Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments F28P659DK8ZEJRQ1

Part No.:
F28P659DK8ZEJRQ1
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
256-LFBGA
Datasheet:
AetrixF28P659DK8ZEJRQ1.pdf
Description:
C2000 32-BIT MCU, 2X C28X+CLA CP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:970

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

F28P659DK8ZEJRQ1 from Texas Instruments is a dual-CPU C28x real-time microcontroller with CLA, operating at 200MHz per core, featuring 1.28MB ECC-protected flash, 248KB parity-protected RAM, three 16-bit/12-bit ADCs (1.19MSPS @ 16-bit), 36 HRPWM channels (150ps resolution), and dual CAN FD interfaces - deployed in automotive HVAC compressor modules and DC fast charging stations.

For engineers reviewing the F28P659DK8ZEJRQ1 datasheet, F28P659DK8ZEJRQ1 pinout, F28P659DK8ZEJRQ1 application, or F28P659DK8ZEJRQ1 equivalent, this page delivers verified specifications, package mapping to 256-ball nFBGA (ZEJ), functional safety compliance (ISO 26262 ASIL B, IEC 61508 SIL 2), and validated alternative part selection for motor control and power conversion designs.

Technical Context

The F28P659DK8ZEJRQ1 implements lockstep operation on C28x CPU2 for functional safety, with hardware redundancy checking across ADC conversions and dual-clock comparator (DCC) for clock fault detection. Its CLA executes independent floating-point control law code at 200MHz while CPU1 and CPU2 handle real-time signal processing and system management.

It integrates EtherCAT SubDevice Controller, Fast Serial Interface (FSI) supporting 200Mbps isolated communication, and Configurable Logic Block (CLB) with six logic tiles - enabling FPGA-like custom PWM generation and encoder interface logic without external components.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Architecture Dual 32-bit C28x DSP cores + single CLA core, all at 200MHz - delivers 600 MIPS total real-time control throughput for multi-axis servo and inverter algorithms.
Flash / RAM 1.28MB ECC-protected flash (5 banks) and 248KB enhanced parity RAM - supports live firmware update (LFU) with zero-downtime context switching between versions.
ADC Performance Three 16-bit/12-bit ADCs: 1.19MSPS @ 16-bit or 3.92MSPS @ 12-bit, with 40 single-ended inputs and hardware oversampling up to 128× - enables high-fidelity current/voltage sensing in SiC/GaN inverters.
PWM Capability 36 ePWM channels, all with 150ps high-resolution timing, MINDB and ICL logic - supports resonant, multilevel, and matrix converter topologies without external dead-time ICs.
Safety Certification ISO 26262 ASIL B certified (TÜV SÜD), IEC 61508 SIL 2 certified, with lockstep CPU2, MPOST, HWBIST, and reciprocal ADC comparison - meets systematic capability requirements for automotive traction inverters.
Package & Temp 256-ball nFBGA (ZEJ), 13mm × 13mm, 0.8mm pitch; qualified for –40°C to 125°C ambient - suitable for under-hood automotive and industrial power module integration.
Communication Dual CAN FD controllers, EtherCAT SubDevice Controller, USB 2.0 (MAC+PHY), 4× SPI, 2× UART (25Mbps), 2× I²C (400kbps), FSI TX/RX - enables deterministic fieldbus connectivity and high-speed isolated diagnostics.

Pinout & Package

Package: 256-ball New Fine Pitch Ball Grid Array (nFBGA), ZEJ suffix, 13mm × 13mm, 0.8mm pitch, lead-free and green compliant.

Pin/Terminal Circuit Role Design Meaning
VDDA / VSSA Analog Power / Ground Separate 3.3V analog supply and ground planes - critical for ADC/DAC noise immunity and 16-bit measurement accuracy.
A0/DACA_OUT Analog Output Buffered 12-bit DAC output channel A - used for slope-compensated peak/valley current mode control in resonant converters.
B0/VDAC Analog Reference Input Reference voltage input for DAC outputs - enables programmable current limit thresholds in motor phase protection circuits.
A9, GPIO212 General-Purpose I/O Multiplexed digital I/O with interrupt capability - configurable as ePWM sync input or CLB trigger for custom timing sequences.
TCK / TDO / TDI / TMS JTAG Debug Interface IEEE 1149.1 boundary-scan pins - support secure JTAGLOCK and zero-pin boot for production programming and debug lockdown.

Key Features

Feature Design Value
Control Law Accelerator (CLA) Independent IEEE 754 single-precision floating-point CPU running at 200MHz - offloads PID, observer, and SVM calculations from main C28x cores to reduce latency below 1µs.
Hardware Redundancy Checker Real-time comparison of ADC results across multiple modules - eliminates software overhead for functional safety compliance in ASIL B systems.
Configurable Logic Block (CLB) Six programmable logic tiles with input/output crossbars - replaces external CPLD for encoder decoding, custom PWM edge shaping, and fault logic arbitration.
Live Firmware Update (LFU) Hardware-assisted context switch between active and standby firmware images - enables over-the-air updates without power cycle or motor stop in EV charging applications.
EtherCAT SubDevice Controller Integrated ESC with 2× 100Mbps Ethernet PHY interface - reduces bill-of-materials and PCB area for industrial servo drives requiring real-time motion control.

Applications

Automotive HVAC Compressor Module DC Fast Charging Station

Use Scenario: Closed-loop vector control of brushless DC compressor motor in electric vehicle climate systems.

IC Role / Device Role / Timing Role: Real-time motor control MCU executing field-oriented control (FOC), ADC sampling, and PWM generation with <1µs loop latency.

Use Value: Enables precise torque ripple suppression and thermal derating via on-chip temperature sensor and dual-CPU lockstep fault detection.

Use Scenario: Bidirectional AC/DC and DC/DC power conversion in 150kW+ charging cabinets with SiC MOSFETs.

IC Role / Device Role / Timing Role: Primary controller managing interleaved PFC, LLC resonant stages, and isolation gate drivers via 36 HRPWM channels.

Use Value: 150ps PWM resolution and hardware dead-band logic ensure safe zero-voltage switching transitions and minimize EMI in high-frequency GaN designs.

Industrial Servo Drive Control Central Solar Inverter

Use Scenario: High-bandwidth position/velocity/torque control in robotic joint actuators with dual-loop feedback.

IC Role / Device Role / Timing Role: Dual-C28x architecture runs position loop on CPU1 and current loop on CPU2 with CLA handling observer math.

Use Value: Lockstep CPU2 and ERAD diagnostic unit provide ASIL B-compliant fault detection for collaborative robot safety monitoring.

Use Scenario: Three-phase grid-tied inverter with MPPT, reactive power control, and anti-islanding protection.

IC Role / Device Role / Timing Role: Central controller coordinating 3× ADCs for simultaneous line voltage/current sampling and 36 PWM outputs for 3-level NPC topology.

Use Value: Hardware oversampling (128×) and outlier rejection enable sub-0.1% THD current regulation under dynamic irradiance conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar real-time motor control applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS320F28P650DK9 Same ZEJ package, identical dual-CPU+CLA architecture, but includes EtherCAT SubDevice Controller and lockstep mode enabled - no CLA disable option. Targeted for EtherCAT-enabled servo drives where deterministic network synchronization is mandatory. Select when EtherCAT integration is required and ASIL B certification is not needed.
TMS320F28379D Legacy dual-core C28x+CLA at 200MHz, 1MB flash, 200KB RAM, no CAN FD or FSI - uses 176-pin HLQFP (PTP) or 337-ball BGA. Used in cost-sensitive industrial motor drives where automotive qualification and advanced safety features are unnecessary. Choose for non-automotive applications needing proven toolchain compatibility and lower BOM cost.

Compared with F28P659DK8ZEJRQ1, TMS320F28P650DK9 adds EtherCAT but lacks AEC-Q100 qualification, while TMS320F28379D offers mature ecosystem support but omits CAN FD, FSI, and ISO 26262 certification - making F28P659DK8ZEJRQ1 optimal for next-gen automotive power electronics requiring both safety and connectivity.

Availability

F28P659DK8ZEJRQ1 is available at Aetrix Electronics and suitable for automotive HVAC compressor modules, DC fast charging stations, and industrial servo drive systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for F28P659DK8ZEJRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in real-time control MCUs for power electronics.

The TMS320F28P65x product line was designed specifically for high-efficiency, high-reliability power conversion systems using SiC and GaN devices - targeting automotive traction, EV charging, and industrial motor control applications.

FAQ

What is the qualification status of F28P659DK8ZEJRQ1 for automotive applications?

F28P659DK8ZEJRQ1 is AEC-Q100 Grade 1 qualified (–40°C to 125°C) and certified to ISO 26262 ASIL B by TÜV SÜD. It includes lockstep CPU2, memory built-in self-test (HWBIST), and hardware-based ADC redundancy - enabling its use in automotive HVAC compressors and onboard chargers without additional safety hardware.

Does F28P659DK8ZEJRQ1 support live firmware update without stopping motor operation?

Yes, F28P659DK8ZEJRQ1 includes dedicated Live Firmware Update (LFU) hardware that enables atomic context switching between two firmware images in flash. This allows seamless runtime updates in EV charging stations and servo drives - F28P659DK8ZEJRQ1 maintains PWM output continuity and retains state variables during transition.

How many high-resolution PWM channels does F28P659DK8ZEJRQ1 provide, and what is their timing resolution?

F28P659DK8ZEJRQ1 provides 36 ePWM channels, all with high-resolution capability down to 150ps step size. This resolution supports precise dead-time insertion, phase-shifted modulation, and ZVS/ZCS timing in resonant and multilevel topologies - critical for minimizing switching losses in SiC-based F28P659DK8ZEJRQ1 designs.

What analog peripherals are integrated into F28P659DK8ZEJRQ1 for motor current sensing?

F28P659DK8ZEJRQ1 integrates three 16-bit/12-bit ADCs with simultaneous sample-and-hold, 40 single-ended inputs, hardware oversampling (up to 128×), and automatic outlier rejection. It also includes 11 windowed comparators with internal DAC references - enabling direct shunt-based current sensing with real-time overcurrent protection in F28P659DK8ZEJRQ1 motor control systems.

Is F28P659DK8ZEJRQ1 pin-compatible with other TMS320F28P65x variants in the ZEJ package?

F28P659DK8ZEJRQ1 shares the same 256-ball ZEJ nFBGA footprint and pinout with F28P650DK9, F28P650DK8, and F28P650DK7 - enabling hardware reuse across industrial and automotive variants. However, feature enablement (e.g., EtherCAT, lockstep) differs per part number, so firmware must be validated per device configuration.

F28P659DK8ZEJRQ1 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
256-LFBGA
Series:
C2000™ C28x Piccolo™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, I2C, SCI, SPI, UART/USART, USB
Peripherals:
AES, Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
163
Program Memory Size:
1.28MB (1.28M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
248K x 8
Voltage - Supply (Vcc/Vdd):
2.8V ~ 3.63V
Data Converters:
A/D 40x12/16b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

F28P659DK8ZEJRQ1 FAQ

1.How can I place an order for F28P659DK8ZEJRQ1 through Aetrix?

Please submit a Request for Quotation (RFQ) for F28P659DK8ZEJRQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for F28P659DK8ZEJRQ1 reliable?

The price and inventory of F28P659DK8ZEJRQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for F28P659DK8ZEJRQ1 is usually 5 days.

3.What payment methods are accepted for F28P659DK8ZEJRQ1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for F28P659DK8ZEJRQ1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for F28P659DK8ZEJRQ1?

F28P659DK8ZEJRQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your F28P659DK8ZEJRQ1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for F28P659DK8ZEJRQ1?

For technical support, including F28P659DK8ZEJRQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your F28P659DK8ZEJRQ1 requirements.

6.How does Aetrix verify that F28P659DK8ZEJRQ1 is sourced from the original manufacturer or authorized distributors?

All F28P659DK8ZEJRQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that F28P659DK8ZEJRQ1 meets industry standards.

7.What is the process for return or replacement of F28P659DK8ZEJRQ1?

All F28P659DK8ZEJRQ1 units undergo pre-shipment inspection (PSI). If there is an issue with F28P659DK8ZEJRQ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The F28P659DK8ZEJRQ1 part is unused and in its original packaging.

Return procedure for F28P659DK8ZEJRQ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

F28P659DK8ZEJRQ1 Tags

  • F28P659DK8ZEJRQ1
  • F28P659DK8ZEJRQ1 PDF
  • F28P659DK8ZEJRQ1 Datasheet
  • F28P659DK8ZEJRQ1 Specifications
  • F28P659DK8ZEJRQ1 Images
  • Texas Instruments
  • Texas Instruments F28P659DK8ZEJRQ1
  • Buy F28P659DK8ZEJRQ1
  • F28P659DK8ZEJRQ1 Price
  • F28P659DK8ZEJRQ1 Distributor
  • F28P659DK8ZEJRQ1 Supplier
  • F28P659DK8ZEJRQ1 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER