Monolithic Power Systems Inc. EVM3570E-LD-00A

Overview

EVM3570E-LD-00A from Monolithic Power Systems is an evaluation board for the MPM3570E synchronous step-down power module, designed to validate 75V-input, 0.3A-output DC-DC conversion in space-constrained automotive and industrial systems. It implements a fixed 3.3V output (adjustable 1.0–12.0V via FB resistor), supports 4.5–75V input, integrates inductor and MOSFETs, and delivers up to 90% efficiency at 12V_IN/3.3V_OUT.

For engineers reviewing the EVM3570E-LD-00A datasheet, EVM3570E-LD-00A pinout, EVM3570E-LD-00A application, or EVM3570E-LD-00A equivalent, this board enables rapid validation of high-voltage POL regulation, transient response under load steps, enable-controlled sequencing, and CISPR25 Class 5 EMI compliance in real-world layouts.

Technical Context

The EVM3570E-LD-00A implements the MPM3570E's integrated synchronous buck architecture with internal high-side and low-side MOSFETs, controller, and shielded inductor. It operates in forced PWM mode with 40μA quiescent current and fixed soft-start time, supporting remote enable control and Power OK (POK) status signaling.

Test data confirms stable regulation across 0–300mA load (±0.8% load regulation) and 5–75V input (±0.8% line regulation), with output ripple under 80mV_pp at full load and ultra-fast transient recovery verified via oscilloscope waveforms for EN/V_IN startup/shutdown and short-circuit protection.

Key Specifications

Availability

EVM3570E-LD-00A is available at Aetrix Electronics and suitable for automotive infotainment power validation, industrial sensor node prototyping, and telecom base station auxiliary supply design requiring stable component supply and fast engineering access.

Supply support for EVM3570E-LD-00A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with over two decades of leadership in DC-DC conversion, motor drivers, and LED lighting controllers.

The MPM3570E product line targets ultra-compact, high-input-voltage POL modules for automotive ADAS, industrial PLCs, and networking equipment where board space, thermal density, and EMI are critical constraints.

FAQ

What input voltage range is validated on the EVM3570E-LD-00A?

The board is fully tested across 4.5V to 75V input, with published efficiency, ripple, and regulation curves for 5V, 12V, 24V, and 75V. Input capacitors CIN1/CIN2 (NS placeholders) must be selected per IEC 62368-1 surge requirements when operating above 42V.

How is output voltage adjusted from the default 3.3V?

Voltage adjustment uses the FB pin with an external resistor divider (R1/R2, both NS in BOM). The MPM3570E datasheet specifies V_FB = 0.8V; for example, R1 = 30.1kΩ and R2 = 10kΩ sets V_OUT = 3.3V. Values must maintain ≥100kΩ total resistance to limit divider current.

Does the board provide Power OK (POK) signaling, and how is it used?

Yes - POK is an open-drain output active-high when V_OUT is within ±8% of target. It drives a 10kΩ pull-up to V_OUT on the board and can interface directly with MCU reset or FPGA configuration logic for power-good sequencing.

What is the purpose of the "VEMI" test point?

VEMI is a dedicated low-noise measurement point connected to the output capacitor's ground side, isolated from high-current return paths. It enables accurate AC-coupled ripple measurement (<20mV/div) without ground loop interference during EMI debugging.

Can the board operate without connecting the EN pin?

Yes - the EN pin has an internal pull-up; leaving it unconnected enables the module by default. To disable, drive EN <1.0V (logic low); to enable, drive >1.2V (logic high). No external pull-up is required unless level-shifting from 3.3V logic.

Is thermal performance characterized on this evaluation board?

Yes - thermal shutdown triggers at T_J ≈ 150°C, and board-level IR imaging shows ≤45°C temperature rise at 0.3A/12V_IN with 200LFM airflow. The 10×10mm module's exposed thermal pad is soldered to a 25mm² copper pour on layer 2 for conduction cooling.