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Texas Instruments F28M36P63C2ZWTS

Part No.:
F28M36P63C2ZWTS
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
289-LFBGA
Datasheet:
AetrixF28M36P63C2ZWTS.pdf
Description:
IC MCU 32BIT 1MB FLASH 289NFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,724

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Product details

Overview

F28M36P63C2ZWTS from Texas Instruments is a dual-core Concerto™ microcontroller integrating an Arm® Cortex®-M3 (125 MHz) for communications and a TMS320C28x (150 MHz) for real-time control, with 1MB ECC flash, 128KB RAM (ECC/parity), dual 12-bit ADCs (2.88 MSPS), 12 ePWM modules, and 10/100 ENET 1588 MII - deployed in solar string inverters and industrial AC drive control modules.

For engineers reviewing the F28M36P63C2ZWTS datasheet, F28M36P63C2ZWTS pinout, F28M36P63C2ZWTS application, or F28M36P63C2ZWTS equivalent, key selection criteria include dual-core clock coordination (125/150 MHz max), IPC message RAM (2KB), shared 64KB parity RAM, ZWT nFBGA package (289-ball, 16×16 mm), and –40°C to 125°C junction temperature rating.

Technical Context

The F28M36P63C2ZWTS implements tightly coupled subsystems: the Master Subsystem (Cortex-M3) handles Ethernet 1588, USB OTG + PHY, dual CAN, five UARTs, and external peripheral interface (EPI); the Control Subsystem (C28x) executes high-precision motor control via 12 ePWMs (24 outputs, 16 high-resolution), six eCAPs, three eQEPs, and VCU-accelerated complex math. Both cores share analog resources and IPC messaging infrastructure.

Its clocking architecture supports dynamic PLL ratio changes, with strict integer divide constraints between C28x and ADC clocks (e.g., 150 MHz C28x → 2.88 MSPS ADC). Safety features include ECC on flash/RAM, dual security zones (128-bit password), NMI watchdogs per subsystem, and critical register lock protection - targeting industrial safety certification support.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Dual-core: Arm Cortex-M3 (125 MHz) + TMS320C28x (150 MHz), independent buses, shared memory and IPC
Memory 1MB ECC flash (Master), 512KB ECC flash (Control), 128KB RAM (ECC/parity), 64KB shared RAM (parity), 2KB IPC message RAM
Analog Subsystem Dual 12-bit ADCs (2.88 MSPS total, 24 channels, 4 S/H), six comparators with integrated 10-bit DACs
Control Peripherals 12 ePWM modules (24 outputs, 16 high-resolution), 6 eCAP, 3 eQEP, Viterbi/Complex Math/CRC Unit (VCU)
Communication Interfaces 10/100 ENET 1588 MII, USB OTG + PHY, 2× D_CAN, 5× UART, 4× SSI/SPI, 2× I²C, SCI, McBSP, EPI
Package & Temp 289-ball ZWT nFBGA (16.0 mm × 16.0 mm), –40°C to 125°C junction temperature (S-grade)
Power Domains 1.2-V digital core, 1.8-V analog, 3.3-V I/O; integrated 1.2-V and 1.8-V regulators from 3.3-V supply

Pinout & Package

289-ball ZWT New Fine Pitch Ball Grid Array (nFBGA), 16.0 mm × 16.0 mm body size, 0.8-mm ball pitch, bottom-side mounting. Thermal pad exposed on underside for enhanced heat dissipation in high-power industrial applications.

Pin/Terminal Circuit Role Design Meaning
VDD12 / VDD18 / VDDA / VDDIO Power supply inputs Separate 1.2-V digital core, 1.8-V analog, 3.3-V I/O domains; decoupling required per domain for noise isolation
VSS / VSSA / VSSOSC Ground returns Dedicated analog (VSSA), oscillator (VSSOSC), and digital (VSS) ground planes minimize coupling noise in mixed-signal operation
X1 / X2 Crytal oscillator terminals Supports external crystal (e.g., 20 MHz) for precise clock generation; internal oscillator also available
ADC1INA0–ADC1INB7 / ADC2INA0–ADC2INB7 Analog input channels 24 total ADC inputs across two 12-channel 12-bit converters; differential or single-ended acquisition supported
GPIO0–GPIO142 Programmable I/O 142 multiplexed, glitch-free GPIOs with configurable pull-up/down; many support peripheral functions (ePWM, eCAP, etc.)
EMU0 / EMU1 / TCK / TMS / TDI / TDO / TRST JTAG debug interface IEEE 1149.1-compliant boundary scan and emulation; enables real-time debugging of both Cortex-M3 and C28x cores

Key Features

Feature Design Value
Dual-core IPC infrastructure 32 handshaking channels + 4 IPC interrupt-capable channels coordinate data transfer through dedicated 2KB message RAM
Real-time control acceleration VCU unit offloads Viterbi decoding, 16-bit FFTs, and CRC computation - reducing C28x CPU load in motor control algorithms
High-resolution PWM timing 16 HRPWM outputs with sub-nanosecond resolution enable precise dead-time insertion and phase-shifted topologies in inverters
Industrial Ethernet readiness Integrated 10/100 ENET 1588 MII with hardware timestamping supports deterministic communication in distributed drive systems
Functional safety enablers ECC on all flash and critical RAM, dual security zones, NMI watchdogs per subsystem, and register lock protection aid IEC 61508 SIL-2 compliance

Applications

Solar String Inverter Industrial AC Drive Control

Use Scenario: Distributed photovoltaic array with per-string MPPT and grid-synchronized DC-AC conversion.

IC Role / Device Role / Timing Role: F28M36P63C2ZWTS manages MPPT algorithm (C28x), grid synchronization (ENET 1588), and communication (CAN/USB) in one chip.

Use Value: Dual-core separation eliminates inter-core latency; 2.88 MSPS ADC captures fast current transients during fault conditions.

Use Scenario: Closed-loop vector-controlled induction motor drive with field-oriented control and safety monitoring.

IC Role / Device Role / Timing Role: C28x executes FOC loop at 150 MHz with 12 ePWMs driving 3-phase IGBT gate drivers; Cortex-M3 handles EtherCAT master stack.

Use Value: Shared 64KB RAM stores real-time torque/current waveforms; VCU accelerates Clarke/Park transforms.

Three-Phase UPS System BLDC Motor Drive Module

Use Scenario: Online double-conversion UPS with battery management, inverter control, and remote monitoring.

IC Role / Device Role / Timing Role: F28M36P63C2ZWTS runs inverter modulation (C28x), battery SOC estimation (Cortex-M3), and SNMP/Modbus TCP (Ethernet).

Use Value: 1MB ECC flash stores dual firmware images; dual watchdogs ensure fail-safe switchover during brownouts.

Use Scenario: High-efficiency BLDC drive for HVAC compressors with sensorless commutation and thermal derating.

IC Role / Device Role / Timing Role: C28x performs back-EMF sensing and 6-step commutation; Cortex-M3 logs runtime diagnostics and communicates via UART/USB.

Use Value: Six comparators with DACs enable fast overcurrent trip (<100 ns response to GPIO); 125°C rating supports compact heatsink designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core real-time control applications.

Alternative Part Technical Difference Application Difference Selection Advice
F28M36P53C2ZWTS Same package and temp grade, but 512KB Master flash (vs. 1MB), no ENET 1588 or USB OTG Suitable for cost-sensitive drives without Ethernet or USB host requirements Select when Ethernet/USB are unnecessary and flash headroom >512KB suffices
TMS320F28388D Dual C28x cores (no Arm), 2MB flash, EtherCAT, but no ENET 1588 or shared RAM architecture Better for pure motor control with EtherCAT; lacks integrated communication subsystem Choose when EtherCAT is mandatory and Arm-based protocol stacks are not needed

Compared with F28M36P53C2ZWTS and TMS320F28388D, the F28M36P63C2ZWTS uniquely balances high-speed real-time control (150 MHz C28x + VCU) with robust connectivity (ENET 1588, USB OTG, dual CAN), making it optimal for systems requiring synchronized communication and deterministic control in a single SoC.

Availability

F28M36P63C2ZWTS is available at Aetrix Electronics and suitable for solar inverters, industrial AC drives, and three-phase UPS systems requiring stable component supply across extended product lifecycles.

Supply support for F28M36P63C2ZWTS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of industrial MCU innovation.

The F28M36x Concerto™ family was designed to unify communication and real-time control in single-chip solutions for energy conversion, motion control, and industrial automation - eliminating inter-processor bottlenecks while enabling functional safety certification.

FAQ

What is the maximum operating temperature range for the F28M36P63C2ZWTS?

The F28M36P63C2ZWTS is rated for –40°C to 125°C junction temperature (S-grade), validated per TI's thermal resistance specifications for the ZWT package. This enables deployment in high-ambient environments such as enclosed motor drives and outdoor solar inverters without derating. The device integrates on-chip thermal monitoring circuitry and supports software-triggered shutdown via the C28x or Cortex-M3 subsystems. F28M36P63C2ZWTS operates reliably under continuous thermal stress within this range when PCB layout follows TI's recommended copper pour and via guidelines.

Does the F28M36P63C2ZWTS support pin-compatible migration from other Concerto devices?

No - the F28M36P63C2ZWTS uses the 289-ball ZWT nFBGA package, which is mechanically identical across the F28M36x series (e.g., F28M36P53C2ZWTS, F28M36H53B2ZWT), but electrical compatibility requires verification. While pinout is shared, differences in peripheral enablement (e.g., ENET 1588 present only in P63/P53 variants) and flash/RAM mapping mean direct PCB reuse is not guaranteed. F28M36P63C2ZWTS requires explicit validation of signal routing for unused pins and power domain sequencing per the device-specific datasheet.

How does the IPC mechanism work between the Cortex-M3 and C28x subsystems in the F28M36P63C2ZWTS?

The F28M36P63C2ZWTS implements a hardware-accelerated Interprocessor Communication (IPC) system with 32 handshaking channels and dedicated 2KB message RAM (1KB CTOM, 1KB MTOC). Each subsystem accesses its own message RAM segment via AXI/AHB bus; IPC interrupts trigger on channel assertion. Software uses TI's IPC library to manage mailbox-style transfers, semaphore synchronization, and data coherency - enabling deterministic, low-latency coordination (e.g., C28x sends PWM update flags, Cortex-M3 responds with new reference values). F28M36P63C2ZWTS supports both polling and interrupt-driven IPC modes.

Can the F28M36P63C2ZWTS ADCs operate simultaneously at full speed?

Yes - the F28M36P63C2ZWTS supports concurrent sampling of both 12-bit ADC modules at up to 2.88 MSPS aggregate rate (1.44 MSPS per ADC), provided the C28x clock is set to 150 MHz and the ADC clock divider maintains an integer ratio. Each ADC has independent sample-and-hold circuits and conversion pipelines, allowing interleaved or synchronized acquisition across all 24 channels. F28M36P63C2ZWTS includes hardware triggers from ePWM timers and GPIOs to precisely align sampling with power stage switching events.

What safety certifications does the F28M36P63C2ZWTS support out-of-the-box?

The F28M36P63C2ZWTS includes hardware features aligned with IEC 61508 SIL-2 and ISO 13849 PL d requirements: ECC on flash/RAM, parity on critical RAM, dual NMI watchdogs (one per subsystem), register lock protection, and secure boot with 128-bit password zones. However, system-level certification requires external validation - TI provides safety manuals, FMEDA reports, and diagnostic software libraries. F28M36P63C2ZWTS itself is not pre-certified; its safety value lies in enabling certified system designs when integrated per TI's functional safety documentation.

F28M36P63C2ZWTS Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
289-LFBGA
Series:
C2000™ C28x + ARM® Cortex® M3 Concerto™
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
125MHz/150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, McBSP, SCI, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
142
Program Memory Size:
512KB/1MB
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
232KB
Voltage - Supply (Vcc/Vdd):
1.14V ~ 3.63V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

F28M36P63C2ZWTS FAQ

1.How can I place an order for F28M36P63C2ZWTS through Aetrix?

Please submit a Request for Quotation (RFQ) for F28M36P63C2ZWTS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of F28M36P63C2ZWTS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for F28M36P63C2ZWTS is usually 5 days.

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F28M36P63C2ZWTS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for F28M36P63C2ZWTS?

For technical support, including F28M36P63C2ZWTS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your F28M36P63C2ZWTS requirements.

6.How does Aetrix verify that F28M36P63C2ZWTS is sourced from the original manufacturer or authorized distributors?

All F28M36P63C2ZWTS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that F28M36P63C2ZWTS meets industry standards.

7.What is the process for return or replacement of F28M36P63C2ZWTS?

All F28M36P63C2ZWTS units undergo pre-shipment inspection (PSI). If there is an issue with F28M36P63C2ZWTS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The F28M36P63C2ZWTS part is unused and in its original packaging.

Return procedure for F28M36P63C2ZWTS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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