Texas Instruments F28M36H33B2ZWTQ

Overview

F28M36H33B2ZWTQ from Texas Instruments is a dual-core Concerto™ microcontroller integrating an Arm® Cortex®-M3 (100 MHz) master subsystem and a TMS320C28x (150 MHz) real-time control subsystem on a single die, with 512KB ECC flash per core, dual 12-bit ADCs (2.88 MSPS total), 12 ePWM modules, 6 comparators with integrated DACs, and 289-ball nFBGA (ZWT) packaging for industrial motor control and power conversion applications.

For engineers reviewing the F28M36H33B2ZWTQ datasheet, F28M36H33B2ZWTQ pinout, F28M36H33B2ZWTQ application, or F28M36H33B2ZWTQ equivalent, key selection criteria include dual-core clock coordination (100/150 MHz), shared RAM allocation (0 KB), absence of Ethernet/USB peripherals, temperature grade (–40°C to 105°C), and ZWT package mechanical compatibility.

Technical Context

The F28M36H33B2ZWTQ implements strict hardware separation between its Cortex-M3 communications subsystem and C28x real-time control subsystem, coordinated via 32-channel IPC with 2KB message RAM and handshaking interrupts. Clocking uses independent PLLs with dynamic ratio changes, maintaining integer divide constraints between cores (e.g., 100 MHz M3 / 150 MHz C28x).

Analog resources are shared: dual 12-bit ADCs operate at up to 2.88 MSPS with 24 total channels and four S/H circuits; six comparators each integrate a 10-bit DAC and support GPIO-triggered trip zones. Safety features include ECC on all flash, parity on RAM, critical register lock protection, and dual watchdog timers (one per subsystem).

Key Specifications

Pinout & Package

289-ball New Fine Pitch Ball Grid Array (nFBGA), 16.0 mm × 16.0 mm body size, 0.8 mm ball pitch, RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core real-time control applications.

Compared with F28M36H53B2ZWTQ, the F28M36H33B2ZWTQ removes Ethernet/USB to reduce cost and power while retaining identical real-time control capability; versus F28388D, it trades dual-C28x determinism for Arm-based protocol flexibility and simpler system architecture.

Availability

F28M36H33B2ZWTQ is available at Aetrix Electronics and suitable for industrial motor drives, solar string inverters, three-phase UPS systems, and AC-input BLDC motor drives requiring stable component supply across extended production lifecycles.

Supply support for F28M36H33B2ZWTQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets since 1930.

The F28M36x Concerto™ family was designed to unify communication and real-time control in single-chip solutions for power electronics, enabling safety-certifiable systems through hardware-enforced subsystem isolation and ECC/parity memory protection.

FAQ

What is the maximum operating frequency of the Cortex-M3 core in the F28M36H33B2ZWTQ?

The F28M36H33B2ZWTQ specifies a maximum Cortex-M3 core frequency of 100 MHz. This is a fixed speed grade for the H33B2 variant, distinct from the P63C2 (125 MHz) and H53B2 (100 MHz, with added Ethernet/USB). The 100 MHz operation ensures deterministic timing for communication stacks while maintaining integer clock ratio constraints with the 150 MHz C28x core.

Does the F28M36H33B2ZWTQ include Ethernet or USB peripherals?

No, the F28M36H33B2ZWTQ does not include Ethernet or USB peripherals. Unlike the F28M36H53B2ZWTQ variant, the H33B2 omits the 10/100 ENET 1588 MII and USB OTG FS modules to reduce cost and power consumption. Communication is supported via five UARTs, four SSIs/SPI, two I2Cs, and two CAN modules.

How much shared RAM is available in the F28M36H33B2ZWTQ?

The F28M36H33B2ZWTQ provides 0 KB of shared RAM. According to Table 3-1 in the SPRS825F datasheet, the H33B2 variant has "0" listed under Shared RAM (Parity) (KB), whereas P63C2/P53C2/H53B2 offer 64 KB. This eliminates potential memory contention but requires explicit IPC-based data exchange between subsystems using the dedicated 2KB message RAM.

What analog peripherals are integrated into the F28M36H33B2ZWTQ?

The F28M36H33B2ZWTQ integrates dual 12-bit analog-to-digital converters (ADCs) with up to 2.88 MSPS aggregate sampling rate and 24 total input channels, four sample-and-hold circuits, and six analog comparators each with a 10-bit integrated DAC. These resources support simultaneous current/voltage sensing and hardware-triggered fault responses in power conversion applications.

What is the package type and thermal specification for the F28M36H33B2ZWTQ?

The F28M36H33B2ZWTQ uses a 289-ball ZWT new fine-pitch ball grid array package (16.0 mm × 16.0 mm, 0.8 mm pitch) with a junction temperature range of –40°C to 105°C (T-grade). Its thermal resistance is θ_JA = 22.5°C/W for Revision A silicon, validated per JEDEC JESD51-2 standards, supporting convection-cooled industrial PCB layouts.