Texas Instruments F280025PNSR
- Part No.:
- F280025PNSR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
F280025PNSR.pdf
- Description:
- IC MCU 32BIT 128MB FLASH 80LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,941
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
F280025PNSR from Texas Instruments is a 100MHz C28x real-time microcontroller with IEEE 754 FPU, 128KB ECC-protected flash, 24KB RAM (ECC/parity), and 14 ePWM channels (8 with 150ps high-resolution). It integrates dual 3.45MSPS 12-bit ADCs, four CMPSS modules with 12-bit DACs, and FSI up to 200Mbps - designed for digital power control in solar inverters, EV charging stations, and motor drives.
For engineers reviewing the F280025PNSR datasheet, F280025PNSR pinout, F280025PNSR application, or F280025PNSR equivalent, key selection criteria include high-resolution PWM timing accuracy, on-chip analog signal chain integration, functional safety documentation support (ISO 26262/IEC 61508), and CLB-augmented peripheral flexibility for GaN/SiC gate drive control.
Technical Context
The F280025PNSR implements a deterministic real-time control subsystem centered on the C28x 32-bit DSP core, accelerated by TMU for trigonometric functions and VCRC for CRC-32 computation. Its dual-clock comparator (DCC) enables precise timing fault detection, while ERAD provides hardware-assisted runtime diagnostics.
Analog-to-control loop latency is minimized via tightly coupled ADCs with four post-processing blocks per converter and ePWM modules featuring integrated dead-band generation and hardware trip zones. The HIC interface allows external host access to internal memory without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | C28x 32-bit DSP at 100MHz with IEEE 754 FPU and TMU acceleration |
| Flash Memory | 128KB (64KW) ECC-protected - ensures reliable firmware storage in noisy power electronics environments |
| RAM | 24KB (12KW) total: 20KB dedicated/local shared + 4KB global shared, ECC or parity protected |
| ePWM Channels | 14 channels, 8 with 150ps high-resolution capability - supports precise GaN/SiC switching control |
| ADC System | Dual 12-bit, 3.45MSPS converters with 4 PPB per ADC - enables real-time current/voltage loop sampling |
| Communication | FSI (200Mbps TX/RX), 1 CAN, 2 SPI, 2 I²C, 1 PMBus, 2 LIN, 1 SCI - robust isolation-capable serial interfaces |
| Package | 80-pin LQFP (PN suffix), 14mm × 14mm body - standard industrial footprint with 43 GPIOs |
Pinout & Package
Package: 80-pin Low-profile Quad Flatpack (LQFP), 14mm × 14mm body size, 0.5mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDIO, VDDA | Power supply inputs | Separate digital core (VDD), I/O (VDDIO), and analog (VDDA) rails enable noise-isolated mixed-signal operation |
| VSS, VSSA | Ground terminals | Digital (VSS) and analog (VSSA) ground planes reduce coupling between logic and precision analog circuits |
| XRSn | Active-low reset input | Asynchronous hardware reset with debouncing support for system-level fault recovery |
| GPIO0–GPIO46 | Configurable I/O pins | 43 multiplexed GPIOs support peripheral function assignment including ePWM, eCAP, eQEP, and analog inputs |
| A0–A15, C0–C15 | Analog input channels | Up to 16 single-ended ADC inputs across two 12-bit converters - directly tied to power stage sensing nodes |
| FLT1, FLT2 | Hardware fault inputs | Dedicated fast-trip inputs for immediate ePWM shutdown during overcurrent or overtemperature events |
Key Features
| Feature | Design Value |
|---|---|
| High-Resolution PWM | 8 ePWM channels with 150ps resolution enable sub-nanosecond timing control for SiC/GaN gate drivers |
| Integrated Analog Signal Chain | Dual 3.45MSPS ADCs + 4 CMPSS modules with 12-bit DACs allow closed-loop current/voltage control without external components |
| Fast Serial Interface (FSI) | 200Mbps bidirectional link supports isolated communication with FPGA or auxiliary controllers across galvanic barriers |
| Configurable Logic Block (CLB) | Programmable logic tiles augment ePWM/eCAP functionality - implement custom gate drive sequencing or protection logic |
| Functional Safety Support | Documentation available for ISO 26262 ASIL-B, IEC 61508 SIL-2, and IEC 60730 Class B compliance in safety-critical systems |
Applications
| Solar Power Optimizer | EV DC Charging Station |
|---|---|
Use Scenario: Per-module MPPT control in residential PV arrays with rapid shutdown compliance. IC Role / Device Role / Timing Role: Real-time controller executing MPPT algorithms, driving MOSFETs via high-res ePWM, sampling panel voltage/current via dual ADCs. Use Value: 150ps PWM resolution enables precise duty-cycle modulation for >99% conversion efficiency at high switching frequencies. | Use Scenario: Primary controller in liquid-cooled 150kW+ DC fast chargers managing AC-DC rectification and DC-DC isolation stages. IC Role / Device Role / Timing Role: Coordinating interleaved PFC and LLC resonant converters using synchronized ePWM outputs and real-time current feedback. Use Value: Integrated DCC and hardware trip zones provide <100ns fault response - critical for IGBT/SiC short-circuit protection. |
| Industrial Servo Drive Power Stage | Automotive On-Board Charger (OBC) |
Use Scenario: Control of three-phase permanent magnet synchronous motors in CNC machine tools requiring <1µs current loop update. IC Role / Device Role / Timing Role: Running field-oriented control (FOC) with TMU-accelerated sine/cosine calculations and sampling motor phase currents via ADC PPBs. Use Value: Dual ADCs with post-processing blocks eliminate need for external filtering, reducing BOM cost and board area by 30%. | Use Scenario: Bidirectional AC/DC and DC/DC conversion in 11kW automotive OBCs meeting AEC-Q100 Grade 1 requirements. IC Role / Device Role / Timing Role: Managing dual active bridge (DAB) topology with synchronized 100kHz+ switching and CAN-based vehicle communication. Use Value: AEC-Q100 qualified variant (F280025-Q1) and built-in BIST/MPOST ensure reliability in automotive under-hood environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320F280025C | Includes 2 CLB tiles and motor control libraries in ROM; identical core/peripheral specs otherwise | Better suited for position manager solutions requiring FPGA-like logic augmentation | Select F280025C when CLB-based encoder interpolation or custom gate drive logic is required |
| TMS320F280023 | 64KB flash, no CLB, same 100MHz C28x core and peripheral set except reduced GPIO count (30 vs 43) | Targeted at cost-sensitive industrial drives with simpler control requirements | Choose F280023 for compact designs where full 128KB flash and CLB are unnecessary |
Compared with F280025C, the F280025PNSR lacks CLB resources but retains full flash and GPIO capability; compared with F280023, it delivers double flash capacity and 13 additional GPIOs - making it optimal for complex multi-loop digital power systems requiring field-upgradable firmware and extensive peripheral routing.
Availability
F280025PNSR is available at Aetrix Electronics and suitable for solar inverters, EV charging infrastructure, and industrial servo drives requiring stable component supply across extended production lifecycles.
Supply support for F280025PNSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management, signal chain, and real-time control MCUs.
The TMS320F28002x product line was engineered specifically for ultra-low-latency digital power conversion - targeting high-efficiency GaN/SiC-based systems in solar, EV, and industrial motor control applications.
FAQ
What is the maximum operating junction temperature for the F280025PNSR?
The F280025PNSR is rated for –40°C to 125°C junction temperature (S-grade). This specification is validated per TI's thermal characterization and supports continuous operation in high-power-density applications such as 3-phase inverters and onboard chargers where ambient temperatures exceed 85°C.
Does the F280025PNSR support AEC-Q100 qualification?
No, the F280025PNSR is the commercial S-grade variant. For automotive applications, TI offers the pin-compatible F280025-Q1, which is AEC-Q100 qualified for Grade 1 (–40°C to 125°C free-air) and includes additional automotive-specific test coverage and documentation.
How many hardware breakpoints does the F280025PNSR support during debug?
The F280025PNSR supports ten hardware breakpoints using the Embedded Real-time Analysis and Diagnostic (ERAD) module. These breakpoints operate independently of code execution flow and remain active during real-time control loops without performance penalty.
Can the F280025PNSR's Fast Serial Interface (FSI) be used across an isolation barrier?
Yes, the F280025PNSR's FSI supports robust 200Mbps communication across galvanic isolation boundaries using standard digital isolators. Its differential signaling and built-in error detection make it ideal for interfacing with isolated gate drivers or auxiliary safety monitors in high-voltage systems.
Is the F280025PNSR pin-compatible with other devices in the F28002x family?
Yes, the F280025PNSR in the 80-pin PN package shares identical pinout with F280025C, F280023, and F280023C in the same package option - enabling hardware reuse across variants with different flash sizes or CLB configurations.
F280025PNSR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 80-LQFP
- Series:
- F28002x C2000™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- C28x
- Core Size:
- 32-Bit
- Speed:
- 100MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 128KB (64K x 16)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 12K x 16
- Voltage - Supply (Vcc/Vdd):
- 2.81V ~ 3.63V
- Data Converters:
- A/D 16x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
F280025PNSR FAQ
1.How can I place an order for F280025PNSR through Aetrix?
Please submit a Request for Quotation (RFQ) for F280025PNSR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for F280025PNSR reliable?
The price and inventory of F280025PNSR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for F280025PNSR is usually 5 days.
3.What payment methods are accepted for F280025PNSR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for F280025PNSR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for F280025PNSR?
F280025PNSR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your F280025PNSR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for F280025PNSR?
For technical support, including F280025PNSR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your F280025PNSR requirements.
6.How does Aetrix verify that F280025PNSR is sourced from the original manufacturer or authorized distributors?
All F280025PNSR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that F280025PNSR meets industry standards.
7.What is the process for return or replacement of F280025PNSR?
All F280025PNSR units undergo pre-shipment inspection (PSI). If there is an issue with F280025PNSR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The F280025PNSR part is unused and in its original packaging.
Return procedure for F280025PNSR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
F280025PNSR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

