Texas Instruments F28P650DK8ZEJR
- Part No.:
- F28P650DK8ZEJR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 256-LFBGA
- Datasheet:
-
F28P650DK8ZEJR.pdf
- Description:
- C2000 32-bit MCU, 2x C28x+CLA C
- Quantity:
- Payment:

- Shipping:

Inventory:950
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Product details
Overview
TMS320F28P650DK8ZEJR from Texas Instruments is a dual-C28x DSP + CLA real-time microcontroller for high-precision power electronics control, featuring 200MHz C28x CPUs (CPU1 and CPU2), IEEE 754 double-precision FPU, 1.28MB ECC-protected flash, 248KB parity-protected RAM, and 36 HRPWM channels with 150ps resolution - deployed in servo drives, string inverters, and EV DC fast charging stations.
For engineers reviewing the TMS320F28P650DK8ZEJR datasheet, TMS320F28P650DK8ZEJR pinout, TMS320F28P650DK8ZEJR application, or TMS320F28P650DK8ZEJR equivalent, this page delivers verified specifications, package mapping to 256-ball nFBGA (ZEJ), functional safety compliance (ISO 26262 ASIL B, IEC 61508 SIL 2), EtherCAT SubDevice support, and CAN FD dual-controller capability - all confirmed against TI SPRSP69D (Rev. August 2025).
Technical Context
The TMS320F28P650DK8ZEJR implements lockstep operation on C28x CPU2 for functional safety, with hardware redundancy checking across ADC conversions and dual-clock comparator (DCC) for clock fault detection. Its Control Law Accelerator (CLA) runs IEEE 754 single-precision code independently at 200MHz, offloading real-time control law execution from CPU1.
It integrates three 16-bit/12-bit ADCs (1.19MSPS @16-bit, 3.92MSPS @12-bit), 11 windowed comparators with slope-compensated DAC references, and six Configurable Logic Block (CLB) tiles enabling FPGA-like logic for encoder interfaces or custom PWM generation - all tightly coupled to the ePWM and eCAP subsystems for deterministic timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual 32-bit C28x DSP cores + one CLA CPU, all at 200MHz - enables parallel real-time signal processing and independent control law execution. |
| Flash Memory | 1.28MB ECC-protected CPU-mappable flash across 5 banks - supports robust firmware updates and safe code partitioning. |
| Analog Inputs | Up to 40 single-ended or 19 differential ADC inputs with simultaneous sampling via separate S/H - critical for multi-phase motor current sensing. |
| PWM Capability | 36 ePWM channels, all with 150ps high-resolution mode and MINDB/ICL logic - enables precise dead-time control for SiC/GaN half-bridge and multilevel topologies. |
| Safety Certification | ISO 26262 certified up to ASIL B (TÜV SÜD), IEC 61508 up to SIL 2 - validated hardware features include lockstep CPU2, MPOST, HWBIST, and reciprocal ADC comparison. |
| Communication Interfaces | 2× CAN FD, 1× EtherCAT SubDevice Controller, 4× SPI, 2× UART, 2× I²C, USB 2.0, FSI (200Mbps) - supports deterministic industrial networking and isolated high-speed data exchange. |
| Package & Thermal | 256-ball nFBGA (ZEJ), 13mm × 13mm, 0.8mm pitch - qualified for –40°C to 125°C ambient operation with thermal resistance θJA = 24.5°C/W. |
Pinout & Package
Package: 256-ball New Fine Pitch Ball Grid Array (nFBGA), ZEJ suffix, 13mm × 13mm footprint, 0.8mm ball pitch, lead-free and green compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog Power / Ground | Separate 3.3V analog supply domain with dedicated ground - isolates noise-sensitive ADC/DAC reference paths. |
| A0/DACA_OUT | Analog Output | Buffered 12-bit DAC output channel A - used for slope compensation in peak/valley current-mode control loops. |
| B0/VDAC | Analog Reference Input | Reference voltage input for DAC B - enables programmable comparator thresholds with temperature compensation. |
| GPIO126–GPIO134 | Multiplexed Digital I/O | Configurable as ePWM, eCAP, or CLB interface pins - supports dynamic peripheral routing without external glue logic. |
| TCK / TDO / TDI / TMS | JTAG Debug Interface | IEEE 1149.1-compliant boundary-scan and debug access - required for secure JTAGLOCK-enabled development and production programming. |
Key Features
| Feature | Design Value |
|---|---|
| Triple ADC with Hardware Oversampling | Up to 128× hardware oversampling with accumulation/averaging - reduces CPU load and improves SNR for motor phase current measurement. |
| Embedded Pattern Generator (EPG) | Generates complex PWM patterns (e.g., 5-level NPC, matrix converter gating) directly in hardware - eliminates software timing jitter in resonant converters. |
| Live Firmware Update (LFU) | Hardware-accelerated context switch between old and new firmware images - enables zero-downtime field updates in mission-critical UPS and EV charging systems. |
| Dual CAN FD Controllers | Independent flexible data-rate CAN interfaces supporting 5Mbps payloads - meets automotive and industrial network bandwidth requirements for distributed motor control. |
| Configurable Logic Block (CLB) | 6 logic tiles with XBAR interconnect - implements custom encoder decoding, dead-time insertion, or protection logic without FPGA or CPLD. |
Applications
| Servo Drive Control Module | String Inverter |
|---|---|
Use Scenario: High-bandwidth position and torque control of PMSM/BLDC motors in industrial robots and CNC machines. IC Role / Device Role / Timing Role: Real-time execution of field-oriented control (FOC) loops at ≤1μs latency using dual C28x + CLA, synchronized to 36-channel HRPWM outputs. Use Value: 150ps PWM resolution enables <1ns dead-time accuracy for SiC-based servo drives, reducing switching losses by up to 18% versus legacy MCUs. | Use Scenario: MPPT and grid-synchronization control in photovoltaic string inverters with rapid partial-shading response. IC Role / Device Role / Timing Role: Simultaneous execution of dual ADC sampling (3× 16-bit @1.19MSPS), fast Fourier transform (FFT) on CLA, and grid-tie PWM modulation on ePWM. Use Value: Hardware CRC and BGCRC ensure firmware integrity during over-the-air updates; dual CAN FD enables module-level diagnostics and firmware distribution across 20+ strings. |
| DC Fast Charging Station | Automotive HVAC Compressor Module |
Use Scenario: Bidirectional AC/DC and DC/DC conversion control in 150kW+ EV charging infrastructure with liquid-cooled power stages. IC Role / Device Role / Timing Role: Coordinated control of interleaved totem-pole PFC and CLLC resonant DC/DC stages using EPG-generated gate patterns and CLB-based protection logic. Use Value: Lockstep CPU2 and reciprocal ADC comparison satisfy ASIL B requirements for charger safety monitoring without external watchdog ICs. | Use Scenario: Variable-speed compressor control in electric vehicle HVAC systems with refrigerant pressure and cabin temperature feedback. IC Role / Device Role / Timing Role: Execution of sensor fusion (ADC + internal temp sensor), PID-based speed regulation, and CAN FD communication with vehicle body controller. Use Value: Integrated 12-bit DACs with slope compensation enable stable valley-current mode control under wide input voltage transients (9–16V battery range). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320F28379D | Single C28x+CLA subsystem (400 MIPS total), 1MB flash, no EtherCAT, no lockstep CPU2, 176-pin PTP package. | Lacks ISO 26262 ASIL B certification and dual-CPU lockstep - suitable for non-safety-critical industrial motor drives only. | Select when cost sensitivity outweighs functional safety requirements and EtherCAT is not needed. |
| TMS320F28P650DK9ZEJR | Identical package and peripherals, but includes EtherCAT SubDevice Controller enabled - same 1.28MB flash, dual lockstep CPUs, and safety certifications. | Required where real-time deterministic motion control over EtherCAT is mandatory (e.g., collaborative robot joints). | Choose over TMS320F28P650DK8ZEJR only if EtherCAT integration is essential for system architecture. |
Compared with TMS320F28P650DK9ZEJR, the TMS320F28P650DK8ZEJR omits EtherCAT but retains identical safety, analog, and PWM capabilities - making it optimal for CAN FD–based distributed control. Versus TMS320F28379D, it delivers higher safety assurance and broader connectivity at the cost of package size and toolchain maturity.
Availability
TMS320F28P650DK8ZEJR is available at Aetrix Electronics and suitable for servo drive control modules, string inverters, and DC fast charging stations requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.
Supply support for TMS320F28P650DK8ZEJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies with over 50 years of innovation in industrial and automotive electronics.
The TMS320F28P650DK8ZEJR belongs to TI's C2000™ real-time MCU family, engineered specifically for ultra-low-latency power electronics control - targeting high-switching-frequency applications using SiC, GaN, and IGBT devices in motor drives, renewable energy, and EV infrastructure.
FAQ
What is the core architecture of the TMS320F28P650DK8ZEJR?
The TMS320F28P650DK8ZEJR integrates two 32-bit C28x DSP CPUs and one Control Law Accelerator (CLA) CPU, all operating at 200MHz. It includes IEEE 754 double-precision FPU on each C28x core, TMU, VCRC, and lockstep capability on CPU2. This architecture delivers 600 MIPS total processing power and is optimized for deterministic real-time control loops in power electronics - a key differentiator of the TMS320F28P650DK8ZEJR.
Does the TMS320F28P650DK8ZEJR support functional safety standards?
Yes, the TMS320F28P650DK8ZEJR is ISO 26262 certified up to ASIL B and IEC 61508 certified up to SIL 2 by TÜV SÜD. It includes hardware safety features such as lockstep C28x CPU2, memory power-on self-test (MPOST), hardware built-in self-test (HWBIST), reciprocal ADC comparison, and dual-clock comparator - all documented in TI's Industrial and Automotive Functional Safety manuals for the TMS320F28P650DK8ZEJR.
What package type does the TMS320F28P650DK8ZEJR use?
The TMS320F28P650DK8ZEJR uses a 256-ball New Fine Pitch Ball Grid Array (nFBGA) package with ZEJ suffix, measuring 13mm × 13mm with 0.8mm ball pitch. This package is lead-free, green-compliant, and thermally rated for –40°C to 125°C ambient operation. Pin assignments and ball maps for the TMS320F28P650DK8ZEJR are defined in TI's SPRSP69D datasheet Section 5.1.
How many ADC channels does the TMS320F28P650DK8ZEJR support?
The TMS320F28P650DK8ZEJR integrates three configurable 16-bit/12-bit Analog-to-Digital Converters (ADCs), supporting up to 40 single-ended or 19 differential input channels. Each ADC has dedicated sample-and-hold circuitry for simultaneous sampling, hardware oversampling (up to 128×), and automatic result comparison - all confirmed in the TMS320F28P650DK8ZEJR device comparison table (Table 4-1) and analog subsystem description.
Is EtherCAT supported on the TMS320F28P650DK8ZEJR?
No, EtherCAT SubDevice Controller functionality is disabled on the TMS320F28P650DK8ZEJR. It is enabled only on variants with "9" or "7" suffixes (e.g., TMS320F28P650DK9ZEJR). The TMS320F28P650DK8ZEJR retains all other communications peripherals - including 2× CAN FD, 4× SPI, 2× I²C, USB 2.0, and FSI - making it ideal for CAN-based distributed control architectures where EtherCAT is not required.
F28P650DK8ZEJR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 256-LFBGA
- Series:
- C2000™ C28x Piccolo™, Functional Safety (FuSa)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- C28x
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, I2C, SCI, SPI, UART/USART, USB
- Peripherals:
- AES, Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 163
- Program Memory Size:
- 1.28MB (1.28M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 248K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.8V ~ 3.63V
- Data Converters:
- A/D 40x12/16b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
F28P650DK8ZEJR FAQ
1.How can I place an order for F28P650DK8ZEJR through Aetrix?
Please submit a Request for Quotation (RFQ) for F28P650DK8ZEJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for F28P650DK8ZEJR reliable?
The price and inventory of F28P650DK8ZEJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for F28P650DK8ZEJR is usually 5 days.
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Once your F28P650DK8ZEJR order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for F28P650DK8ZEJR?
For technical support, including F28P650DK8ZEJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your F28P650DK8ZEJR requirements.
6.How does Aetrix verify that F28P650DK8ZEJR is sourced from the original manufacturer or authorized distributors?
All F28P650DK8ZEJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that F28P650DK8ZEJR meets industry standards.
7.What is the process for return or replacement of F28P650DK8ZEJR?
All F28P650DK8ZEJR units undergo pre-shipment inspection (PSI). If there is an issue with F28P650DK8ZEJR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The F28P650DK8ZEJR part is unused and in its original packaging.
Return procedure for F28P650DK8ZEJR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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