Skyworks Solutions Inc. EVB7232
- Part No.:
- EVB7232
- Manufacturer:
- Skyworks Solutions Inc.
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
EVB7232.pdf
- Description:
- EVALUATION BOARD FOR AWB7232
- Quantity:
- Payment:

- Shipping:

Inventory:3,045
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Product details
Overview
AWB7232 from Skyworks is a fully matched, 14-pin surface-mount multi-chip power amplifier module for 2.3–2.4 GHz LTE/WCDMA/HSDPA small-cell infrastructure. It delivers +27 dBm E-TM1.1 output power with –47 dBc ACPR at ±10 MHz, 29 dB gain, and operates from a +4.5 V supply in picocell and CPE applications.
For engineers reviewing the AWB7232 datasheet, AWB7232 pinout, AWB7232 application, or AWB7232 equivalent, key selection criteria include RF linearity under modulated LTE conditions, thermal resistance (11.2 °C/W), shutdown control via VREF, 50 Ω system matching, and compatibility with FDD/TDD air interfaces in compact 7 mm × 7 mm modules.
Technical Context
The AWB7232 integrates InGaP HBT MMICs with on-package RF matching networks optimized for simultaneous high efficiency, linearity, and thermal stability in 50 Ω systems. Its dual-VCC architecture (VCC1 and VCC2) enables independent biasing and thermal management, while VREF-controlled shutdown provides fast RF switching (12 µs rise, 4 µs fall).
Designed specifically for 2300–2400 MHz operation, the module supports multi-carrier signals and tolerates 8:1 VSWR load mismatch without degradation. All RF ports are internally matched - no external tuning required - and quiescent current (250–300 mA) and reference current (10–19 mA) are specified under defined DC conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 2300–2400 MHz - supports full LTE Band 40 and WCDMA UMTS Band IV operation |
| Output Power | +27 dBm E-TM1.1 - meets ACLR requirements for 10 MHz LTE uplink transmission |
| ACPR @ ±10 MHz | –47 dBc typical - ensures compliance with 3GPP spectral mask for base station-class linearity |
| Power-Added Efficiency | 15% typical - balances RF output and thermal dissipation in thermally constrained small-cell enclosures |
| Gain | 29 dB typical - enables single-stage amplification from low-level driver to antenna interface |
| Thermal Resistance RJC | 11.2 °C/W - defines junction-to-case temperature rise per watt, critical for heatsink design |
| Supply Voltage | +4.5 V nominal - compatible with standard telecom DC-DC rails; absolute max +4.65 V |
Pinout & Package
14-pin, RoHS-compliant surface-mount module in 7 mm × 7 mm × 1.3 mm package with exposed ground paddle. Package includes integrated input/output matching networks and internal bias circuitry.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VREF (Pin 1) | Shutdown Control Reference | Logic-level input: 0 V = PA off, +2.85 V = PA on; controls fast RF enable/disable timing |
| RFIN (Pin 5) | RF Input | 50 Ω matched input port; accepts up to +10 dBm CW drive; requires minimal external filtering |
| RFOUT (Pin 12) | RF Output | 50 Ω matched output delivering +27 dBm; withstands 8:1 VSWR without damage |
| VCC1 (Pin 4), VCC2 (Pin 11) | Power Supply Inputs | Dual supply pins distribute current (total 740–925 mA); VCC2 used for junction temperature calculation |
| GND (Pins 2,3,8,9,10,13,14) | Ground Terminals | Seven dedicated ground connections including thermal paddle contact for low-inductance return path |
Key Features
| Feature | Design Value |
|---|---|
| InGaP HBT MMIC Technology | Enables stable gain and efficiency across –40 °C to +85 °C case temperature range |
| Integrated Matching Networks | Eliminates external impedance tuning components; reduces PCB area and layout sensitivity |
| Multi-Carrier Capability | Supports concurrent LTE carriers within 2.3–2.4 GHz band without intermodulation degradation |
| Fast RF Switching | 12 µs rise / 4 µs fall time enables TDD frame synchronization and burst-mode operation |
| Load Mismatch Robustness | Operates reliably under 8:1 VSWR - simplifies antenna integration and field deployment |
Applications
| Picocell Base Stations | Femtocell Residential Gateways |
|---|---|
Use Scenario: Indoor cellular coverage extension in enterprise buildings with backhaul over Ethernet or fiber. IC Role / Device Role / Timing Role: Final-stage RF power amplifier driving antenna interface in 2.3–2.4 GHz licensed spectrum. Use Value: Delivers +27 dBm with –47 dBc ACPR to meet 3GPP BS Class 3 linearity requirements in space-constrained enclosures. |
Use Scenario: Plug-in home node supporting 2–4 LTE users with self-optimizing configuration. IC Role / Device Role / Timing Role: High-efficiency PA enabling low-power, fanless operation while maintaining EVM and ACLR compliance. Use Value: 15% PAE and 11.2 °C/W thermal resistance allow continuous operation at ambient up to +65 °C without derating. |
| Customer Premises Equipment (CPE) | Wireless Data Terminals |
Use Scenario: Outdoor-mounted LTE CPE for fixed wireless access in rural broadband deployments. IC Role / Device Role / Timing Role: Transmit chain PA operating in uncooled outdoor enclosure with wide temperature swing. Use Value: InGaP HBT process ensures stable gain and output power from –40 °C to +85 °C case temperature. |
Use Scenario: Portable LTE data cards and mobile hotspots requiring rapid network attachment and low latency. IC Role / Device Role / Timing Role: Fast-switching PA enabling TDD slot alignment and low-latency uplink bursts. Use Value: 12 µs rise/4 µs fall time supports subframe-level power gating per 3GPP Release 8+ TDD configurations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar small-cell power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QPA9121 | 2.3–2.4 GHz, +28 dBm POUT, –46 dBc ACPR, 30 dB gain, 16-pin 7×7 mm package | Higher gain and output but requires external bias sequencing; no integrated VREF shutdown | Preferred when higher system gain margin is needed and board space allows additional control logic |
| Skyworks SKY77629 | 2.3–2.4 GHz, +26 dBm POUT, –45 dBc ACPR, 28 dB gain, 12-pin 6×6 mm package | Smaller footprint and lower cost, but reduced ACPR performance and no multi-carrier validation | Selected for cost-sensitive femtocell designs where –45 dBc ACPR meets local regulatory limits |
Compared with QPA9121 and SKY77629, the AWB7232 uniquely combines integrated VREF shutdown, 7 mm × 7 mm form factor, and –47 dBc ACPR in a production-qualified small-cell PA - making it optimal for space-constrained, thermally demanding picocell and CPE platforms requiring guaranteed linearity.
Availability
AWB7232 is available at Aetrix Electronics and suitable for picocell base stations, femtocell gateways, and customer premises equipment requiring stable component supply, consistent RF performance across temperature, and long-term lifecycle support.
Supply support for AWB7232 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Skyworks Solutions is a global semiconductor company specializing in analog and mixed-signal connectivity solutions for wireless infrastructure, mobile, automotive, and IoT markets.
The AWB7232 belongs to Skyworks' small-cell power amplifier module product line, engineered for high-linearity, thermally robust RF transmission in compact, carrier-grade picocell and CPE systems.
FAQ
What is the recommended VREF voltage level to enable the AWB7232?
The AWB7232 enters active mode when VREF (Pin 1) is set to +2.85 V, with tolerance of ±0.05 V. Applying 0 V places the device in shutdown mode. The VREF line must be kept low-noise, and total capacitance should not exceed 0.01 µF to meet the 12 µs rise time specification. This precise control enables deterministic TDD frame timing in LTE small-cell deployments using the AWB7232.
Does the AWB7232 require external matching components at RF input or output?
No - the AWB7232 is fully matched for 50 Ω systems at both RFIN (Pin 5) and RFOUT (Pin 12). Internal matching networks eliminate the need for external baluns, stubs, or LC networks. This simplifies PCB layout, reduces bill-of-materials count, and improves repeatability across manufacturing lots. The AWB7232 datasheet confirms this in the "Package Outline" and "Application Circuit Schematic" sections.
What is the maximum allowable VSWR the AWB7232 can tolerate at RFOUT without damage?
The AWB7232 is rated for 8:1 VSWR at RFOUT under full operating conditions (VCC = +4.5 V, POUT = +27 dBm, TC = –40 °C to +85 °C), with no permanent degradation or failure. This robustness allows direct connection to antennas or diplexers without isolators in most small-cell deployments. The specification is verified per JEDEC JESD22-A108 and confirmed in Table 4 of the AWB7232 datasheet.
How is thermal management handled for the AWB7232 in high-density PCB layouts?
The AWB7232 uses an exposed ground paddle on the underside of its 7 mm × 7 mm package, providing low-thermal-resistance path (RJC = 11.2 °C/W) to the PCB copper pour. Designers must solder the paddle fully and connect it to a minimum 200 mm² internal or external ground plane. Thermal vias under the paddle (≥8×0.3 mm) are mandatory for sustained +27 dBm operation. This thermal architecture is documented in Figure 4 (PCB Footprint) and Table 4 of the AWB7232 datasheet.
Can the AWB7232 support multi-carrier LTE signals without performance degradation?
Yes - the AWB7232 is explicitly characterized for multi-carrier capability in its product description and electrical specifications. It maintains –47 dBc ACPR and <1.5% EVM across two or more adjacent 10 MHz LTE carriers within the 2.3–2.4 GHz band. This behavior stems from its InGaP HBT process linearity and integrated harmonic suppression, validated in Skyworks Application Note AN-1127 and confirmed in the "Features" section of the AWB7232 datasheet.
EVB7232 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Skyworks Solutions Inc.
- Series:
- -
- Packaging:
- Box
- Product Status:
- Obsolete
- Type:
- Amplifier
- Frequency:
- 2.3GHz ~ 2.4GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- AWB7232
EVB7232 FAQ
1.How can I place an order for EVB7232 through Aetrix?
Please submit a Request for Quotation (RFQ) for EVB7232 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for EVB7232 reliable?
The price and inventory of EVB7232 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for EVB7232 is usually 5 days.
3.What payment methods are accepted for EVB7232?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for EVB7232 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for EVB7232?
EVB7232 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your EVB7232 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for EVB7232?
For technical support, including EVB7232 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your EVB7232 requirements.
6.How does Aetrix verify that EVB7232 is sourced from the original manufacturer or authorized distributors?
All EVB7232 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that EVB7232 meets industry standards.
7.What is the process for return or replacement of EVB7232?
All EVB7232 units undergo pre-shipment inspection (PSI). If there is an issue with EVB7232, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The EVB7232 part is unused and in its original packaging.
Return procedure for EVB7232:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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