Texas Instruments F28P659DH8PZPRQ1
- Part No.:
- F28P659DH8PZPRQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
F28P659DH8PZPRQ1.pdf
- Description:
- AUTOMOTIVE C2000 32-BIT MCU, 600
- Quantity:
- Payment:

- Shipping:

Inventory:1,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMS320F28P659DH8PZPRQ1 from Texas Instruments is an AEC-Q100 qualified real-time microcontroller featuring dual 32-bit C28x DSP CPUs and one CLA CPU, all operating at 200 MHz, with 768KB ECC-protected flash, 244KB RAM, and dual CAN FD interfaces. It integrates three 16-bit/12-bit ADCs (up to 3.92 MSPS), 36 HRPWM channels (150 ps resolution), and hardware safety features including lockstep on CPU2 and ISO 26262 ASIL B certification - deployed in automotive HVAC compressor modules and EV on-board chargers.
For engineers reviewing the TMS320F28P659DH8PZPRQ1 datasheet, TMS320F28P659DH8PZPRQ1 pinout, TMS320F28P659DH8PZPRQ1 application, or TMS320F28P659DH8PZPRQ1 equivalent, key selection criteria include its 100-pin HTQFP package, dual-CPU lockstep capability, 768KB flash size, and automotive-grade (-40°C to 125°C) qualification for functional safety-critical motor control systems.
Technical Context
The TMS320F28P659DH8PZPRQ1 implements a deterministic real-time control architecture with two independent C28x DSP cores (CPU1 and CPU2), where CPU2 operates in lockstep mode for fault detection, and a dedicated CLA CPU executing control law code in parallel. Its analog subsystem includes three ADCs with hardware oversampling (up to 128×), automatic result comparison, and 24 redundant input channels - enabling functional safety compliance without software overhead.
Control peripherals are optimized for high-frequency power conversion: 36 ePWM channels support Minimum Dead-Band Logic (MINDB) and Illegal Combo Logic (ICL), while the Configurable Logic Block (CLB) provides six logic tiles for custom encoder interfaces or PWM generation. Communications include EtherCAT SubDevice Controller, USB 2.0, FSI (200 Mbps), two CAN FD controllers, and PMBus - all integrated into a single-chip solution for isolated, time-critical industrial and automotive systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual 32-bit C28x DSP + CLA CPU, all at 200 MHz - delivers 600 MIPS total processing for real-time signal chain execution without external co-processors. |
| Flash Memory | 768KB ECC-protected on-chip flash - supports secure firmware updates and robust operation in automotive ECU environments. |
| RAM | 244KB total (100KB dedicated + 64KB local shared + 80KB global shared) - enables multi-threaded control algorithms with low-latency inter-CPU communication. |
| ADC Performance | Three 16-bit/12-bit ADCs: 1.19 MSPS (16-bit) or 3.92 MSPS (12-bit), with simultaneous sampling via separate S/H - critical for vector-controlled PMSM drives. |
| PWM Resolution | 36 channels with 150 ps high-resolution capability - supports GaN/SiC switching at >1 MHz with precise dead-time control. |
| Safety Certification | ISO 26262 ASIL B certified (TÜV SÜD), with lockstep CPU2, MPOST, HWBIST, and reciprocal ADC comparison - reduces system-level FMEDA effort. |
| Package & Temp | 100-pin HTQFP (PZP), 16mm × 16mm, –40°C to 125°C ambient - thermally enhanced PowerPAD design for automotive under-hood deployment. |
Pinout & Package
Package: 100-pin PowerPAD™ Thermally Enhanced Thin Quad Flatpack (HTQFP), suffix PZP, 16mm × 16mm footprint with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO | I/O Supply Voltage | 3.3V supply for all digital I/O banks - supports mixed-voltage interfacing with sensors, gate drivers, and communication transceivers. |
| VDDA / VSSA | Analog Supply / Ground | Separate 3.3V analog domain with dedicated ground plane - minimizes noise coupling into ADC and DAC reference paths. |
| GPIO28–GPIO59 | General-Purpose I/O | 32 pins multiplexed with ADC inputs, ePWM, eCAP, and CLB - enables flexible peripheral routing for motor phase sensing and protection signals. |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 Interface | Differential pair supporting up to 5 Mbps data rate - used for high-bandwidth diagnostics and coordination between inverter and OBC subsystems. |
| USB0_DP / USB0_DM | USB 2.0 Physical Layer | Integrated PHY with MAC - allows direct firmware update and debug over standard USB cable without external transceiver. |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-CPU Comparator | Hardware-enforced comparison between CPU1 and CPU2 outputs - detects transient faults in real time for ASIL B compliance without software polling. |
| Live Firmware Update (LFU) | Hardware-assisted context switch between old and new firmware images - enables zero-downtime field updates in automotive ECUs. |
| Configurable Logic Block (CLB) | Six programmable logic tiles implementing custom state machines or PWM generators - replaces external CPLD in motor position feedback circuits. |
| Hardware ADC Redundancy Checker | Automatic comparison of results across multiple ADC modules - eliminates CPU cycles for safety-critical validation in ISO 26262 applications. |
| Minimum Dead-Band Logic (MINDB) | On-the-fly dead-time enforcement per PWM channel - prevents shoot-through in SiC/GaN half-bridges without software intervention. |
Applications
| Automotive HVAC Compressor Control | EV On-Board Charger (OBC) |
|---|---|
|
Use Scenario: Closed-loop field-oriented control of brushless DC compressors in electric vehicle climate systems, requiring fast torque response and thermal derating. IC Role / Device Role / Timing Role: Real-time motor controller executing FOC algorithm, ADC sampling, PWM generation, and CAN FD diagnostics - all within <10 µs loop time. Use Value: Dual C28x CPUs enable separation of safety-critical torque control (lockstep CPU2) and non-safety functions (CPU1), meeting ASIL B decomposition requirements. |
Use Scenario: Bidirectional AC/DC and DC/DC conversion in 11 kW OBCs, managing grid synchronization, isolation monitoring, and battery charging profiles. IC Role / Device Role / Timing Role: Primary controller coordinating interleaved PFC stages, LLC resonant converter, and isolated communication via FSI to secondary MCU. Use Value: 36 HRPWM channels support multi-phase topologies; hardware oversampling improves current sensing accuracy for Class I energy metering compliance. |
| Industrial Servo Drive Module | Mobile Robot Motor Controller |
|
Use Scenario: High-bandwidth position/velocity/torque control of servo motors in CNC machines and robotic arms, with real-time EtherCAT slave operation. IC Role / Device Role / Timing Role: EtherCAT SubDevice Controller (ESC) handles distributed clock synchronization and process data exchange while C28x executes motion control loops. Use Value: Integrated ESC eliminates external ASIC; CLB implements custom encoder interpolation logic, reducing latency vs. FPGA-based solutions. |
Use Scenario: Compact, high-efficiency motor control for autonomous mobile robots with dynamic load changes and battery voltage variation. IC Role / Device Role / Timing Role: Central controller managing dual BLDC motors, IMU fusion, CAN bus telemetry, and thermal shutdown via internal temperature sensor. Use Value: Single-chip integration of 2× CAN FD, USB, and LIN reduces BOM count; 125°C ambient rating supports sealed, fanless enclosure designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time motor control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320F28P659DK8-Q1 | 256-ball nFBGA (ZEJ), 1.28MB flash, EtherCAT support - larger package, higher memory, added industrial protocol. | Suitable for central inverter or multi-axis servo systems requiring EtherCAT master/slave and extended memory for complex motion profiles. | Select when needing EtherCAT, larger flash, or higher GPIO count (185 pins); not drop-in due to package and pinout differences. |
| TMS320F28P659SH6-Q1 | 176-pin HLQFP (PTP), 768KB flash, single C28x+CLA CPU - same flash/RAM but no lockstep CPU2 or dual CAN FD. | Targeted at cost-sensitive, non-safety-critical applications like HVAC fans or auxiliary pumps where ASIL B is not required. | Select for simpler motor control without functional safety certification; shares same core peripherals but lacks lockstep and second CAN FD. |
Compared with TMS320F28P659DH8PZPRQ1, the DK8-Q1 offers EtherCAT and more memory in a larger BGA package, while the SH6-Q1 removes lockstep and one CAN FD to reduce cost - making the DH8PZPRQ1 the optimal balance of automotive safety, compact QFP packaging, and dual CAN FD for OBC and compressor modules.
Availability
TMS320F28P659DH8PZPRQ1 is available at Aetrix Electronics and suitable for automotive HVAC compressor modules, EV on-board chargers, and industrial servo drive systems requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for TMS320F28P659DH8PZPRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in real-time control MCUs for power electronics.
The TMS320F28P65x product line is designed for high-efficiency, ultra-low-latency power conversion systems using SiC, GaN, and IGBT devices - targeting automotive traction inverters, solar string inverters, and industrial motor drives.
FAQ
What is the core architecture of the TMS320F28P659DH8PZPRQ1?
The TMS320F28P659DH8PZPRQ1 features two 32-bit C28x DSP CPUs and one Control Law Accelerator (CLA) CPU, all running at 200 MHz. CPU2 operates in lockstep mode for functional safety, and the CLA executes control algorithms independently. This architecture delivers 600 MIPS total performance and is optimized for real-time motor control and power conversion tasks in the TMS320F28P659DH8PZPRQ1.
Does the TMS320F28P659DH8PZPRQ1 support functional safety standards?
Yes, the TMS320F28P659DH8PZPRQ1 is ISO 26262 ASIL B certified by TÜV SÜD and supports IEC 61508 SIL 2. It includes hardware safety features such as lockstep CPU2, Memory Power-On Self-Test (MPOST), Hardware Built-in Self-Test (HWBIST), and reciprocal ADC comparison - all documented to aid system-level safety certification for automotive and industrial applications using the TMS320F28P659DH8PZPRQ1.
What package type and pin count does the TMS320F28P659DH8PZPRQ1 use?
The TMS320F28P659DH8PZPRQ1 uses a 100-pin PowerPAD™ Thermally Enhanced Thin Quad Flatpack (HTQFP) package, designated PZP, with a 16mm × 16mm footprint and exposed thermal pad. This package supports automotive under-hood operation from –40°C to 125°C ambient and provides 60 total GPIO/AIO pins - a key differentiator of the TMS320F28P659DH8PZPRQ1 versus larger BGA variants.
How much flash and RAM does the TMS320F28P659DH8PZPRQ1 include?
The TMS320F28P659DH8PZPRQ1 integrates 768KB of ECC-protected on-chip flash memory and 244KB of RAM (comprising 100KB dedicated, 64KB local shared, and 80KB global shared). This memory configuration supports complex real-time control algorithms, dual-firmware storage for Live Firmware Update, and robust operation in automotive environments - defining a core capability of the TMS320F28P659DH8PZPRQ1.
Which communication interfaces are available on the TMS320F28P659DH8PZPRQ1?
The TMS320F28P659DH8PZPRQ1 includes two CAN FD controllers (supporting up to 5 Mbps), USB 2.0 (MAC + PHY), Fast Serial Interface (FSI) for 200 Mbps isolated communication, four SPI ports, two UARTs, two I2C interfaces, two LIN modules, and a PMBus interface. Notably, it omits EtherCAT - distinguishing it from ZEJ-package variants and confirming its focus on automotive and cost-optimized industrial applications within the TMS320F28P659DH8PZPRQ1 family.
F28P659DH8PZPRQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- C2000™ C28x Piccolo™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- C28x
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, I2C, SCI, SPI, UART/USART, USB
- Peripherals:
- AES, Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 49
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 248K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.8V ~ 3.63V
- Data Converters:
- A/D 24x12/16b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
F28P659DH8PZPRQ1 FAQ
1.How can I place an order for F28P659DH8PZPRQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for F28P659DH8PZPRQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for F28P659DH8PZPRQ1 reliable?
The price and inventory of F28P659DH8PZPRQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for F28P659DH8PZPRQ1 is usually 5 days.
3.What payment methods are accepted for F28P659DH8PZPRQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for F28P659DH8PZPRQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for F28P659DH8PZPRQ1?
F28P659DH8PZPRQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your F28P659DH8PZPRQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for F28P659DH8PZPRQ1?
For technical support, including F28P659DH8PZPRQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your F28P659DH8PZPRQ1 requirements.
6.How does Aetrix verify that F28P659DH8PZPRQ1 is sourced from the original manufacturer or authorized distributors?
All F28P659DH8PZPRQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that F28P659DH8PZPRQ1 meets industry standards.
7.What is the process for return or replacement of F28P659DH8PZPRQ1?
All F28P659DH8PZPRQ1 units undergo pre-shipment inspection (PSI). If there is an issue with F28P659DH8PZPRQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The F28P659DH8PZPRQ1 part is unused and in its original packaging.
Return procedure for F28P659DH8PZPRQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
F28P659DH8PZPRQ1 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

