STMicroelectronics EVLMG4LPWRBR1

Overview

EVLMG4LPWRBR1 from STMicroelectronics is a GaN-based half-bridge evaluation board built around the MASTERGAN4L 600 V half-bridge enhancement-mode GaN HEMT with integrated high-voltage driver, supporting LLC, active clamp flyback, and synchronous inverse buck topologies. It features on-board adjustable dead-time filtering (via R11/C15 & R12/C16), discrete bootstrap diode (D2) and capacitor (C9), zero-ohm low-side sense resistors (R17–R20), and dual 6 V regulator options for VCC/PVCC. Designed for high-efficiency resonant power conversion up to ~250 W in LLC mode.

For engineers reviewing the EVLMG4LPWRBR1 datasheet, EVLMG4LPWRBR1 pinout, EVLMG4LPWRBR1 application, or EVLMG4LPWRBR1 equivalent, this board enables rapid validation of GaN-based resonant and peak-current-mode topologies-especially where fast wake-up time, thermal performance (R_th(J-A) = 45 °C/W), and flexible gate-drive signal conditioning are critical.

Technical Context

The EVLMG4LPWRBR1 implements a dedicated signal interface for MASTERGAN4L's LIN/HIN inputs (0–20 V logic range), SD/OD enable/disable control, and SENSE feedback for peak-current-mode loop closure. Its RC-filtered input paths allow precise dead-time tuning without modifying controller firmware.

Thermal design centers on a 30 × 40 mm FR-4 PCB with measured junction-to-ambient thermal resistance of 45 °C/W under natural convection-enabling thermal evaluation of large-power GaN topologies without forced airflow. External body diodes (D6/D7) and optional snubber components (C12/R10) support EMI optimization in LLC operation.

Key Specifications

Availability

EVLMG4LPWRBR1 is available at Aetrix Electronics and suitable for LLC resonant converters, active clamp flyback power supplies, synchronous inverse buck LED drivers, and GaN-based industrial SMPS requiring stable component supply and rapid topology prototyping.

Supply support for EVLMG4LPWRBR1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, analog, microcontrollers, and automotive-grade ICs with vertical manufacturing and broad industrial qualification.

This board belongs to ST's MASTERGAN evaluation platform family, designed specifically to accelerate development of high-efficiency, high-frequency GaN-based AC-DC and DC-DC power converters targeting data center, industrial, and LED lighting applications.

FAQ

What topologies does EVLMG4LPWRBR1 support out-of-the-box?

The board ships configured for LLC resonant converters: low-side sense resistors are shorted (0 Ω), and external STTH1R06A body diodes (D6/D7) are mounted in parallel with each GaN device to minimize conduction loss during current recirculation. No hardware changes are needed to run LLC with an ST controller like the STLUX or HVLED series.

How do I reconfigure EVLMG4LPWRBR1 for peak-current-mode flyback?

Replace the 0 Ω sense resistors (R17–R20) with appropriately sized shunts based on target output power and controller gain; remove D6 and D7; install a 6.2 V Zener diode (D11) between GH and OUTb for high-side gate protection. The SENSE pin then feeds the controller's current-sense input for duty-cycle modulation.

What is the purpose of the two RC networks on LIN and HIN?

R11/C15 and R12/C16 form independent low-pass filters on the LIN and HIN inputs, enabling precise adjustment of propagation delay and dead time between high- and low-side gate signals-critical for minimizing shoot-through in high-frequency GaN operation without relying on controller-level timing margins.

Can EVLMG4LPWRBR1 operate without forced airflow?

Yes-the board's 45 °C/W junction-to-ambient thermal resistance is measured under natural convection. It supports continuous operation in LLC mode up to ~250 W at 25 °C ambient, assuming proper heatsinking of the MASTERGAN4L QFN package and minimal copper plane thermal bottlenecks on the host motherboard.