Texas Instruments F28M35H52C1RFPT

Overview

F28M35H52C1RFPT from Texas Instruments is a dual-core Concerto™ microcontroller integrating an Arm® Cortex®-M3 master subsystem (100 MHz) and a TMS320C28x real-time control subsystem (150 MHz), with 512KB ECC flash, 32KB RAM (ECC/parity), 64KB shared RAM, dual 12-bit ADCs (2.88 MSPS, 20 channels), six comparators with integrated DACs, and 10/100 ENET 1588 MII - deployed in solar string inverters and industrial AC drive control modules.

For engineers reviewing the F28M35H52C1RFPT datasheet, F28M35H52C1RFPT pinout, F28M35H52C1RFPT application, or F28M35H52C1RFPT equivalent, key selection criteria include dual-core clock coordination (100/150 MHz), HTQFP-144 PowerPAD thermal packaging, IPC-based interprocessor communication, and hardware safety features including ECC memory, dual security zones, and NMI watchdogs for industrial safety-critical systems.

Technical Context

The F28M35H52C1RFPT implements a tightly coupled dual-core architecture: the Cortex-M3 handles high-level communication (USB OTG + PHY, Ethernet 1588, five UARTs, two CAN, I²C, SSI/SPI) while the C28x executes deterministic real-time control (nine ePWM modules with 16 HRPWM outputs, six eCAP, three eQEP, VCU-accelerated math). Both subsystems share 64KB parity RAM and 2KB IPC message RAM with 32 handshaking channels.

Clocking uses independent PLLs with dynamic ratio changes; the system supports 1.2-V digital, 1.8-V analog, and 3.3-V I/O domains. Analog subsystem includes two synchronized 12-bit ADCs with four sample-and-hold circuits, enabling simultaneous sampling across 20 total channels - critical for motor current and voltage sensing in servo drives.

Key Specifications

Pinout & Package

Package: 144-pin RFP PowerPAD™ Thermally Enhanced Thin Quad Flatpack (HTQFP), 20.0 mm × 20.0 mm body size, exposed thermal pad requiring solder connection to PCB ground plane for thermal and electrical integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core real-time control applications.

Compared with F28M35H52C-Q1, the F28M35H52C1RFPT offers identical silicon functionality but targets commercial/industrial use with 105°C junction rating; versus TMS320F28388D, it trades EtherCAT for broader protocol support (ENET 1588, USB OTG, multiple CAN) and true heterogeneous multicore partitioning.

Availability

F28M35H52C1RFPT is available at Aetrix Electronics and suitable for solar string inverters, industrial servo drives, and central HVAC inverters requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for safety-certified designs.

Supply support for F28M35H52C1RFPT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies, with leadership in industrial, automotive, and power electronics markets.

The F28M35H52C1RFPT belongs to TI's Concerto™ family - designed specifically to unify high-speed communication and deterministic real-time control on a single chip for energy conversion and motion control systems.

FAQ

What is the maximum operating junction temperature for the F28M35H52C1RFPT?

The F28M35H52C1RFPT is rated for –40°C to 105°C junction temperature (TJ), as specified in the "Temperature options" section of the datasheet. This T-grade rating aligns with industrial applications requiring reliable operation under sustained thermal load. The HTQFP PowerPAD package must be soldered to a PCB ground plane with thermal vias to maintain safe junction temperatures during full-load operation of both CPU cores and analog peripherals.

Does the F28M35H52C1RFPT support pin-compatible migration from other F28M35x devices?

The F28M35H52C1RFPT uses the same 144-pin HTQFP PowerPAD package and pinout as F28M35H52C, F28M35H22C, and F28M35M52C variants. However, feature differences exist - for example, F28M35H52C1RFPT includes 10/100 ENET 1588 and USB OTG, while F28M35M52C omits ENET. Pin compatibility does not guarantee functional equivalence; peripheral enablement and clock configuration must be verified per device variant.

How does the IPC mechanism work between the Cortex-M3 and C28x subsystems in the F28M35H52C1RFPT?

The F28M35H52C1RFPT implements a hardware IPC module with 32 dedicated handshaking channels and two 2KB message RAM blocks (CTOM and MTOC). Each channel supports interrupt generation and semaphore-style signaling, allowing the Cortex-M3 and C28x to coordinate data transfers - for example, passing updated PID gains from the M3 to C28x control loops - without polling or shared-memory race conditions.

Can the F28M35H52C1RFPT's dual ADCs perform simultaneous sampling across all 20 channels?

No - the F28M35H52C1RFPT's dual 12-bit ADCs support simultaneous sampling only within each converter's channel group (10 per ADC), enabled by shared sample-and-hold circuits. Full 20-channel simultaneous acquisition requires external synchronization or staggered triggering. The maximum aggregate sampling rate is 2.88 MSPS per ADC, with conversion time fixed at 347 ns when running at 150 MHz C28x clock.

What safety certifications or hardware features does the F28M35H52C1RFPT provide for industrial applications?

The F28M35H52C1RFPT includes ECC on flash and RAM, parity on shared RAM, dual security zones with 128-bit passwords, NMI watchdogs per core, critical register lock protection, and glitch-free GPIO - all documented to support IEC 61508 SIL-2 system-level certification. It does not carry pre-certified ASIL or SIL ratings; end-equipment certification remains the responsibility of the system integrator using these features as part of a validated safety architecture.