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Texas Instruments F28P650DK9ZEJ
- Part No.:
- F28P650DK9ZEJ
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 256-LFBGA
- Datasheet:
-
F28P650DK9ZEJ.pdf
- Description:
- 32-BIT MCU 2X C28X+CLA
- Quantity:
- Payment:
- Shipping:
Inventory:4,237
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Product details
Overview
TMS320F28P650DK9ZEJ from Texas Instruments is a dual-C28x DSP + CLA real-time microcontroller for high-precision power electronics control, featuring 200MHz C28x CPUs (lockstep enabled), IEEE 754 double-precision FPU, 1.28MB ECC-protected flash, 248KB parity-protected RAM, and 36 HRPWM channels with 150ps resolution - deployed in servo drives, string inverters, and EV DC fast chargers.
For engineers reviewing the TMS320F28P650DK9ZEJ datasheet, TMS320F28P650DK9ZEJ pinout, TMS320F28P650DK9ZEJ application, or TMS320F28P650DK9ZEJ equivalent, this page delivers verified technical context, package-specific pin mapping, functional safety architecture (ASIL B/SIL 2 certified), EtherCAT SubDevice support, and validated alternative options for industrial motor control and digital power designs.
Technical Context
The TMS320F28P650DK9ZEJ implements a dual-C28x DSP subsystem with lockstep comparison on CPU2 and independent CLA execution at 200MHz, delivering 600 MIPS total processing capability. Its analog subsystem integrates three 16-bit/12-bit ADCs (1.19 MSPS @ 16-bit), 11 windowed comparators with slope-compensated DAC references, and hardware oversampling up to 128× with outlier rejection.
Control peripherals include 36 HRPWM channels with MINDB and ICL logic for multilevel converter support, six eQEP modules, 16 SDFM inputs, and a Configurable Logic Block with six logic tiles for FPGA-like peripheral augmentation. Communications include two CAN FD controllers, EtherCAT SubDevice Controller, USB 2.0, FSI (200Mbps), and PMBus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual 32-bit C28x DSP cores + CLA coprocessor, all at 200MHz; lockstep enabled on CPU2 for ASIL B functional safety compliance. |
| Flash / RAM | 1.28MB ECC-protected flash across 5 banks; 248KB RAM (104KB dedicated + 64KB local shared + 80KB global shared) with enhanced parity protection. |
| Analog Subsystem | Three 16-bit/12-bit ADCs (1.19 MSPS / 3.92 MSPS); 40 single-ended or 19 differential inputs; hardware post-processing, oversampling (up to 128×), and automatic result comparison. |
| PWM & Control | 36 ePWM channels, all with 150ps high-resolution capability; MINDB and Illegal Combo Logic (ICL) for resonant/multilevel topologies without external logic. |
| Communications | Two CAN FD interfaces, EtherCAT SubDevice Controller, USB 2.0 (MAC+PHY), FSI (200Mbps), four SPI, two UART, two I²C, PMBus, and LIN. |
| Safety & Security | ISO 26262 ASIL B and IEC 61508 SIL 2 certified; JTAGLOCK, zero-pin boot, dual-zone security, AES-128/192/256 accelerator, and ERAD diagnostic unit. |
Pinout & Package
Package: 256-ball New Fine Pitch Ball Grid Array (nFBGA), ZEJ suffix, 13mm × 13mm, 0.8mm pitch, lead-free/green compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power supply / ground | Separate 3.3V analog domain with dedicated low-noise reference pins (VREFHIA/VREFLOA) for ADC/DAC accuracy. |
| A0/DACA_OUT | Analog output | First buffered 12-bit DAC output channel, usable for peak current mode control or reference generation. |
| B0/VDAC / B1/DACC_OUT | Analog output | Second and third DAC outputs; B1 supports slope compensation for valley current mode control in resonant converters. |
| A9–A15, B10–B15, C2–C13 | GPIO / peripheral multiplexing | 185 individually programmable GPIOs including 22 AGPIOs shared with ADC inputs and 18 AIOs - configurable for ePWM, eCAP, eQEP, or CLB interface. |
| TCK/TMS/TDO/TDI | JTAG debug interface | IEEE 1149.1-compliant boundary-scan and emulation interface; supports secure JTAGLOCK disable. |
| VDDIO / VSS | I/O power domain | 3.3V tolerant I/O bank supporting mixed-voltage interfacing with external FPGAs, ASICs, or isolated gate drivers. |
Key Features
| Feature | Design Value |
|---|---|
| Live Firmware Update (LFU) | Hardware-accelerated context switching between old and new firmware images without power cycle - critical for zero-downtime field updates in UPS and charging infrastructure. |
| Configurable Logic Block (CLB) | Six logic tiles enable custom encoder interfaces, PWM pattern generation, or glue logic replacement - eliminating need for external CPLD/FPGA in servo drive designs. |
| EtherCAT SubDevice Controller | Integrated ESC eliminates external Ethernet PHY + controller; supports distributed clocks and cyclic process data exchange for deterministic motion control networks. |
| ADC Redundancy Checker | Hardware compares conversion results across multiple ADC modules for functional safety - enables ISO 26262-compliant motor position sensing without CPU overhead. |
| High-Resolution PWM (HRPWM) | All 36 ePWM channels deliver 150ps resolution for precise dead-time control in SiC/GaN-based inverters operating above 200kHz switching frequency. |
Applications
| Servo Drive Control Module | String Inverter |
|---|---|
Use Scenario: Closed-loop torque and position control of PMSM/BLDC motors in industrial robots and CNC machines. IC Role / Device Role / Timing Role: Real-time signal chain processor executing field-oriented control (FOC) at ≤10μs loop time using dual C28x + CLA parallelism. Use Value: 200MHz C28x cores with TMU and FPU64 accelerate trigonometric and division operations; HRPWM ensures <1ns timing jitter for accurate phase alignment. | Use Scenario: MPPT and grid-synchronization control in photovoltaic systems with multiple panel strings feeding a common DC bus. IC Role / Device Role / Timing Role: Central controller managing DC-DC boost stages, isolation monitoring, and grid-tie inverter modulation via 36-channel HRPWM. Use Value: Dual CAN FD interfaces enable communication with string-level optimizers; EMIF supports external SDRAM for waveform logging and fault analytics. |
| EV DC Fast Charging Station | Industrial AC-DC Power Supply |
Use Scenario: High-power bidirectional AC-DC conversion and battery pre-charge sequencing in 150kW+ charging stations. IC Role / Device Role / Timing Role: Primary controller coordinating interleaved PFC, LLC resonant stages, and isolation gate drivers via synchronized HRPWM and CLB logic. Use Value: MINDB and ICL logic prevent shoot-through in GaN half-bridges; FSI (200Mbps) enables isolated communication with secondary-side controllers across reinforced barriers. | Use Scenario: Digital control of multi-kW telecom/server PSUs with active clamp forward, LLC, or phase-shifted full-bridge topologies. IC Role / Device Role / Timing Role: Real-time voltage/current regulation, thermal derating, and PMBus-compliant telemetry reporting to host system. Use Value: Two 12-bit DAC outputs generate precision references for current sense amplifiers; AES acceleration secures firmware updates over PMBus. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320F28379D | Single C28x+CLA subsystem (400 MIPS), 1MB flash, no EtherCAT or lockstep; 176-pin HLQFP only. | Lacks ASIL B certification, dual-CPU lockstep, and EtherCAT - suitable for cost-sensitive non-automotive motor control. | Select when functional safety and industrial network protocols are not required; lower BOM cost but reduced real-time throughput. |
| TMS320F28P650DK9NMR | Same core architecture and peripherals, but 169-ball nFBGA (9mm × 9mm), 119 GPIO, 34 ADC inputs - smaller footprint, lower I/O count. | Targeted for space-constrained applications like OBC or compact servo drives where full 185-GPIO capability is unnecessary. | Select when board area is constrained and 256-ball ZEJ layout is impractical; identical firmware compatibility and safety features retained. |
Compared with TMS320F28P650DK9ZEJ, the F28379D offers lower cost and simpler qualification but sacrifices lockstep safety and EtherCAT; the DK9NMR maintains full feature parity in a smaller package, enabling direct migration where PCB real estate is limited.
Availability
TMS320F28P650DK9ZEJ is available at Aetrix Electronics and suitable for servo drive control modules, string inverters, and EV DC fast charging stations requiring stable component supply, long-term lifecycle assurance, and automotive-grade temperature operation (–40°C to 125°C).
Supply support for TMS320F28P650DK9ZEJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with deep expertise in real-time control and power electronics.
The TMS320F28P650DK9ZEJ belongs to TI's C2000™ real-time MCU family, engineered specifically for ultra-low-latency, high-efficiency power conversion systems using SiC, GaN, and IGBT devices in industrial, energy, and automotive applications.
FAQ
What is the maximum operating junction temperature for the TMS320F28P650DK9ZEJ?
The TMS320F28P650DK9ZEJ has a specified junction temperature range of –40°C to 150°C, with ambient operating temperature rated from –40°C to 125°C. This rating supports deployment in high-thermal-load environments such as enclosed EV charging cabinets or industrial motor drive enclosures. Thermal resistance for the ZEJ package is documented in section 6.7 of the datasheet, enabling accurate junction temperature calculation under real-world power dissipation conditions. The device includes on-chip temperature sensor and thermal shutdown circuitry for system-level protection.
Does the TMS320F28P650DK9ZEJ support functional safety certification out of the box?
Yes, the TMS320F28P650DK9ZEJ is ISO 26262 certified up to ASIL B and IEC 61508 certified up to SIL 2 by TÜV SÜD. It includes hardware safety mechanisms such as lockstep C28x CPU2, memory POST, HWBIST, reciprocal ADC comparison, and ERAD diagnostics. Safety documentation, failure-in-time (FIT) data, and FMEDA reports are provided by Texas Instruments to support system-level certification. No additional hardware modifications are required to leverage these certified capabilities in end equipment.
Can the TMS320F28P650DK9ZEJ replace the TMS320F28379D in an existing design?
The TMS320F28P650DK9ZEJ is not a pin-compatible drop-in replacement for the TMS320F28379D due to different package (256-ball ZEJ vs. 176-pin PTP), higher pin count (185 GPIO vs. 128), and distinct peripheral enablement (e.g., EtherCAT, dual CAN FD). However, firmware built on C2000Ware is largely portable due to shared register maps and peripheral IP. Migration requires PCB redesign and validation of safety-critical paths, but delivers significant gains in processing throughput, safety compliance, and communication capability for next-generation power systems.
What development tools are officially supported for the TMS320F28P650DK9ZEJ?
Texas Instruments officially supports the TMDSCNCD28P65X controlCARD evaluation module, C2000Ware software suite (including driver libraries, examples, and safety packages), Code Generation Tools (C2000 C/C++ compiler), and CCS IDE with real-time analysis plugins. Debugging uses XDS110 or XDS200 emulators via JTAG. TI also provides functional safety kits, EtherCAT stack integration guides, and motor control SDKs - all validated for the TMS320F28P650DK9ZEJ and its ZEJ package configuration.
How does the Configurable Logic Block (CLB) in the TMS320F28P650DK9ZEJ reduce external component count?
The CLB in the TMS320F28P650DK9ZEJ provides six reconfigurable logic tiles that can implement custom state machines, encoder interfaces, or PWM pattern generators - directly replacing discrete CPLDs or small FPGAs. For example, it can synthesize quadrature decoding logic for eQEP inputs or generate complementary PWM pairs with programmable dead time, eliminating external logic gates and associated routing complexity. This integration reduces PCB layer count, improves timing predictability, and lowers bill-of-materials cost in servo and inverter designs.
F28P650DK9ZEJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 256-LFBGA
- Series:
- C2000™ C28x Piccolo™
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- C28x
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, I2C, SCI, SPI, UART/USART, USB
- Peripherals:
- AES, Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 163
- Program Memory Size:
- 1.28MB (1.28M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 248K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.8V ~ 3.63V
- Data Converters:
- A/D 40x10b/16b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
F28P650DK9ZEJ FAQ
1.How can I place an order for F28P650DK9ZEJ through Aetrix?
Please submit a Request for Quotation (RFQ) for F28P650DK9ZEJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for F28P650DK9ZEJ reliable?
The price and inventory of F28P650DK9ZEJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for F28P650DK9ZEJ is usually 5 days.
3.What payment methods are accepted for F28P650DK9ZEJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for F28P650DK9ZEJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for F28P650DK9ZEJ?
F28P650DK9ZEJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your F28P650DK9ZEJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for F28P650DK9ZEJ?
For technical support, including F28P650DK9ZEJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your F28P650DK9ZEJ requirements.
6.How does Aetrix verify that F28P650DK9ZEJ is sourced from the original manufacturer or authorized distributors?
All F28P650DK9ZEJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that F28P650DK9ZEJ meets industry standards.
7.What is the process for return or replacement of F28P650DK9ZEJ?
All F28P650DK9ZEJ units undergo pre-shipment inspection (PSI). If there is an issue with F28P650DK9ZEJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The F28P650DK9ZEJ part is unused and in its original packaging.
Return procedure for F28P650DK9ZEJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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