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Texas Instruments F280039CSPN

Part No.:
F280039CSPN
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
80-LQFP
Datasheet:
AetrixF280039CSPN.pdf
Description:
IC MCU 32BIT 384KB FLASH 80LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,049

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Product details

Overview

F280039CSPN from Texas Instruments is a C28x-based real-time microcontroller with 120 MHz DSP core, IEEE 754 FPU, CLA accelerator, 384KB ECC-protected flash, and 69KB ECC-protected RAM. It integrates three 4-MSPS 12-bit ADCs, 16 ePWM channels (8 with 150-ps resolution), dual CAN/CAN FD interfaces, FSI up to 200 Mbps, and CLB for FPGA-like logic extension-designed for high-efficiency power electronics control in motor drives and digital power modules.

For engineers reviewing the F280039CSPN datasheet, F280039CSPN pinout, F280039CSPN application, or F280039CSPN equivalent, key selection criteria include CLA offload capability, 150-ps HRPWM timing precision, dual CAN FD + DCAN support, on-chip analog signal chain integration, and AEC-Q100 qualification readiness via PN-package variants.

Technical Context

The F280039CSPN implements a dual-core real-time architecture: the C28x CPU executes main control loops at 120 MHz with FPU, TMU, and VCRC acceleration, while the independent 120 MHz CLA handles time-critical tasks like PWM update, current loop computation, and sensor preprocessing-enabling deterministic sub-microsecond response. Its memory subsystem features three independent 128KB flash banks supporting concurrent execute-and-program operations and Live Firmware Update with minimized downtime.

Analog-peripheral co-location includes three synchronized 12-bit ADCs with four post-processing blocks each, four windowed comparators with integrated 12-bit DAC references, two buffered DAC outputs, and eight SDFM input channels-tightly coupled to ePWM and eCAP modules for closed-loop control of GaN/SiC power stages. The CLB provides four configurable logic tiles for custom I/O sequencing, position manager logic, or fault-handling state machines.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreC28x 32-bit DSP at 120 MHz with IEEE 754 FPU, TMU, and VCRC instructions
CLA AcceleratorDedicated 120 MHz floating-point accelerator executing independently of CPU with message RAM
Flash Memory384KB (192KW) ECC-protected across three 128KB banks enabling parallel execution and programming
RAM69KB (34.5KW) ECC-protected: 4KB M0/M1, 32KB LS, 32KB GS, 1KB message RAM
ePWM Channels16 total, with 8 supporting 150-ps high-resolution pulse width modulation for precise dead-time control
ADC SystemThree 12-bit, 4-MSPS ADCs with 250 ns conversion time and four post-processing blocks per ADC
Communication1× DCAN, 1× MCAN/CAN FD, 2× SPI, 2× SCI/UART, 2× I²C, 1× PMBus, 1× FSI (200 Mbps)
Package & Temp80-pin LQFP (PN), –40°C to 125°C ambient, –40°C to 150°C junction

Pinout & Package

80-pin Low-profile Quad Flatpack (LQFP), 14 mm × 14 mm body size, 0.5 mm pitch, exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
VDDIOI/O Power Supply3.3-V supply for all GPIO, peripheral I/O, and analog reference; supports single-supply system design
VDDAAnalog Power3.3-V analog domain supply for ADC, CMPSS, DAC, and SDFM-separate from digital VDDIO for noise isolation
VREFHI/VREFLOADC ReferenceExternal 0–3.3-V reference inputs for ADC full-scale range; internal 1.65-V reference available when unconnected
GPIO0–GPIO38General-Purpose I/O39 multiplexed pins supporting digital I/O, ePWM, eCAP, eQEP, SPI, SCI, I²C, CAN, LIN, FSI, CLB, and HIC functions
EPWMxA/EPWMxBPWM Output PairComplementary high-resolution PWM outputs with programmable dead-band generation and trip-zone protection
ECAP1–ECAP3Capture InputThree enhanced capture modules for edge-timing measurement; ECAP3 supports high-resolution capture (HRCAP)
EQEP1/EQEP2Quadrature EncoderTwo encoder interfaces with CW/CCW direction detection, index pulse handling, and position counter synchronization
FSI_TX/FSI_RXFast Serial InterfaceDifferential transmitter/receiver pair supporting up to 200 Mbps isolated communication with CRC and error detection
HIC_DATA/HIC_ADDRHost InterfaceParallel 16-bit data and 16-bit address bus allowing external host direct access to internal memory and peripherals
JTAG_TCK/TMS/TDO/TDIDebug InterfaceIEEE 1149.1-compliant boundary-scan and debug interface; cJTAG mode supported on TCK/TMS/TDO only

Key Features

FeatureDesign Value
Live Firmware Update (LFU)Enables fast context switch between old and new firmware images with reduced flash bank erase time-minimizing system downtime during field updates
Configurable Logic Block (CLB)Four independent logic tiles allow implementation of custom state machines, position managers, or hardware-accelerated fault responses without FPGA
Enhanced Control Peripherals16 ePWM channels with integrated dead-band, trip zones, and HRPWM (150-ps resolution) for SiC/GaN gate driver timing precision
Integrated Analog Signal ChainThree synchronized 12-bit ADCs, four CMPSS units with 12-bit DAC references, two buffered DAC outputs, and eight SDFM channels enable full analog sensing and actuation in one chip
Functional Safety SupportHardware features including MPOST, HWBIST, ERAD, dual-clock comparator, and ASIL B/SIL 2 certification documentation aid ISO 26262 and IEC 61508 system development
High-Speed Isolated CommunicationFSI interface delivers up to 200 Mbps robust serial communication across isolation barriers-replacing multiple discrete isolators in motor drive and power supply designs

Applications

Motor Drive Position FeedbackIndustrial AC-DC Power Conversion

Use Scenario: Real-time rotor position tracking in servo and BLDC drives using eQEP and HRCAP for nanosecond-level timing accuracy.

IC Role / Device Role / Timing Role: Primary controller executing field-oriented control (FOC) with CLA-accelerated current loops and eQEP-based position decoding.

Use Value: Eliminates external position decoder IC and reduces latency by 3.2 µs versus software-only capture-enabling >20 kHz servo bandwidth.

Use Scenario: Digital control of multi-phase interleaved PFC and LLC resonant converters in telecom/server PSUs.

IC Role / Device Role / Timing Role: Real-time PWM generator with 150-ps HRPWM resolution, synchronized ADC sampling, and hardware trip zones for overcurrent protection.

Use Value: Supports >1 MHz switching frequencies with <1% duty-cycle error-critical for GaN-based 3 kW server PSU efficiency targets.

Solar Microinverter ControlEV On-Board Charger (OBC) Module

Use Scenario: MPPT, grid synchronization, and anti-islanding protection in single-phase solar microinverters.

IC Role / Device Role / Timing Role: Dual-core controller: C28x manages grid sync and safety logic; CLA runs fast inner current loops and ADC post-processing.

Use Value: Achieves <100 ms anti-islanding response time and ±0.02% THD under dynamic load-meeting IEEE 1547-2018 requirements.

Use Scenario: Bidirectional AC/DC and DC/DC control in 11 kW OBC modules with SiC power stages.

IC Role / Device Role / Timing Role: Central controller managing PFC, DC-link regulation, and isolated LLC stages via FSI-linked secondary-side controllers.

Use Value: FSI enables 200 Mbps isolated communication to secondary MCU-reducing component count by 4 optocouplers and improving startup time by 18 ms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar real-time control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TMS320F280037CPN256KB flash, same 80-pin LQFP package, identical peripheral set except reduced flash bank count (2×128KB vs 3×128KB)Lower-cost option for systems not requiring LFU or concurrent execute-and-program operationSelect F280037CPN when firmware update frequency is low and flash partitioning is unnecessary
TMS320F280049CPNNewer generation with C28x+ core, higher analog performance (5-MSPS ADC), additional CLA type, but no FSI or HICBetter suited for next-gen designs prioritizing analog fidelity over legacy interface compatibilityChoose F280049CPN for new designs needing higher ADC throughput and advanced math acceleration-but verify absence of FSI/HIC does not impact system architecture

Compared with F280037CPN, F280039CSPN adds 128KB flash and LFU support for robust field updates; versus F280049CPN, it retains FSI and HIC for high-throughput isolated communication and host interfacing-making it optimal for industrial power modules requiring both upgradeability and system-level connectivity.

Availability

F280039CSPN is available at Aetrix Electronics and suitable for industrial motor drives, solar microinverters, and EV on-board chargers requiring stable component supply, long-term lifecycle assurance, and automotive-grade qualification pathways.

Supply support for F280039CSPN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with deep expertise in real-time control and power electronics.

The TMS320F28003x product line was designed specifically for ultra-low-latency, high-efficiency power conversion systems-including motor drives, digital power supplies, renewable energy inverters, and EV charging infrastructure-leveraging C28x DSP performance and hardware accelerators.

FAQ

What is the maximum operating temperature for the F280039CSPN?

The F280039CSPN has a specified free-air operating temperature range of –40°C to 125°C and a junction temperature limit of –40°C to 150°C. These ratings apply to the 80-pin LQFP (PN) package variant and are validated per TI's recommended operating conditions in the SPRSP61C datasheet. Thermal design must ensure junction temperature remains within limits under worst-case power dissipation.

Does the F280039CSPN support functional safety certification?

Yes, the F280039CSPN supports functional safety development with hardware features including Memory Power-On Self Test (MPOST), Hardware Built-in Self Test (HWBIST), Embedded Real-time Analysis and Diagnostic (ERAD), and Dual-Clock Comparator (DCC). While the F280039CSPN itself is not AEC-Q100 qualified, its pin-compatible F280039C-Q1 (PZ/PN) variant is certified to ASIL B and SIL 2 by TÜV SÜD-enabling reuse of safety documentation and architecture.

How many independent ADC modules does the F280039CSPN integrate?

The F280039CSPN integrates three independent 12-bit Analog-to-Digital Converters (ADCs), each capable of 4 million samples per second (4 MSPS) with 250 ns conversion time. Each ADC includes four dedicated Post-Processing Blocks (PPBs) for real-time filtering, oversampling, and averaging-enabling simultaneous voltage, current, and temperature acquisition in high-speed motor control loops.

What communication interfaces with isolation capability does the F280039CSPN provide?

The F280039CSPN provides Fast Serial Interface (FSI) with dedicated TX and RX differential pairs supporting up to 200 Mbps isolated communication across capacitive or magnetic barriers. Unlike standard UART or SPI, FSI includes built-in CRC, error detection, and automatic retransmission-making it suitable for replacing multiple optocouplers in motor drive gate driver interfaces and isolated power stage controllers.

Is the F280039CSPN pin-compatible with other F28003x devices in the same package?

Yes, the F280039CSPN is fully pin-compatible with all other F28003x devices offered in the 80-pin LQFP (PN) package-including F280037CPN, F280034PN, and F280034-Q1PN. Pin assignments, electrical characteristics, and peripheral mappings match exactly across these variants, enabling drop-in replacement for memory or feature scaling without PCB redesign.

F280039CSPN Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
80-LQFP
Series:
C2000™ C28x
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
AES, Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
384KB (192K x 16)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
34.5K x 16
Voltage - Supply (Vcc/Vdd):
1.14V ~ 3.63V
Data Converters:
A/D 18x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

F280039CSPN FAQ

1.How can I place an order for F280039CSPN through Aetrix?

Please submit a Request for Quotation (RFQ) for F280039CSPN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for F280039CSPN reliable?

The price and inventory of F280039CSPN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for F280039CSPN is usually 5 days.

3.What payment methods are accepted for F280039CSPN?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for F280039CSPN transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for F280039CSPN?

F280039CSPN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your F280039CSPN order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for F280039CSPN?

For technical support, including F280039CSPN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your F280039CSPN requirements.

6.How does Aetrix verify that F280039CSPN is sourced from the original manufacturer or authorized distributors?

All F280039CSPN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that F280039CSPN meets industry standards.

7.What is the process for return or replacement of F280039CSPN?

All F280039CSPN units undergo pre-shipment inspection (PSI). If there is an issue with F280039CSPN, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The F280039CSPN part is unused and in its original packaging.

Return procedure for F280039CSPN:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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