My Inquiry
My Account
Texas Instruments F280039SPZ
- Part No.:
- F280039SPZ
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
F280039SPZ.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,736
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMS320F280039SPZ from Texas Instruments is a C28x-based real-time microcontroller designed for high-precision power electronics control, featuring a 120 MHz DSP core with IEEE 754 FPU, 384KB ECC-protected flash across three banks, 69KB ECC-protected RAM, and integrated CLA running at 120 MHz. It delivers deterministic low-latency execution for motor drives, digital power converters, and EV charging systems.
For engineers reviewing the TMS320F280039SPZ datasheet, TMS320F280039SPZ pinout, TMS320F280039SPZ application, or TMS320F280039SPZ equivalent, key selection criteria include its 16-channel ePWM with 8 high-resolution (150-ps) channels, dual CAN/CAN FD interfaces, triple 4-MSPS 12-bit ADCs, CLB with 4 tiles, and functional safety compliance up to ASIL B/SIL 2 in PZ package.
Technical Context
The TMS320F280039SPZ integrates a C28x CPU with FPU, TMU, and VCRC extensions to accelerate real-time control math, while the independent CLA offloads PID/NLPID loops and sensor preprocessing. Its memory architecture supports concurrent flash programming and execution via three 128KB banks.
Analog subsystem tightly couples three 12-bit ADCs (4 MSPS, 250 ns conversion time), four CMPSS modules with 12-bit DAC references, and two buffered DAC outputs to 16 ePWM channels-eight supporting 150-ps resolution and hardware dead-band generation for GaN/SiC gate drivers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | C28x 32-bit DSP at 120 MHz with IEEE 754 FPU and TMU for fast trigonometric and floating-point control math |
| Flash Memory | 384KB (192KW) ECC-protected across three independent 128KB banks enabling live firmware update with zero downtime |
| RAM | 69KB (34.5KW) ECC-protected: 4KB M0/M1, 32KB LS0–LS7, 32KB GS0–GS3, plus 1KB message RAM |
| ePWM Channels | 16 total, with 8 supporting 150-ps high-resolution timing for precise GaN/SiC switching control |
| ADC System | Three 12-bit, 4-MSPS ADCs with 250 ns conversion time and four post-processing blocks per ADC for real-time filtering |
| Communication | Dual CAN: one DCAN (CAN 2.0B) and one MCAN (CAN FD); plus two I²C, two SPI, two SCI/LIN, PMBus, and FSI (200 Mbps) |
| Functional Safety | ISO 26262 ASIL B and IEC 61508 SIL 2 certified (TÜV SÜD) for PZ package; includes HWBIST, MPOST, ERAD, and dual-clock comparator |
Pinout & Package
Package: 100-pin Low-profile Quad Flatpack (LQFP), 16 mm × 16 mm body size, 0.5 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO / VSSIO | I/O Power Supply / Ground | 3.3-V tolerant I/O domain with internal LDO regulation; supports single-supply system design |
| VDDA / VSSA | Analog Power / Ground | Separate 3.3-V analog supply domain for ADC, CMPSS, and DAC to minimize noise coupling |
| XCLKIN / XCLKOUT | External Clock Input / Output | Accepts external crystal (1–20 MHz) or clock source; provides buffered output for system synchronization |
| GPIO0–GPIO50 | General-Purpose I/O | 51 programmable pins with configurable pullup/pulldown, interrupt capability, and peripheral multiplexing (ePWM, eCAP, SPI, etc.) |
| EPWM1A–EPWM16B | ePWM Output Pairs | Dedicated high/low-side PWM outputs with integrated dead-band generation and trip-zone protection |
| ADCINA0–ADCINA22 | Analog Input Channels | Up to 23 external analog inputs shared across three ADCs; includes dedicated temperature sensor input |
| CANA_H / CANA_L | CAN Bus Differential Pair | Physical layer interface for DCAN port (CAN 2.0B compliant, up to 1 Mbps) |
| CANFD_H / CANFD_L | CAN FD Bus Differential Pair | Physical layer interface for MCAN port (CAN FD compliant, up to 5 Mbps data phase) |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Control Law Accelerator (CLA) | Independent 120 MHz floating-point accelerator executing control loops in parallel with C28x CPU; reduces main CPU load by >40% in servo drive benchmarks |
| Configurable Logic Block (CLB) | Four programmable logic tiles enabling FPGA-like custom logic (e.g., position manager, encoder interpolation, fault logic) without external components |
| Live Firmware Update (LFU) | Hardware-accelerated context switch between active and updated firmware images; enables <500 µs switchover during runtime for zero-downtime updates |
| Enhanced Analog Subsystem | Triple synchronized 12-bit ADCs with 4-MSPS sampling, 250 ns conversion, and per-ADC post-processing blocks for real-time harmonic analysis and overcurrent detection |
| Functional Safety Support | Integrated diagnostics including memory BIST (MPOST), hardware watchdog (windowed + NMI), dual-clock comparator (DCC), and ERAD trace capture for ASIL B/SIL 2 system certification |
| Fast Serial Interface (FSI) | 200 Mbps isolated serial link with built-in error correction; replaces optocouplers in isolated gate driver communication for compact, high-reliability power stage designs |
Applications
| Motor Drive Control | Digital Power Conversion |
|---|---|
|
Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase PMSM/BLDC motors in industrial servo drives. IC Role / Device Role / Timing Role: Real-time controller executing FOC algorithm, generating 16-channel PWM with 150-ps resolution, sampling current/voltage via triple ADCs, and managing CAN FD feedback loop. Use Value: Enables <1 µs current loop latency and sub-100 ns timing jitter for <0.1% torque ripple in high-speed spindles and robotics. |
Use Scenario: High-frequency LLC resonant converter control in telecom/server PSUs with adaptive frequency modulation. IC Role / Device Role / Timing Role: Primary controller managing variable-frequency PWM, sensing primary-side current/voltage, implementing soft-start and overvoltage protection using CMPSS comparators. Use Value: Achieves >97% efficiency at 1 MHz switching with real-time adaptive dead-time compensation via HRPWM and CLB logic. |
| EV On-Board Charger (OBC) | Solar String Inverter |
|
Use Scenario: Bidirectional AC/DC and DC/DC conversion in 11-kW OBCs with grid synchronization and battery isolation monitoring. IC Role / Device Role / Timing Role: Dual-core controller: C28x handles grid PLL, power factor correction, and CAN communication; CLA executes battery-side DC/DC control and thermal management. Use Value: Supports seamless mode transitions (AC charge → DC fast charge → vehicle-to-grid) with <2 ms response time and ISO 26262 ASIL B compliance. |
Use Scenario: MPPT and grid-synchronization control in residential string inverters with rapid shutdown and arc-fault detection. IC Role / Device Role / Timing Role: Central controller performing real-time MPPT (P&O + incremental conductance), 50/60 Hz grid sync via eQEP and ADC sampling, and arc-fault classification using SDFM filters. Use Value: Delivers <98.5% weighted efficiency and meets UL 1741 SB rapid shutdown requirements with on-chip SDFM and CMPSS hardware acceleration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320F280037CPZ | 256KB flash (vs. 384KB), no CLB tiles, same 100-pin PZ package and 120 MHz C28x/CLA performance | Lacks CLB for custom logic; reduced flash limits complex multi-stage control algorithms and dual-firmware storage | Select when CLB and full 384KB flash are unnecessary-e.g., single-loop motor control with minimal firmware overhead |
| TMS320F280049CPZ | Newer generation with 256KB flash, enhanced CLA (Type 3), higher ADC resolution (16-bit), and additional ePWM channels (24) | Higher precision analog and expanded peripherals suit next-gen SiC traction inverters but require updated toolchain and layout | Choose for new designs targeting >100 kW inverters where 16-bit ADC resolution and extended PWM flexibility justify migration effort |
Compared with TMS320F280037CPZ, the TMS320F280039SPZ adds 128KB flash and 4 CLB tiles for FPGA-like logic integration-critical for position managers and safety monitors. Versus TMS320F280049CPZ, it trades newer analog features for proven ASIL B certification and broader ecosystem support in production automotive OBCs.
Availability
TMS320F280039SPZ is available at Aetrix Electronics and suitable for industrial motor drives, EV on-board chargers, and solar string inverters requiring stable component supply, long-term lifecycle assurance, and functional safety documentation.
Supply support for TMS320F280039SPZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in power management and real-time control ICs.
The TMS320F28003x product line was engineered specifically for ultra-low-latency, high-efficiency power electronics-including GaN/SiC-based motor drives, digital power supplies, and EV charging infrastructure-with integrated safety and firmware update capabilities.
FAQ
What is the maximum operating junction temperature for the TMS320F280039SPZ?
The TMS320F280039SPZ has a specified junction temperature range of –40°C to 150°C, validated for continuous operation under full load in sealed industrial enclosures and automotive under-hood environments. Thermal resistance for the 100-pin PZ package is 21.5°C/W (θJA), enabling reliable operation at 120 MHz with standard 2-layer PCB cooling.
Does the TMS320F280039SPZ support CAN FD, and how is it implemented?
Yes, the TMS320F280039SPZ includes one Controller Area Network with Flexible Data-Rate (CAN FD/MCAN) port supporting up to 5 Mbps data phase, alongside a separate legacy DCAN port. The MCAN module implements ISO 11898-1:2015 with hardware CRC, bit-rate switching, and payload sizes up to 64 bytes-enabling high-bandwidth diagnostics and firmware updates in EV charging stations.
How does the CLA in the TMS320F280039SPZ improve real-time control performance?
The CLA in the TMS320F280039SPZ is a fully autonomous 32-bit floating-point accelerator running at 120 MHz, with dedicated program/data RAM and direct peripheral access. It executes control loops-such as PID, NLPID, or observer algorithms-concurrently with the C28x CPU, reducing main CPU load by up to 45% and enabling sub-microsecond current-loop execution in servo drives.
Is the TMS320F280039SPZ qualified for automotive applications?
The TMS320F280039SPZ itself is not AEC-Q100 qualified; however, the functionally identical TMS320F280039C-Q1 and TMS320F280039-Q1 variants in the same PZ package are AEC-Q100 Grade 1 qualified (–40°C to 125°C TA) and ISO 26262 ASIL B certified. For automotive use, select those Q1 suffix variants.
What development tools are supported for the TMS320F280039SPZ?
The TMS320F280039SPZ is fully supported by TI's C2000Ware software suite, Code Generation Tools v23.6+, and CCS IDE v12.4+. Hardware evaluation is enabled by the TMDSCNCD280039C controlCARD and BOOSTXL-3PHGANINV inverter kit. Debugging uses JTAG/cJTAG with ERAD real-time trace and CLA-aware breakpoints.
F280039SPZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- C2000™ C28x
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- C28x
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI, UART/USART
- Peripherals:
- AES, Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 384KB (192K x 16)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 34.5K x 16
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.63V
- Data Converters:
- A/D 23x12b SAR; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
F280039SPZ FAQ
1.How can I place an order for F280039SPZ through Aetrix?
Please submit a Request for Quotation (RFQ) for F280039SPZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for F280039SPZ reliable?
The price and inventory of F280039SPZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for F280039SPZ is usually 5 days.
3.What payment methods are accepted for F280039SPZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for F280039SPZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for F280039SPZ?
F280039SPZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your F280039SPZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for F280039SPZ?
For technical support, including F280039SPZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your F280039SPZ requirements.
6.How does Aetrix verify that F280039SPZ is sourced from the original manufacturer or authorized distributors?
All F280039SPZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that F280039SPZ meets industry standards.
7.What is the process for return or replacement of F280039SPZ?
All F280039SPZ units undergo pre-shipment inspection (PSI). If there is an issue with F280039SPZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The F280039SPZ part is unused and in its original packaging.
Return procedure for F280039SPZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
F280039SPZ Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
