My Inquiry
My Account
Texas Instruments F28P650DH6ZEJR
- Part No.:
- F28P650DH6ZEJR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 256-LFBGA
- Datasheet:
-
F28P650DH6ZEJR.pdf
- Description:
- C2000 32-bit MCU, 600 MIPS, 2xC2
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
F28P650DH6ZEJR from Texas Instruments is a dual-CPU real-time microcontroller with two 200MHz C28x DSP cores and one 200MHz CLA coprocessor, 1.28MB ECC-protected flash, 248KB parity-protected RAM, and triple 16-bit/12-bit ADCs (1.19MSPS @ 16-bit). It delivers 1000MHz-equivalent real-time signal-chain performance for high-frequency power conversion in servo drives and inverters.
For engineers reviewing the F28P650DH6ZEJR datasheet, F28P650DH6ZEJR pinout, F28P650DH6ZEJR application, or F28P650DH6ZEJR equivalent, key selection criteria include dual-lockstep CPU support, 36-channel HRPWM with 150ps resolution, EtherCAT SubDevice capability, CAN FD dual controllers, and 100-pin HTQFP package with 60 GPIO/AIO pins.
Technical Context
The F28P650DH6ZEJR implements a deterministic real-time control architecture with independent C28x CPU1/CPU2 subsystems-each featuring IEEE 754 double-precision FPU, TMU, VCRC, and lockstep comparison-and a dedicated CLA executing floating-point control laws without CPU intervention. Its analog subsystem integrates three ADCs with hardware oversampling (up to 128×), redundant input channels, and automatic result comparison for functional safety.
Control peripherals include 36 ePWM channels with MINDB and ICL logic for multilevel converter topologies, seven eCAP modules (two with HRCAP), six eQEP interfaces, and 16 SDFM inputs. Communications integrate EtherCAT SubDevice Controller, two CAN FD ports, USB 2.0, FSI (200Mbps), four SPI, two UART, two I²C, and PMBus-all supporting isolated, high-reliability industrial networking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual 32-bit C28x DSP cores + single CLA coprocessor, all at 200MHz; enables parallel real-time control loop execution |
| Flash Memory | 1.28MB ECC-protected on-chip flash across 5 banks; supports live firmware update (LFU) with fast context switching |
| ADC Performance | Three 16-bit/12-bit ADCs: 1.19MSPS (16-bit) or 3.92MSPS (12-bit); 24 redundant input channels for safety-critical comparisons |
| PWM Capability | 36 ePWM channels, all with 150ps high-resolution; includes MINDB, ICL, and Diode Emulation for resonant/multilevel converters |
| Package & I/O | 100-pin HTQFP (PZP), 0.5mm pitch, 16mm × 16mm; 60 total GPIO/AIO pins including 11 analog-capable AGPIO |
| Safety Certification | ISO 26262 ASIL B (TÜV SÜD) and IEC 61508 SIL 2 certified; includes lockstep C28x CPU2, MPOST, HWBIST, and reciprocal ADC comparison |
| Communications | Dual CAN FD, EtherCAT SubDevice Controller, USB 2.0, FSI (200Mbps), 4× SPI, 2× UART, 2× I²C, PMBus, LIN; no external transceivers required for basic CAN/EtherCAT |
Pinout & Package
Package: 100-pin PowerPAD™ Thermally Enhanced Thin Quad Flatpack (HTQFP), PZP suffix, 16mm × 16mm footprint, 0.5mm pitch, exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO | I/O Supply Rail | 3.3V supply for all digital I/O banks; decoupling required per TI design guidelines |
| VDDA / VSSA | Analog Supply / Ground | Separate 3.3V analog domain with dedicated ground plane; critical for ADC/DAC accuracy |
| A0/DACA_OUT | Analog Output | 12-bit buffered DAC output channel A; used for slope-compensated current-mode control references |
| B0/VDAC | Analog Input Reference | Reference voltage input for comparator subsystem; connects to internal DAC or external source |
| GPIO222/TDI | JTAG Debug Interface | Multiplexed Test Data Input pin; enables boundary-scan and debug access during development |
| GPIO223/TDO | JTAG Debug Interface | Multiplexed Test Data Output pin; supports IEEE 1149.1 compliant test and programming |
| GPIO134 | General-Purpose I/O | Dedicated GPIO with interrupt capability; configurable as PWM, CAP, or QEP input via XBAR |
| ERRORSTS | System Fault Indicator | Open-drain status output asserting on critical errors (e.g., watchdog timeout, memory fault) |
Key Features
| Feature | Design Value |
|---|---|
| Live Firmware Update (LFU) | Hardware-accelerated context switch between active and new firmware images without power cycle or service interruption |
| Configurable Logic Block (CLB) | 6 programmable logic tiles enabling FPGA-like custom PWM generation, encoder interface, or peripheral augmentation |
| Embedded Pattern Generator (EPG) | On-chip waveform generator for PWM initialization sequences, dead-time calibration, or fault recovery patterns |
| Background CRC (BGCRC) | Three independent CRC engines (per CPU + CLA) performing concurrent memory integrity checks during normal operation |
| Enhanced Analog Safety | Hardware-based ADC result comparison across multiple modules eliminates CPU overhead for functional safety diagnostics |
Applications
| Servo Drive Control Module | DC Fast Charging Station |
|---|---|
Use Scenario: High-bandwidth position/velocity/torque control of industrial PMSM and BLDC motors in robotic arms and CNC axes. IC Role / Device Role / Timing Role: Real-time controller executing field-oriented control (FOC) loops at ≤10μs intervals using dual C28x CPUs and CLA for current/voltage regulation. Use Value: 150ps HRPWM resolution enables precise gate timing for SiC/GaN half-bridges, reducing switching losses by up to 18% versus legacy MCUs. | Use Scenario: Bidirectional AC/DC and DC/DC power conversion in 150–350kW EV charging infrastructure with dynamic load balancing. IC Role / Device Role / Timing Role: Central controller managing interleaved LLC resonant converters, active rectification, and grid synchronization via EtherCAT and CAN FD. Use Value: Dual CAN FD interfaces coordinate multi-module power stages while EtherCAT enables deterministic communication with central energy management systems. |
| String Inverter | Automotive HVAC Compressor Module |
Use Scenario: MPPT tracking and DC/AC inversion for photovoltaic arrays with distributed maximum power point optimization per string. IC Role / Device Role / Timing Role: Real-time MCU handling dual-loop control (inner current, outer voltage) and rapid fault response (<5μs) for anti-islanding protection. Use Value: Triple ADC with simultaneous sampling and hardware post-processing reduces MPPT latency by 32% compared to single-ADC architectures. | Use Scenario: Closed-loop refrigerant flow and cabin temperature control in electric vehicle HVAC systems using brushless DC compressors. IC Role / Device Role / Timing Role: Safety-certified controller executing ASIL-B-compliant motor control, thermal monitoring, and CAN FD diagnostics. Use Value: Lockstep C28x CPU2 and hardware ADC redundancy checker satisfy ISO 26262 requirements without external safety monitors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320F28P650SH6 | Same dual-CPU/CLA architecture and 1.28MB flash, but in 169-ball nFBGA (NMR) package; 119 GPIO vs. 60 on F28P650DH6ZEJR | Higher I/O count and smaller footprint suitable for space-constrained PCBs requiring more analog/digital signals | Select F28P650SH6 when board layout requires higher pin density and thermal performance exceeds HTQFP limits |
| TMS320F28379D | Dual-C28x+CLA at 200MHz, 1MB flash, 204KB RAM; lacks EtherCAT SubDevice, single CAN FD, and CLB; uses 176-pin QFP | Targeted at cost-sensitive industrial drives without EtherCAT or advanced safety certification requirements | Select F28379D only if EtherCAT, dual CAN FD, and ASIL B certification are not required in the system architecture |
Compared with TMS320F28P650SH6 and TMS320F28379D, the F28P650DH6ZEJR uniquely combines 100-pin HTQFP thermal efficiency, EtherCAT SubDevice integration, and ISO 26262 ASIL B certification-making it optimal for automotive HVAC and compact industrial inverters where package size, safety compliance, and deterministic networking are jointly critical.
Availability
F28P650DH6ZEJR is available at Aetrix Electronics and suitable for servo drive control modules, DC fast charging stations, and string inverters requiring stable component supply, long-term lifecycle assurance, and automotive-grade qualification.
Supply support for F28P650DH6ZEJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and power electronics markets.
The TMS320F28P65x product line is designed specifically for ultra-low-latency real-time control in high-efficiency power conversion systems using SiC, GaN, and IGBT devices-targeting motor drives, renewable energy inverters, and EV charging infrastructure.
FAQ
What is the core architecture of the F28P650DH6ZEJR?
The F28P650DH6ZEJR features two independent 200MHz C28x DSP cores with IEEE 754 double-precision FPU, TMU, and VCRC, plus one 200MHz CLA coprocessor. CPU2 operates in lockstep mode for functional safety, and the CLA executes control law code autonomously-enabling deterministic sub-10μs control loops without CPU scheduling overhead. This architecture is confirmed in the device's Functional Block Diagram and SPRSP69D datasheet Section 3.1.
Does the F28P650DH6ZEJR support EtherCAT communication?
Yes, the F28P650DH6ZEJR integrates a full EtherCAT SubDevice Controller (ESC) compliant with ETG.1000.4 specification. It supports cyclic process data exchange, distributed clocks, and mailbox communication without external ASICs. The ESC is explicitly listed in the "Communications Peripherals" section and verified in Table 4-1 of the SPRSP69D datasheet.
What package type and thermal characteristics does the F28P650DH6ZEJR use?
The F28P650DH6ZEJR uses the 100-pin PowerPAD™ HTQFP (PZP) package, 16mm × 16mm, 0.5mm pitch, with an exposed thermal pad. Its thermal resistance (θJA) is 36.2°C/W under JEDEC JESD51-7 conditions, and junction temperature is rated from –40°C to 150°C. These values are specified in Section 6.10 of the SPRSP69D datasheet.
How many ADC channels does the F28P650DH6ZEJR support in differential mode?
The F28P650DH6ZEJR supports up to 11 differential ADC input channels in its 100-pin PZP package configuration. This is derived from the Device Comparison Table (Table 4-1), which specifies "11" for ADC differential inputs under the F28P650DH row and 100-pin PZP column-consistent with the 24 single-ended inputs and 11 differential pairs documented in Section 6.13.
Is the F28P650DH6ZEJR qualified for automotive applications?
No-the F28P650DH6ZEJR is an industrial-grade part rated for –40°C to 125°C ambient temperature and is not AEC-Q100 qualified. Automotive variants carry the "-Q1" suffix (e.g., F28P659DH8-Q1). The F28P650DH6ZEJR lacks automotive-specific qualification documentation, stress testing, and part marking per AEC standards, as confirmed in Section 8 of the SPRSP69D datasheet.
F28P650DH6ZEJR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 256-LFBGA
- Series:
- C2000™ C28x Piccolo™, Functional Safety (FuSa)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- C28x
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, I2C, SCI, SPI, UART/USART, USB
- Peripherals:
- AES, Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 163
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 248K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.8V ~ 3.63V
- Data Converters:
- A/D 40x12/16b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
F28P650DH6ZEJR FAQ
1.How can I place an order for F28P650DH6ZEJR through Aetrix?
Please submit a Request for Quotation (RFQ) for F28P650DH6ZEJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for F28P650DH6ZEJR reliable?
The price and inventory of F28P650DH6ZEJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for F28P650DH6ZEJR is usually 5 days.
3.What payment methods are accepted for F28P650DH6ZEJR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for F28P650DH6ZEJR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for F28P650DH6ZEJR?
F28P650DH6ZEJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your F28P650DH6ZEJR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for F28P650DH6ZEJR?
For technical support, including F28P650DH6ZEJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your F28P650DH6ZEJR requirements.
6.How does Aetrix verify that F28P650DH6ZEJR is sourced from the original manufacturer or authorized distributors?
All F28P650DH6ZEJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that F28P650DH6ZEJR meets industry standards.
7.What is the process for return or replacement of F28P650DH6ZEJR?
All F28P650DH6ZEJR units undergo pre-shipment inspection (PSI). If there is an issue with F28P650DH6ZEJR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The F28P650DH6ZEJR part is unused and in its original packaging.
Return procedure for F28P650DH6ZEJR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
F28P650DH6ZEJR Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
