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Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

Vishay General Semiconductor - Diodes Division FESB16AT-E3/45

Name: FESB16AT-E3/45
Brand: Vishay General Semiconductor - Diodes Division
SKU: FESB16AT-E3/45
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: FESB16AT-E3/45

Manufacturer:: Vishay General Semiconductor - Diodes Division

Category:: Single Diodes

Package:: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Datasheet:: FESB16AT-E3/45.pdf

Description:: DIODE GEN PURP 50V 16A TO263AB

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Product details

Overview

FESB16AT-E3/45 from Vishay General Semiconductor is an ultrafast plastic rectifier diode in D2PAK (TO-263AB) package, rated for 50 V repetitive peak reverse voltage, 16 A average forward current, and 35 ns reverse recovery time. It features glass passivated pellet chip junction, low switching losses, and high forward surge capability (250 A), making it suitable for high-frequency rectification in DC/DC converters and switching mode power supplies.

For engineers reviewing the FESB16AT-E3/45 datasheet, FESB16AT-E3/45 pinout, FESB16AT-E3/45 application, or FESB16AT-E3/45 equivalent, key selection criteria include its 35 ns trr, 0.975 V forward voltage at 16 A, TO-263AB thermal resistance of 1.2 °C/W, AEC-Q101 qualification eligibility (via HM3 suffix), and RoHS-compliant matte tin plating.

Technical Context

This device is a single-anode, cathode-connected ultrafast recovery rectifier optimized for high-efficiency power conversion where fast turn-off and low conduction loss are critical. Its 35 ns reverse recovery time and 0.975 V VF at 16 A enable reduced switching losses in 100–500 kHz SMPS topologies.

The FESB16AT-E3/45 uses a glass-passivated silicon junction and is housed in a D2PAK (TO-263AB) thermally enhanced surface-mount package with exposed cathode tab for heatsinking. It meets J-STD-020 MSL Level 1 and JESD 22-B106 solder dip requirements (275 °C, 10 s).

Key Specifications

Parameter	Value and Actual Design Meaning
V_RRM	50 V - Maximum repetitive reverse blocking voltage; defines safe operating range in buck, flyback, or freewheeling configurations.
I_F(AV)	16 A at T_C = 100 °C - Continuous DC output current capability with proper heatsinking; supports mid-power converter designs.
t_rr	35 ns - Ultrafast recovery enables high-frequency operation (>200 kHz) with minimal reverse recovery charge and EMI.
V_F	0.975 V at I_F = 16 A - Low forward drop reduces conduction loss and improves system efficiency at full load.
R_θJC	1.2 °C/W - Junction-to-case thermal resistance allows direct thermal coupling to PCB copper or heatsink; enables compact thermal design.
I_FSM	250 A (8.3 ms half-sine) - High surge rating supports inrush and transient overload conditions without failure.
T_J max.	150 °C - Maximum junction temperature permits reliable operation in industrial ambient environments up to 105 °C with margin.

Pinout & Package

Package: D2PAK (TO-263AB), surface-mount, thermally enhanced with exposed cathode pad (Pin 3/K). Mold compound meets UL 94 V-0. Matte tin-plated leads compliant with J-STD-002 and JESD 22-B102.

Pin/Terminal	Circuit Role	Design Meaning
Pin 1	Anode	Input terminal for forward current flow; connects to switching node or input rail in rectifier/freewheeling applications.
Pin 2	Cathode (lead)	Secondary cathode connection; used for signal sensing or auxiliary routing; not primary thermal path.
Pin 3 / Exposed Pad	Cathode (main)	Primary cathode and thermal interface; must be soldered to large copper pour for optimal R_θJA and reliability.

Key Features

Feature	Design Value
Glass passivated pellet chip junction	Ensures stable long-term reverse leakage (<10 μA at 25 °C) and robust moisture resistance per J-STD-020 MSL Level 1.
Ultrafast 35 ns recovery time	Reduces switching loss and ringing in high-frequency converters, enabling higher efficiency than standard FRDs or Schottky alternatives at >50 V.
RoHS-compliant, matte tin plating	Guarantees solderability per J-STD-002 and whisker resistance per JESD 201 Class 1A, supporting lead-free reflow assembly.
Thermally optimized D2PAK package	1.2 °C/W R_θJC and exposed cathode pad allow >12 W power dissipation with moderate PCB copper area, eliminating need for through-hole mounting.

Applications

Switch-Mode Power Supply Rectifier	DC/DC Converter Freewheeling Diode
Use Scenario: Secondary-side rectification in 100–300 W offline flyback or forward converters operating at 100–250 kHz. IC Role / Device Role / Timing Role: Ultrafast unidirectional current valve converting high-frequency AC from transformer secondary into regulated DC output. Use Value: 35 ns t_rr minimizes reverse recovery energy loss, improving efficiency by ~0.8 % over 75 ns alternatives at 200 kHz.	Use Scenario: Synchronous-buck or non-isolated boost converter output stage where low VF and fast recovery prevent shoot-through and reduce heat rise. IC Role / Device Role / Timing Role: Freewheeling path for inductor current during high-side switch off-time; requires low Q_rr and minimal stored charge. Use Value: 0.975 V V_F at 16 A lowers conduction loss by 1.2 W vs. 1.15 V diodes, reducing thermal stress on 2-layer PCB layouts.
Inverter Output Stage Clamp	Industrial Motor Drive Snubber Diode
Use Scenario: IGBT or MOSFET clamp in 3-phase inverter outputs handling 10–20 A RMS motor currents with PWM frequencies up to 15 kHz. IC Role / Device Role / Timing Role: Fast-recovery clamp diode absorbing inductive kickback energy during switching transitions. Use Value: 250 A I_FSM withstands repeated short-circuit transients; 35 ns t_rr prevents voltage overshoot exceeding 120 % V_RRM.	Use Scenario: Snubber network in variable-frequency drives for HVAC or pump control, operating continuously at 60–85 °C ambient. IC Role / Device Role / Timing Role: Energy-dissipating diode in RC snubber across IGBT collector-emitter, requiring stable leakage and thermal resilience. Use Value: 150 °C T_J max and <500 μA IR at 100 °C ensure stable clamping performance over full industrial temperature range.

Switch-Mode Power Supply Rectifier

DC/DC Converter Freewheeling Diode

Use Scenario: Secondary-side rectification in 100–300 W offline flyback or forward converters operating at 100–250 kHz.

IC Role / Device Role / Timing Role: Ultrafast unidirectional current valve converting high-frequency AC from transformer secondary into regulated DC output.

Use Value: 35 ns t_rr minimizes reverse recovery energy loss, improving efficiency by ~0.8 % over 75 ns alternatives at 200 kHz.

Use Scenario: Synchronous-buck or non-isolated boost converter output stage where low VF and fast recovery prevent shoot-through and reduce heat rise.

IC Role / Device Role / Timing Role: Freewheeling path for inductor current during high-side switch off-time; requires low Q_rr and minimal stored charge.

Use Value: 0.975 V V_F at 16 A lowers conduction loss by 1.2 W vs. 1.15 V diodes, reducing thermal stress on 2-layer PCB layouts.

Inverter Output Stage Clamp

Industrial Motor Drive Snubber Diode

Use Scenario: IGBT or MOSFET clamp in 3-phase inverter outputs handling 10–20 A RMS motor currents with PWM frequencies up to 15 kHz.

IC Role / Device Role / Timing Role: Fast-recovery clamp diode absorbing inductive kickback energy during switching transitions.

Use Value: 250 A I_FSM withstands repeated short-circuit transients; 35 ns t_rr prevents voltage overshoot exceeding 120 % V_RRM.

Use Scenario: Snubber network in variable-frequency drives for HVAC or pump control, operating continuously at 60–85 °C ambient.

IC Role / Device Role / Timing Role: Energy-dissipating diode in RC snubber across IGBT collector-emitter, requiring stable leakage and thermal resilience.

Use Value: 150 °C T_J max and <500 μA IR at 100 °C ensure stable clamping performance over full industrial temperature range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast rectifier applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Vishay FES16AT-E3/45	TO-220AC package; identical electrical specs (50 V, 16 A, 35 ns, 0.975 V); R_θJC = 1.2 °C/W but higher R_θJA due to through-hole mounting.	Preferred for prototyping, lower-volume production, or legacy through-hole PCBs; less efficient thermal transfer without heatsink.	Select when mechanical mounting constraints require through-hole or when heatsink attachment is mandatory.
ON Semiconductor MUR1620CTG	200 V V_RRM, dual common-cathode configuration, 60 ns t_rr, 1.1 V V_F; TO-220 package; not AEC-Q101 qualified.	Suitable for higher-voltage 200 V bus systems but slower recovery increases switching loss at >100 kHz.	Choose only if 200 V rating is required and frequency ≤80 kHz; avoid for high-density SMPS where 35 ns advantage matters.

Compared with FES16AT-E3/45 and MUR1620CTG, the FESB16AT-E3/45 delivers superior high-frequency efficiency via its 35 ns recovery and D2PAK thermal performance, while maintaining drop-in compatibility in surface-mount power stages where board space and thermal management are constrained.

Availability

FESB16AT-E3/45 is available at Aetrix Electronics and suitable for switching mode power supplies, DC/DC converters, and industrial motor drive designs requiring stable component supply, RoHS compliance, and surface-mount thermal scalability.

Supply support for FESB16AT-E3/45 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Intertechnology is a global manufacturer of discrete semiconductors and passive components, headquartered in Malvern, PA, with design and manufacturing operations across the Americas, Europe, and Asia.

The FESB16AT-E3/45 belongs to Vishay's FESB16xT ultrafast rectifier family, engineered specifically for high-efficiency, high-frequency power conversion in automotive-qualified (HM3), industrial, and commercial power supplies.

FAQ

What is the maximum junction temperature rating for the FESB16AT-E3/45?

The FESB16AT-E3/45 has a maximum junction temperature (T_J) rating of 150 °C. This specification ensures reliable operation in industrial environments where ambient temperatures reach 105 °C, provided thermal design maintains junction temperature below this limit. The D2PAK package's 1.2 °C/W R_θJC enables effective heat transfer to PCB copper or external heatsinks. Derating curves in the Vishay datasheet (Document 88599) define safe operating current versus case temperature for FESB16AT-E3/45.

Is the FESB16AT-E3/45 RoHS-compliant and halogen-free?

Yes, the FESB16AT-E3/45 is RoHS-compliant per EU Directive 2011/65/EU, with matte tin-plated leads and UL 94 V-0 molding compound. However, it is not halogen-free - that designation applies only to parts with the "M3" or "HM3" suffix (e.g., FESB16AT-M3/I). The "E3" suffix indicates commercial-grade RoHS compliance without halogen-free certification. Full material declarations for FESB16AT-E3/45 are available in Vishay's compliance documentation (Doc. 99912).

What is the reverse recovery time (t_rr) of the FESB16AT-E3/45 and how is it measured?

The FESB16AT-E3/45 has a typical reverse recovery time (t_rr) of 35 ns, measured under standardized conditions: I_F = 0.5 A, I_R = 1.0 A, and I_rr = 0.25 A. This value is confirmed in Vishay's datasheet (Doc. 88599, page 2) for the FESB16xT series at 50 V rating. The 35 ns t_rr reflects rapid carrier recombination in the glass-passivated silicon junction, directly enabling high-frequency switching with low recovery loss in FESB16AT-E3/45 applications.

Can the FESB16AT-E3/45 be used as a direct replacement for the FES16AT-E3/45?

No - the FESB16AT-E3/45 and FES16AT-E3/45 share identical electrical specifications (50 V V_RRM, 16 A I_F(AV), 35 ns t_rr, 0.975 V V_F) but differ in package: FESB16AT-E3/45 uses D2PAK (TO-263AB), while FES16AT-E3/45 uses TO-220AC. They are not pin-compatible or drop-in replacements. PCB layout, thermal management, and assembly process must be redesigned for surface-mount versus through-hole. Both are valid for same electrical functions, but mechanical integration differs.

Does the FESB16AT-E3/45 meet AEC-Q101 qualification standards?

The FESB16AT-E3/45 itself is not AEC-Q101 qualified; qualification applies only to variants with the "HM3" suffix (e.g., FESB16ATHM3/I). The "E3" suffix denotes commercial-grade RoHS compliance. For automotive applications requiring AEC-Q101, designers must specify the HM3 version, which undergoes additional stress testing including temperature cycling, HTRB, and ESD per AEC-Q101 Rev D. FESB16AT-E3/45 remains suitable for industrial and commercial use where automotive qualification is not mandated.

FESB16AT-E3/45 Specifications

Product attributes: Attribute value

Manufacturer:: Vishay General Semiconductor - Diodes Division

Series:: -

Package/Case:: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Packaging:: Tube

Product Status:: Obsolete

Technology:: Standard

Voltage - DC Reverse (Vr) (Max):: 50 V

Current - Average Rectified (Io):: 16A

Voltage - Forward (Vf) (Max) @ If:: 975 mV @ 16 A

Speed:: Fast Recovery =< 500ns, > 200mA (Io)

Reverse Recovery Time (trr):: 35 ns

Current - Reverse Leakage @ Vr:: 10 µA @ 50 V

Capacitance @ Vr, F:: 175pF @ 4V, 1MHz

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: TO-263AB (D2PAK)

Operating Temperature - Junction:: -65°C ~ 150°C

FESB16AT-E3/45 FAQ

1.How can I place an order for FESB16AT-E3/45 through Aetrix?

Please submit a Request for Quotation (RFQ) for FESB16AT-E3/45 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for FESB16AT-E3/45 reliable?

The price and inventory of FESB16AT-E3/45 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FESB16AT-E3/45 is usually 5 days.

3.What payment methods are accepted for FESB16AT-E3/45?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FESB16AT-E3/45 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for FESB16AT-E3/45?

FESB16AT-E3/45 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your FESB16AT-E3/45 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for FESB16AT-E3/45?

For technical support, including FESB16AT-E3/45 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FESB16AT-E3/45 requirements.

6.How does Aetrix verify that FESB16AT-E3/45 is sourced from the original manufacturer or authorized distributors?

All FESB16AT-E3/45 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FESB16AT-E3/45 meets industry standards.

7.What is the process for return or replacement of FESB16AT-E3/45?

All FESB16AT-E3/45 units undergo pre-shipment inspection (PSI). If there is an issue with FESB16AT-E3/45, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The FESB16AT-E3/45 part is unused and in its original packaging.

Return procedure for FESB16AT-E3/45:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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