onsemi FAN48630BUC34X
- Part No.:
- FAN48630BUC34X
- Manufacturer:
- onsemi
- Package:
- 16-UFBGA, WLCSP
- Datasheet:
-
FAN48630BUC34X.pdf
- Description:
- IC REG BOOST PROG 1.5A 16WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:2,146
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
FAN48630BUC34X from onsemi is a synchronous boost regulator with forced bypass mode, designed for Li-ion battery-powered systems requiring stable 3.20 V / 3.40 V dual-output regulation. It delivers up to 1500 mA continuous load current at VIN = 2.6 V boosting to 3.5 V, operates at 2.5 MHz switching frequency, and features true bypass operation when VIN exceeds target VOUT. It is used in brownout prevention and USB OTG power delivery.
For engineers reviewing the FAN48630BUC34X datasheet, pinout, applications, or equivalent options, key selection considerations include its backside-laminated WLCSP16 package, low-IQ forced bypass mode (4–10 µA), ±2% output voltage accuracy, and integrated synchronous rectifier with 65 mΩ RDS(ON)P.
Technical Context
The FAN48630BUC34X implements current-mode control in Continuous Conduction Mode (CCM) at ~2.5 MHz, with automatic transition between Boost and Bypass modes based on VIN vs. VOUT_TARGET comparison. Its valley-current limiting architecture supports peak inductor currents up to 3.8 A during overload, while soft-start sequencing (FAST mode, 600 µs EN-to-regulation) prevents inrush.
Bypass entry is triggered when VIN > VOUT_TARGET + 25 mV (25 mV hysteresis), and exit occurs when VOUT reaches target; forced bypass activation via BYP pin disables most internal circuitry to achieve ultra-low quiescent current. Thermal protection activates at 150°C (T150T) with 20°C hysteresis (T150H), and PG fault signaling reports overload, thermal events (>120°C), or startup failure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | 3.20 V / 3.40 V fixed dual option - sets regulated rail for system logic or RF power stages without external feedback resistors. |
| Max Load Current | 1500 mA at VIN = 2.6 V → VOUT = 3.5 V - supports high-pulse loads in portable audio or LTE transceivers. |
| Switching Frequency | 2.5 MHz typical - enables use of compact 0.47 µH inductor and small 0603 capacitors, reducing board area. |
| Quiescent Current | 4–10 µA in Forced Bypass (Low IQ mode) - extends battery runtime during standby in always-on sensor nodes. |
| RDS(ON)P (Sync Rect) | 65–85 mΩ - minimizes conduction loss in boost path, improving efficiency above 500 mA load. |
| UVLO Threshold | 2.35 V rising - ensures reliable startup from deeply discharged single-cell Li-ion batteries down to 2.35 V. |
| Package | 16-bump WLCSP, 1.78 × 1.78 × 0.586 mm - ultra-compact footprint ideal for space-constrained mobile PCBs. |
Pinout & Package
Package: Wafer-Level Chip-Scale Package (WLCSP), 16-bump, 0.4 mm pitch, 1.78 mm × 1.78 mm × 0.586 mm body height (Case 567SY).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | EN | Enable input: logic-high (>1.2 V) activates regulator; must be driven by 1.8 V logic, not connected directly to VIN. |
| A2 | PG | Open-drain Power Good: pulled LOW on overload, thermal fault (>120°C), or startup failure; signals system readiness. |
| A3–A4 | VIN | Main input: connects to single-cell Li-ion battery (2.35–5.5 V); dual pins reduce IR drop under 1500 mA load. |
| B1 | VSEL | Voltage select: adjusts target VOUT upward in fixed steps to mitigate transient undershoot or optimize headroom. |
| B2, C2, D1 | AGND | Analog ground reference: provides low-noise return for internal control circuitry and feedback sensing. |
| B3–B4 | VOUT | Regulated output: supplies system rail; requires COUT placed adjacent to PGND/VOUT pins for low-impedance decoupling. |
| C1 | BYP | Bypass control: logic-low forces true bypass mode, disabling switching and minimizing IQ to 4–10 µA. |
| C3–C4 | SW | Switching node: connects to inductor; high dv/dt node requiring tight layout and minimal trace length. |
| D2–D4 | PGND | Power ground: high-current return path for boost switch and sync rectifier; must tie to COUT ground with shortest possible path. |
Key Features
| Feature | Design Value |
|---|---|
| True Bypass Operation | Enables direct VIN-to-VOUT conduction when VIN > VOUT_TARGET + 25 mV, eliminating switching loss and reducing IQ to <10 µA. |
| Synchronous Rectification | Integrated P-channel sync rectifier (RDS(ON)P = 65–85 mΩ) replaces external Schottky, improving full-load efficiency to 96%. |
| FAST Soft-Start | 600 µs EN-to-regulation time with doubled LIN1/LIN2 current limits - reduces startup delay for responsive USB OTG handshaking. |
| VSEL-Controlled Output Adjustment | Allows dynamic VOUT targeting (e.g., +100 mV step) before load transients, reducing required input headroom and extending battery life. |
| Backside Lamination | Enhanced mechanical robustness and thermal performance in the FAN48630BUC34X variant - critical for drop-prone handheld devices. |
Applications
| Brownout Prevention | USB OTG Power Delivery |
|---|---|
|
Use Scenario: Maintaining stable 3.3 V system rail as single-cell Li-ion discharges from 4.2 V to 2.8 V. IC Role / Device Role / Timing Role: Synchronous boost regulator with auto-bypass - sustains VOUT ≥ 3.2 V even when VIN drops below VOUT_TARGET. Use Value: Prevents system reset or data corruption during battery sag; leverages backside lamination for reliability in portable devices. |
Use Scenario: Supplying 5 V/500 mA to USB peripheral from smartphone battery during host mode. IC Role / Device Role / Timing Role: High-efficiency boost converter with forced bypass - delivers regulated 5 V while minimizing standby drain. Use Value: Achieves >92% efficiency at 500 mA and <10 µA IQ in bypass, extending OTG session duration without compromising thermal safety. |
| Boosted Audio Amplifiers | LTE/3G RF Power Stages |
|
Use Scenario: Providing clean 4.5 V bias to Class-D audio amplifier IC from 3.6 V nominal battery. IC Role / Device Role / Timing Role: Low-noise, fast-transient boost regulator - maintains VOUT stability during dynamic music peaks. Use Value: Delivers 1500 mA peak current with <±4% load transient response and <50 mVpp ripple, preserving audio fidelity. |
Use Scenario: Generating 3.5 V supply for PA driver stage in LTE handset operating across temperature extremes. IC Role / Device Role / Timing Role: Thermally robust boost regulator with PG fault reporting - ensures RF subsystem remains powered within spec. Use Value: Integrates thermal shutdown (150°C) and PG monitoring to prevent PA damage; WLCSP package enables dense RF front-end layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar boost regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS61291DRVR | Fixed 3.3 V output; 1.2 MHz switching; no forced bypass mode; 2.5 µA shutdown IQ. | Lacks true bypass and VSEL control - less suitable for brownout-critical or dynamic-headroom applications. | Prefer FAN48630BUC34X when ultra-low bypass IQ (<10 µA) and VIN > VOUT seamless transition are required. |
| MAX17222ETA+T | 3.3 V output; 2.5 MHz; 1.5 µA shutdown IQ; no PG pin or thermal fault reporting. | Missing power-good signaling and thermal protection - insufficient for safety-monitored RF or medical wearables. | Choose FAN48630BUC34X where PG fault flag, 120°C thermal warning, and backside lamination are mandatory. |
Compared with TPS61291DRVR and MAX17222ETA+T, the FAN48630BUC34X uniquely combines dual-voltage targeting (3.20 V / 3.40 V), forced bypass with sub-10 µA IQ, integrated PG and thermal fault signaling, and mechanically reinforced backside lamination - making it optimal for high-reliability portable power rails.
Availability
FAN48630BUC34X is available at Aetrix Electronics and suitable for USB OTG power delivery, brownout prevention in smartphones, and boosted audio amplifiers requiring stable component supply across production volumes.
Supply support for FAN48630BUC34X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient power management, analog, sensors, and connectivity solutions.
The FAN48630BUC34X belongs to the TINYBOOST® family of high-frequency synchronous boost regulators, engineered specifically for space- and power-constrained portable electronics using advanced Li-ion battery chemistries.
FAQ
What is the output voltage configuration of the FAN48630BUC34X?
The FAN48630BUC34X is factory-configured for dual fixed output voltages: 3.20 V and 3.40 V. This dual-option setting is defined by the "UC34X" suffix and verified in Table 1 of the datasheet. The device does not support adjustable output via external resistors - voltage selection is implemented internally and accessed via the VSEL pin for dynamic stepping. No external feedback network is required for basic operation of FAN48630BUC34X.
Does the FAN48630BUC34X support true bypass mode, and how is it activated?
Yes, the FAN48630BUC34X supports true bypass mode both automatically and forcibly. Automatic bypass engages when VIN exceeds VOUT_TARGET + 25 mV (with hysteresis), turning on internal P-channel switches Q1 and Q3 to create a low-impedance path. Forced bypass is activated by pulling the BYP pin LOW, which disables switching and reduces quiescent current to 4–10 µA. In forced bypass, short-circuit protection remains active only in OCP-On variants - the FAN48630BUC34X uses Low IQ mode, deactivating OCP during bypass.
What package type and dimensions does the FAN48630BUC34X use?
The FAN48630BUC34X uses a 16-bump Wafer-Level Chip-Scale Package (WLCSP) with 0.4 mm pitch, measuring 1.78 mm × 1.78 mm × 0.586 mm (Case 567SY). It features backside lamination - a structural reinforcement explicitly confirmed for FAN48630BUC34X in the identity context - improving mechanical durability and thermal dissipation. The top marking is "JR", per Table 1 ordering information.
How does the FAN48630BUC34X handle thermal protection and fault reporting?
The FAN48630BUC34X incorporates dual thermal thresholds: die temperature shutdown triggers at 150°C (T150T) with 20°C hysteresis (T150H), and early-warning thermal flag pulls PG LOW when junction exceeds 120°C (T120A). PG is an open-drain output that also asserts LOW during overload or startup failure. After a fault, the device enters FAULT state, halts switching, and attempts automatic restart after 20 ms (tRST). These protections are fully active in boost mode and partially retained in forced bypass (Low IQ variant disables OCP and UVLO).
What are the key differences between the FAN48630BUC34X and the standard FAN48630UC34X?
The FAN48630BUC34X differs from FAN48630UC34X solely by inclusion of backside lamination - a mechanical enhancement confirmed in the identity context for this exact part number. Both share identical electrical specifications: 3.20 V / 3.40 V output, FAST soft-start, Low IQ forced bypass, and WLCSP16 packaging. Backside lamination improves board-level reliability under mechanical stress (e.g., flex or drop), making FAN48630BUC34X preferred for consumer handhelds, while FAN48630UC34X suits cost-sensitive, static-mount applications.
FAN48630BUC34X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- TinyBoost®
- Package/Case:
- 16-UFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- Step-Up
- Output Configuration:
- Positive
- Topology:
- Boost
- Output Type:
- Programmable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.35V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.2V, 3.4V
- Voltage - Output (Max):
- -
- Current - Output:
- 1.5A (Switch)
- Frequency - Switching:
- 2.5MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-WLCSP (1.78x1.78)
FAN48630BUC34X FAQ
1.How can I place an order for FAN48630BUC34X through Aetrix?
Please submit a Request for Quotation (RFQ) for FAN48630BUC34X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FAN48630BUC34X reliable?
The price and inventory of FAN48630BUC34X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FAN48630BUC34X is usually 5 days.
3.What payment methods are accepted for FAN48630BUC34X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FAN48630BUC34X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FAN48630BUC34X?
FAN48630BUC34X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FAN48630BUC34X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FAN48630BUC34X?
For technical support, including FAN48630BUC34X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FAN48630BUC34X requirements.
6.How does Aetrix verify that FAN48630BUC34X is sourced from the original manufacturer or authorized distributors?
All FAN48630BUC34X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FAN48630BUC34X meets industry standards.
7.What is the process for return or replacement of FAN48630BUC34X?
All FAN48630BUC34X units undergo pre-shipment inspection (PSI). If there is an issue with FAN48630BUC34X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FAN48630BUC34X part is unused and in its original packaging.
Return procedure for FAN48630BUC34X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
FAN48630BUC34X Tags

-
TPS562201DDCR
Texas Instruments

-
MC34063ABD-TR
STMicroelectronics

-
TPS561201DDCR
Texas Instruments

-
MC33063ADR
Texas Instruments

-
MC34063ADR
Texas Instruments
-
TPS560200DBVR
Texas Instruments

-
AP3012KTR-G1
Diodes Incorporated

-
TLV61048DBVR
Texas Instruments

-
AZ34063UMTR-G1
Diodes Incorporated

-
TPS562200DDCR
Texas Instruments

-
AP62300TWU-7
Diodes Incorporated

-
MC34063EBD-TR
STMicroelectronics
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

