STMicroelectronics EV-VND7004AY

Overview

EV-VND7004AY from STMicroelectronics is an evaluation board pre-assembled with the VND7004AY double-channel smart high-side driver in PowerSSO-36 package, designed for automotive 12 V grounded-load control. It supports 4–28 V operating voltage, delivers 4 mΩ typical on-state resistance per channel, 100 A current limiting, and integrates MultiSense analog feedback (load current, VCC, TCHIP), fault reset (FaultRST), and sense enable (S_EN) for prototyping glow plug, heating, and DC motor drivers.

For engineers reviewing the EV-VND7004AY datasheet, EV-VND7004AY pinout, EV-VND7004AY application, or EV-VND7004AY equivalent, this board enables rapid validation of VIPower® M0-7 high-side driver diagnostics, thermal shutdown behavior, open-load detection, and CMOS-compatible 3 V/5 V interface timing under real load transients and supply variations.

Technical Context

The EV-VND7004AY implements ST's VIPower M0-7 technology to evaluate the VND7004AY's dual high-side switching architecture with integrated protection and diagnostics. It provides direct access to IN0/IN1 control inputs, FaultRST latch-reset, S_EN sense enable, SEL0/SEL1 multiplexer address lines, and the multiplexed MultiSense analog output delivering proportional current, VCC, and chip temperature signals.

Board-level design includes thermal vias (0.5 mm diameter), FR4 double-layer PCB (25 mm × 41.5 mm, 35 µm Cu), and provision for through-hole or SMD Rsense mounting at TP1–TP2. Junction-to-ambient thermal resistance is 39 °C/W under specified layout conditions.

Key Specifications

Availability

EV-VND7004AY is available at Aetrix Electronics and suitable for automotive ECU development, glow plug controller qualification, and high-power resistive/inductive actuator prototyping requiring stable component supply and validated thermal performance.

Supply support for EV-VND7004AY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management solutions with vertical manufacturing and IP ownership across silicon, packaging, and firmware.

The EV-VND7004AY belongs to ST's VIPower® evaluation platform family, engineered to accelerate adoption of smart power ICs in automotive body electronics, where precise diagnostics, latch-off recovery, and robust thermal management are critical.

FAQ

What is the purpose of the MultiSense pin on the EV-VND7004AY board?

The MultiSense pin (J3.8) is a multiplexed analog output delivering current proportional to selected diagnostics: load current (via internal current mirror), VCC supply voltage, or chip junction temperature. It requires external selection via SEL0/SEL1 and activation via S_EN to enable specific diagnostic mode during operation or OFF-state.

How does the FaultRST pin function on this evaluation board?

FaultRST (J3.7) is an active-low input that unlatches the VND7004AY outputs after fault events like overtemperature or short-circuit. When held low, it configures auto-restart mode; when pulsed low then released, it resets latched faults without cycling power, enabling controlled recovery in safety-critical automotive subsystems.

Can the EV-VND7004AY be used to validate open-load detection in OFF-state?

Yes - OFF-state open-load detection is enabled by connecting an external pull-up resistor to J3.5 (IN_PullUP). The board supports this function directly; no additional circuitry is needed. Detection relies on internal current source and comparator, and is disabled when S_EN is low to reduce standby current during module sleep modes.

What thermal performance can be expected from the EV-VND7004AY board under continuous load?

With the documented 2-layer FR4 layout (35 µm Cu, thermal vias), the board achieves 39 °C/W junction-to-ambient thermal resistance. At 100 A peak current and 4 mΩ RON, power dissipation reaches ~40 W per channel - requiring forced air or heatsink attachment to sustain continuous operation without thermal shutdown.