Analog Devices Inc. EVAL01-HMC547LC3

Overview

EVAL01-HMC547LC3 from Hittite Microwave Corporation is an evaluation PCB designed to characterize the HMC547LC3 GaAs MMIC SPDT non-reflective switch, supporting DC–28 GHz operation with 1.6 dB insertion loss at 10 GHz, 45 dB isolation at 10 GHz, and 6 ns switching speed in military EW/ECM and test instrumentation systems.

For engineers reviewing the EVAL01-HMC547LC3 datasheet, EVAL01-HMC547LC3 pinout, EVAL01-HMC547LC3 application, or EVAL01-HMC547LC3 equivalent, this board enables rapid RF performance validation of the HMC547LC3 switch under real-world 50 Ω impedance conditions using SMA connectors, controlled ground layout, and verified Rogers 4350 substrate.

Technical Context

The EVAL01-HMC547LC3 is a dedicated evaluation platform-not an IC or discrete component-featuring three SRI-SMA RF connectors (J1–J3), two DC control pins (J4–J6), dual 100 Ω pull-up resistors (R1–R2), and a pre-mounted HMC547LC3 in its 16-lead 3×3 mm ceramic package. It implements strict RF grounding: all package ground leads (pins 2,4,6,8,13,15) and the exposed paddle must connect directly to the PCB ground plane.

Designed for broadband validation, the board uses Rogers 4350 dielectric (ε_r ≈ 3.48, tan δ ≈ 0.0037) to maintain 50 Ω microstrip routing from SMA launchers to the HMC547LC3 RFC/RF1/RF2 ports, with no internal matching networks-preserving the device's native non-reflective behavior across DC–28 GHz.

Key Specifications

Availability

EVAL01-HMC547LC3 is available at Aetrix Electronics and suitable for RF design validation, microwave test equipment development, and defense-grade EW/ECM subsystem prototyping requiring stable component supply and traceable evaluation hardware.

Supply support for EVAL01-HMC547LC3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Hittite Microwave Corporation was a U.S.-based RF/microwave semiconductor company specializing in high-performance GaAs and GaN MMICs, acquired by Analog Devices in 2014. Known for broadband switches, LNAs, and synthesizers up to W-band.

The EVAL01-HMC547LC3 belongs to Hittite's evaluation board product line, purpose-built to accelerate RF front-end design for their high-isolation, fast-switching GaAs SPDT switches used in defense, aerospace, and instrumentation applications.

FAQ

What is the primary function of the EVAL01-HMC547LC3?

The EVAL01-HMC547LC3 is an evaluation PCB intended solely for RF performance characterization of the HMC547LC3 GaAs MMIC SPDT switch. It provides calibrated 50 Ω signal paths, proper grounding, and DC control access-enabling measurement of insertion loss, isolation, return loss, and switching speed across DC–28 GHz without custom layout effort. The EVAL01-HMC547LC3 does not contain active circuitry beyond passive interconnects.

Does the EVAL01-HMC547LC3 include the HMC547LC3 device?

Yes, the EVAL01-HMC547LC3 includes one factory-mounted HMC547LC3 GaAs MMIC SPDT switch in its 16-lead 3×3 mm ceramic package. The board ships fully assembled with SMA connectors, DC control pins, and 100 Ω bias resistors-ready for immediate RF testing upon power and signal application. No additional assembly is required to use the EVAL01-HMC547LC3.

What RF connector type is used on the EVAL01-HMC547LC3?

The EVAL01-HMC547LC3 uses three SRI-SMA connectors (J1–J3) for RFC, RF1, and RF2 ports. SRI-SMA offers superior high-frequency performance versus standard SMA, maintaining reliable 50 Ω impedance and <1.2:1 VSWR up to 26.5 GHz-critical for accurate wideband evaluation of the HMC547LC3's DC–28 GHz response. The EVAL01-HMC547LC3 does not support alternative connector types.

What substrate material is used in the EVAL01-HMC547LC3 PCB?

The EVAL01-HMC547LC3 uses Rogers RO4350B laminate-a hydrocarbon-ceramic composite with ε_r = 3.48 ± 0.05 and dissipation factor of 0.0037 at 10 GHz. This material ensures stable microstrip impedance, minimal dispersion, and repeatable RF measurements across the full HMC547LC3 bandwidth. The EVAL01-HMC547LC3's performance relies on this specific substrate; FR-4 substitution invalidates published specs.

How is grounding implemented on the EVAL01-HMC547LC3?

Grounding on the EVAL01-HMC547LC3 follows RF best practices: all six ground pins (2,4,6,8,13,15) of the HMC547LC3 package plus its exposed metal paddle are soldered directly to the solid bottom-layer ground plane using multiple thermal vias. The EVAL01-HMC547LC3 also features dense via stitching around RF traces and SMA ground barrels to minimize inductance-ensuring the HMC547LC3 achieves its specified >40 dB isolation and <17 dB return loss.