STMicroelectronics EV-VND5E050AJ

Overview

EV-VND5E050AJ from STMicroelectronics is a pre-assembled evaluation board for the VND5E050AJ-E double-channel high-side driver IC, designed for 12V automotive grounded-load control. It integrates thermal heat-sinking, PowerSSO-12 mounting, and full electrical connectivity including INPUT1/2, OUTPUT1/2, CURRENT SENSE1/2, CS_DIS, and dual VCC/GND terminals. It supports prototyping of load driving with real-time diagnostics and protection in automotive body electronics.

For engineers reviewing the EV-VND5E050AJ datasheet, EV-VND5E050AJ pinout, EV-VND5E050AJ application, or EV-VND5E050AJ equivalent, this board enables rapid validation of VIPower® M0-5 high-side driver behavior-including current sensing, overtemperature auto-restart, short-circuit detection, and CMOS-compatible 3V/5V microcontroller interfacing-under real thermal and electrical conditions.

Technical Context

The EV-VND5E050AJ implements a dedicated hardware interface for the VND5E050AJ-E, a dual-channel VIPower® M0-5 high-side driver in PowerSSO-12. It provides direct access to all functional pins-including two independent analog current sense outputs and a shared CS_DIS enable-and supports operation across 4.5–28 V supply range with up to 41 V transient tolerance.

Thermal design includes 2-layer FR4 PCB (38 × 38 mm), 70 µm copper, 1.6 mm thickness, and optimized thermal vias (0.3 mm Ø, 1.2 mm pitch) to achieve R_thj-amb = 31 °C/W. Board layout separates power, signal, and sense paths to preserve diagnostic accuracy during load switching and fault injection.

Key Specifications

Availability

EV-VND5E050AJ is available at Aetrix Electronics and suitable for automotive body control module development, industrial PLC output stage validation, and smart relay replacement prototyping requiring stable component supply and repeatable thermal performance.

Supply support for EV-VND5E050AJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, delivering silicon solutions for automotive, industrial, and consumer applications with emphasis on reliability, safety, and energy efficiency.

The EV-VND5E050AJ belongs to ST's VIPower® evaluation board family, developed specifically to accelerate adoption of their M0-5 high-side drivers in automotive load-driving applications requiring integrated protection and diagnostics.

FAQ

Does EV-VND5E050AJ include the VND5E050AJ-E IC?

Yes. The board ships fully assembled with one VND5E050AJ-E double-channel high-side driver in PowerSSO-12 package. No soldering or component placement is required to begin evaluation. The IC is factory-mounted and tested per ST's production data brief Doc ID 023958 Rev 2.

Can EV-VND5E050AJ be used for continuous 27 A load testing?

No. While the VND5E050AJ-E supports 27 A typical current limitation, the EV-VND5E050AJ board's thermal resistance (31 °C/W) limits sustained operation to ~10–12 A per channel at 50°C ambient without forced airflow. It is intended for functional validation and transient stress testing-not extended full-power duty cycles.

What external components are required to operate the board?

The board requires an external 4.5–28 V DC supply, microcontroller GPIOs for INPUT1/2 and CS_DIS, load(s) connected to OUTPUT1/2, and optional external sense resistors if CS_DIS is asserted. No additional passive components are needed for basic functionality, as decoupling and protection elements are onboard per AN4210 recommendations.

Is the EV-VND5E050AJ RoHS and ECOPACK® compliant?

Yes. The board uses RoHS-compliant assembly processes and components. The mounted VND5E050AJ-E IC carries ST's ECOPACK®2 environmental compliance grade, verified per ST's public specifications and documented in the device's package information section (Doc ID 023958 Rev 2, Section 4.1).