control modes of the HMC1122?

Yes, the EV2HMC1122LP4M supports both serial and parallel control modes of the HMC1122. Digital signals (SERIN, CLK, LE, P/S, D0–D5, PUP1/PUP2) are routed to the 2×9-pin header J3, allowing connection to external controllers. Additionally, dual SPDT DIP switches (SW1/SW2) provide manual parallel-mode configuration for quick bench testing - all while maintaining signal integrity through controlled-impedance traces and ground plane isolation.

What RF interface connectors are used on the EV2HMC1122LP4M?

The EV2HMC1122LP4M uses SMA connectors for RF interfacing: J1 connects to the HMC1122's ATTIN pin, and J2 connects to ATTOUT. Both paths use 50 Ω coplanar waveguide routing (18 mil width, 13 mil spacing) on the RO4350 top layer. A separate thru-calibration line (J4–J5) is included to measure and de-embed PCB insertion loss during S-parameter characterization of the EV2HMC1122LP4M.

How is power delivered and decoupled on the EV2HMC1122LP4M?

Power is delivered to the EV2HMC1122LP4M via DC test point TP2, accepting 3.3 V to 5.0 V as required by the HMC1122 IC. Three decoupling capacitors are populated: C1/C2 (100 pF), C7 (1 nF), and C4 (10 μF), placed close to the HMC1122's VDD pin to suppress high-frequency noise and ensure stable operation across the full 0.1–6.0 GHz band. Grounding is reinforced via the exposed pad vias and solid inner-layer ground planes.

Is thermal management addressed on the EV2HMC1122LP4M evaluation board?

Yes, thermal management is integral to the EV2HMC1122LP4M design. The board features dense arrays of thermal vias under the HMC1122's exposed pad and throughout the RF signal path, connecting directly to internal and bottom ground planes. This structure ensures efficient heat dissipation during high-power RF operation (up to 24 dBm input), maintaining junction temperature within the HMC1122's −40°C to +85°C operating range and preserving attenuation accuracy and linearity on the EV2HMC1122LP4M.