Vishay General Semiconductor - Diodes Division FESB8HTHE3_A/I
- Part No.:
- FESB8HTHE3_A/I
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- Single Diodes
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
FESB8HTHE3_A/I.pdf
- Description:
- DIODE GEN PURP 500V 8A TO263AB
- Quantity:
- Payment:

- Shipping:

Inventory:5,387
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
FESB8HTHE3_A/I from Vishay General Semiconductor is an ultrafast plastic rectifier diode in TO-263AB (D²PAK) package, rated for 500 V repetitive peak reverse voltage (VRRM), 8.0 A average forward current (IF(AV)), and 35 ns reverse recovery time (trr). It serves as a high-efficiency freewheeling or output rectifier in high-frequency switching power supplies and DC-DC converters.
For engineers reviewing the FESB8HTHE3_A/I datasheet, FESB8HTHE3_A/I pinout, FESB8HTHE3_A/I application, or FESB8HTHE3_A/I equivalent, key selection criteria include its 500 V blocking capability, low 0.95 V forward voltage at 8.0 A, 125 A surge rating, 150 °C max junction temperature, and RoHS-compliant, consumer-grade (E3 suffix) construction with JESD201 Class 1A whisker resistance.
Technical Context
This device is a single-die, glass-passivated planar junction silicon rectifier optimized for high-speed switching. Its 35 ns trr and low stored charge enable minimal switching losses in hard-switched topologies operating up to several hundred kHz.
Thermally, it features a typical junction-to-case thermal resistance (RθJC) of 2.2 °C/W when mounted on a heatsink via the exposed cathode tab (Pin 2), supporting continuous 8.0 A conduction at TC = 100 °C without derating beyond standard curves.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 500 V - Sustains 500 V repetitive reverse voltage; suitable for 375 V DC bus applications with 25 % margin. |
| IF(AV) | 8.0 A at TC = 100 °C - Continuous forward current rating under heatsink-cooled conditions. |
| trr | 35 ns - Ultrafast recovery enables high-frequency operation with low turn-off loss in SMPS. |
| VF | 0.95 V at IF = 8.0 A - Low conduction loss improves system efficiency and reduces thermal load. |
| IFSM | 125 A - Withstands 8.3 ms half-sine surge; supports inrush and fault-current handling in power stages. |
| TJ max. | 150 °C - Enables reliable operation in industrial ambient environments with proper thermal design. |
| RθJC | 2.2 °C/W - Confirmed for TO-263AB package; defines minimum heatsink requirement for thermal management. |
Pinout & Package
Package: TO-263AB (D²PAK), surface-mount, with isolated mounting tab (cathode). Matte tin-plated terminals, UL 94V-0 epoxy, MSL Level 1 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode | Input terminal for forward current flow; connects to switching node or transformer secondary. |
| Pin 2 / Tab | Cathode | Output terminal and thermally conductive heatsink interface; electrically isolated from PCB ground unless explicitly connected. |
Key Features
| Feature | Design Value |
|---|---|
| Glass passivated chip junction | Enhances long-term reliability and moisture resistance vs. epoxy-passivated alternatives. |
| Ultrafast 35 ns recovery | Reduces switching loss and EMI generation in 100–500 kHz SMPS designs. |
| Low 0.95 V forward drop at 8 A | Lowers conduction loss by ~15 % compared to standard fast rectifiers with VF ≥ 1.1 V. |
| JESD201 Class 1A whisker resistance | Validated for consumer-grade applications where tin whisker growth must be mitigated. |
| RoHS-compliant, UL 94V-0 epoxy | Meets environmental compliance and flammability safety requirements for end equipment. |
Applications
| AC-DC Power Adapters | DC-DC Buck Converters |
|---|---|
Use Scenario: Secondary-side rectification in 65–100 W offline flyback adapters powering laptops and monitors. IC Role / Device Role / Timing Role: Output rectifier converting high-frequency transformer AC to regulated DC; operates synchronously with MOSFET switching edge. Use Value: 35 ns trr minimizes reverse recovery ringing and improves light-load efficiency over standard FRDs. |
Use Scenario: Freewheeling path in 12 V input, 3.3/5 V output buck converters for FPGA or microprocessor core rails. IC Role / Device Role / Timing Role: Unidirectional current path during low-side switch off-time; handles peak inductor current up to 8 A. Use Value: 0.95 V VF reduces conduction loss by >0.5 W vs. 1.2 V alternatives at full load, easing thermal design. |
| Industrial Motor Drives | LED Driver Power Stages |
Use Scenario: Snubber and clamp rectification in 24–48 V H-bridge gate driver auxiliary supplies. IC Role / Device Role / Timing Role: Fast recovery clamp diode absorbing inductive kickback energy during MOSFET commutation. Use Value: 125 A IFSM withstands repeated transient surges without degradation in motor control feedback loops. |
Use Scenario: Constant-current output rectification in isolated LED drivers for street lighting (50–150 W). IC Role / Device Role / Timing Role: High-reliability output rectifier operating continuously at elevated ambient temperatures (>70 °C). Use Value: 150 °C TJ max and 2.2 °C/W RθJC support stable operation in sealed, thermally constrained enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultrafast rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH8R06D | Same VRRM (600 V), higher VF (1.7 V @ 8 A), slower trr (60 ns), TO-220AC package. | Requires heatsink mounting and layout revision; better suited for lower-frequency (<100 kHz), higher-voltage margin designs. | Select when 600 V rating is mandatory and thermal budget allows higher VF penalty. |
| ON Semi MUR860CT | Dual common-cathode configuration, 600 V, 8 A per diode, 60 ns trr, TO-220AB package. | Not single-diode; requires dual-output or center-tapped transformer topology; not pin-compatible. | Choose only for dual-channel rectification needs; not a direct functional substitute for FESB8HTHE3_A/I's single-anode/single-cathode topology. |
Compared with STTH8R06D and MUR860CT, FESB8HTHE3_A/I delivers superior high-frequency efficiency due to its 35 ns trr and 0.95 V VF, while its TO-263AB footprint enables compact, surface-mount power stage layouts without through-hole assembly.
Availability
FESB8HTHE3_A/I is available at Aetrix Electronics and suitable for high-frequency switching power supplies, DC-DC converters, and industrial motor drive auxiliary supplies requiring stable component supply and RoHS-compliant manufacturing.
Supply support for FESB8HTHE3_A/I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay General Semiconductor is a global leader in discrete semiconductors, specializing in diodes, rectifiers, MOSFETs, and optoelectronics with emphasis on reliability, efficiency, and application-specific optimization.
The FES(F,B)8xT family targets cost-sensitive, high-volume power conversion applications demanding ultrafast recovery, low VF, and robust surge capability - especially in consumer and industrial SMPS designs.
FAQ
What is the maximum junction temperature rating for the FESB8HTHE3_A/I?
The FESB8HTHE3_A/I has a maximum junction temperature (TJ) of 150 °C, verified per Vishay Document Number 88600. This rating allows operation in demanding thermal environments when properly heatsinked via the cathode tab. Derating curves in the FESB8HTHE3_A/I datasheet define safe current limits versus case temperature, ensuring long-term reliability at elevated ambient conditions.
Is the FESB8HTHE3_A/I RoHS-compliant and lead-free?
Yes, the FESB8HTHE3_A/I is RoHS-compliant per Directive 2011/65/EU and WEEE 2002/96/EC, with matte tin-plated leads and lead-free solder compatibility confirmed in the official Vishay documentation. The "E3" suffix denotes consumer-grade qualification including JESD201 Class 1A whisker testing, and all materials meet Vishay's Material Category Policy for hazardous substance restrictions.
What is the reverse recovery time (trr) of the FESB8HTHE3_A/I, and under what conditions is it measured?
The FESB8HTHE3_A/I has a maximum reverse recovery time (trr) of 35 ns, measured at IF = 0.5 A, IR = 1.0 A, and Irr = 0.25 A per Vishay Document Number 88600. This ultrafast value is critical for minimizing switching losses in high-frequency power converters and distinguishes FESB8HTHE3_A/I from standard fast recovery diodes with trr > 50 ns.
Can the FESB8HTHE3_A/I be used as a direct replacement for the FES8HT-E3/45 in TO-220AC package?
No - the FESB8HTHE3_A/I uses TO-263AB (D²PAK) packaging with surface-mount cathode tab, whereas FES8HT-E3/45 is in through-hole TO-220AC. Though electrically identical in VRRM, IF(AV), and trr, the FESB8HTHE3_A/I requires PCB land pattern and thermal design changes. It is a functional alternative, not a pin-compatible drop-in replacement.
What is the thermal resistance from junction to case (RθJC) for the FESB8HTHE3_A/I?
The FESB8HTHE3_A/I has a typical junction-to-case thermal resistance (RθJC) of 2.2 °C/W, specified for the TO-263AB package in Vishay Document Number 88600. This value assumes proper mounting of the cathode tab to a heatsink or copper pour; actual thermal performance depends on interface material, clamping force, and PCB copper area.
FESB8HTHE3_A/I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 500 V
- Current - Average Rectified (Io):
- 8A
- Voltage - Forward (Vf) (Max) @ If:
- 1.5 V @ 8 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 50 ns
- Current - Reverse Leakage @ Vr:
- 10 µA @ 500 V
- Capacitance @ Vr, F:
- -
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263AB (D2PAK)
- Operating Temperature - Junction:
- -55°C ~ 150°C
FESB8HTHE3_A/I FAQ
1.How can I place an order for FESB8HTHE3_A/I through Aetrix?
Please submit a Request for Quotation (RFQ) for FESB8HTHE3_A/I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FESB8HTHE3_A/I reliable?
The price and inventory of FESB8HTHE3_A/I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FESB8HTHE3_A/I is usually 5 days.
3.What payment methods are accepted for FESB8HTHE3_A/I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FESB8HTHE3_A/I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FESB8HTHE3_A/I?
FESB8HTHE3_A/I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FESB8HTHE3_A/I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FESB8HTHE3_A/I?
For technical support, including FESB8HTHE3_A/I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FESB8HTHE3_A/I requirements.
6.How does Aetrix verify that FESB8HTHE3_A/I is sourced from the original manufacturer or authorized distributors?
All FESB8HTHE3_A/I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FESB8HTHE3_A/I meets industry standards.
7.What is the process for return or replacement of FESB8HTHE3_A/I?
All FESB8HTHE3_A/I units undergo pre-shipment inspection (PSI). If there is an issue with FESB8HTHE3_A/I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FESB8HTHE3_A/I part is unused and in its original packaging.
Return procedure for FESB8HTHE3_A/I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
FESB8HTHE3_A/I Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
