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onsemi FIN1019MX
- Part No.:
- FIN1019MX
- Manufacturer:
- onsemi
- Package:
- -
- Datasheet:
-
FIN1019MX.pdf
- Description:
- LINE TRANSCEIVER, 1 FUNC, 1 DRIV
- Quantity:
- Payment:
- Shipping:
Inventory:33,418
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Product details
Overview
FIN1019MX from Fairchild Semiconductor is a 3.3V LVDS high-speed differential driver/receiver IC integrating both transmitter and receiver functions in a single 14-lead SOIC package. It converts LVTTL inputs to LVDS differential outputs (350 mV typical swing) and LVDS inputs to LVTTL outputs with 100 mV differential input sensitivity, supporting >400 Mbps data rates for clock/data interconnects in backplane and FPGA-to-FPGA links.
For engineers reviewing the FIN1019MX datasheet, pinout, applications, or equivalent options, key selection considerations include its flow-through pinout for simplified PCB routing, fail-safe operation under open/short/terminated conditions, 0.5 ns max pulse skew, 2.5 ns max propagation delay, and compliance with TIA/EIA-644 LVDS standard.
Technical Context
The FIN1019MX implements dual-channel LVDS interface logic: a driver stage accepting LVTTL DIN and DE signals to generate complementary DOUT+/DOUT− outputs, and a receiver stage converting RIN+/RIN− differential inputs into LVTTL ROUT under RE control. Both sections operate from a single 3.3 V supply (3.0–3.6 V range) and share power-off protection and input clamp diodes.
Its timing architecture delivers matched propagation paths-tPLH/tPHL ≤ 2.5 ns for receiver, tPLHD/tPHLD ≤ 1.5 ns for driver-with pulse skew ≤ 0.5 ns and part-to-part skew ≤ 1.0 ns. Fail-safe logic ensures ROUT = LOW during RIN+ = RIN− (open), RIN+ = RIN− = VCC or GND (shorted), or properly terminated 100 Ω loads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | >400 Mbps - supports high-bandwidth serial links without signal integrity degradation |
| Differential Output Swing | 250–450 mV - meets LVDS standard voltage range for noise margin and EMI control |
| Input Sensitivity | ±100 mV differential threshold - enables reliable detection of low-amplitude LVDS signals |
| Propagation Delay | ≤2.5 ns (receiver), ≤1.5 ns (driver) - ensures sub-nanosecond timing alignment in synchronous systems |
| Pulse Skew | ≤0.5 ns - minimizes duty cycle distortion in clock distribution networks |
| Supply Voltage Range | 3.0 V to 3.6 V - compatible with standard 3.3 V logic rails and tolerant of rail variation |
| Operating Temperature | −40°C to +85°C - qualified for industrial-grade embedded and communications equipment |
Pinout & Package
FIN1019MX is packaged in a 14-lead SOIC (JEDEC MS-012, 0.150" narrow body, Package Number M14A), with exposed pad omitted and NC pin electrically isolated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DIN | LVTTL Data Input | Accepts single-ended digital input referenced to VCC/GND; drives internal driver stage |
| DE | Driver Enable (Active HIGH) | Controls DOUT+/DOUT− output state: HIGH enables differential output, LOW forces high-impedance |
| RIN+ | Non-inverting LVDS Input | Positive leg of differential receiver input pair; requires 100 Ω termination to VCC/2 |
| RIN− | Inverting LVDS Input | Negative leg of differential receiver input pair; forms balanced interface with RIN+ |
| RE | Receiver Enable (Active LOW) | Controls ROUT output state: LOW enables LVTTL output, HIGH disables (high-Z) |
| DOUT+ | Non-inverting LVDS Output | Positive leg of differential driver output; must be terminated with 100 Ω across DOUT+/DOUT− |
| DOUT− | Inverting LVDS Output | Negative leg of differential driver output; completes current-mode LVDS signaling path |
| ROUT | LVTTL Receiver Output | Single-ended TTL-compatible output reflecting RIN+/RIN− differential state |
| VCC | Power Supply | 3.3 V supply input; bypassing with 0.1 µF ceramic capacitor near pin required |
| GND | Ground | Reference return for all I/O and internal circuitry; low-inductance connection critical |
| NC | No Connect | Unbonded die pad; must remain unconnected on PCB to avoid parasitic coupling |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through pinout | Input pins (DIN, DE, RIN+, RIN−, RE) on one side and outputs (DOUT+, DOUT−, ROUT) on opposite side - reduces trace crossovers and layer count |
| Fail-safe receiver logic | Guarantees ROUT = LOW under open-circuit, shorted, or 100 Ω-terminated conditions - prevents undefined states in cable disconnect scenarios |
| Power-off protection | IOFF ≤ ±20 µA when VCC = 0 V - prevents back-driving of powered systems during hot-swap or partial power-down |
| LVDS standard compliance | Fully meets TIA/EIA-644 specification for voltage levels, timing, and common-mode range - ensures interoperability with industry-standard LVDS transceivers |
| Low EMI emission | Current-mode differential signaling with 350 mV swing and tight skew - reduces radiated emissions vs. single-ended interfaces at same data rate |
Applications
| High-Speed Backplane Interconnect | FPGA-to-FPGA Serial Link |
|---|---|
Use Scenario: Point-to-point data transmission across 10+ inch PCB backplanes between line cards in telecom chassis. IC Role / Device Role / Timing Role: Bidirectional LVDS transceiver providing robust noise immunity and deterministic latency for control/status packets. Use Value: 0.5 ns pulse skew and 2.5 ns max propagation delay enable precise timing closure across distributed clock domains. |
Use Scenario: High-bandwidth configuration data transfer between adjacent FPGAs on a dense compute module. IC Role / Device Role / Timing Role: Level-shifting bridge converting 3.3 V LVTTL FPGA I/O to low-power LVDS physical layer. Use Value: >400 Mbps capability supports JESD204B-like throughput without requiring dedicated serializer/deserializer IP. |
| Industrial Camera Interface | Test Equipment Digital I/O Module |
Use Scenario: Pixel data streaming from CMOS image sensor to frame grabber over flexible ribbon cable. IC Role / Device Role / Timing Role: LVDS line driver/receiver ensuring signal integrity across noisy factory-floor environments. Use Value: Fail-safe operation maintains defined ROUT state during cable vibration-induced disconnection, preventing system lockup. |
Use Scenario: Digital pattern generator channel interfacing with DUT using differential signaling for noise rejection. IC Role / Device Role / Timing Role: Programmable LVDS translator enabling configurable drive strength and enable control per channel. Use Value: Independent DE and RE controls allow dynamic channel gating without affecting adjacent signal paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LVDS driver/receiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN65LVDS047DR | Separate driver and receiver in one package; no integrated enable controls (DE/RE); higher ICC (16 mA typical) | Requires external logic for enable sequencing; better suited for fixed-configuration links | Select when board space allows discrete enable logic and higher drive current is needed |
| MAX3045CSA+ | 3.3 V LVDS transceiver with integrated 100 Ω termination resistors; no NC pin; different pinout | Reduces external component count but increases thermal load; not flow-through layout compatible | Select when minimizing BOM count outweighs PCB layout flexibility requirements |
Compared with SN65LVDS047DR and MAX3045CSA+, the FIN1019MX provides integrated enable controls (DE/RE), flow-through pinout for compact routing, and lower quiescent current (7.0 mA disabled), making it optimal for space-constrained, dynamically controlled LVDS links.
Availability
FIN1019MX is available at Aetrix Electronics and suitable for high-speed backplane interconnects, FPGA-to-FPGA serial links, industrial camera interfaces, and test equipment digital I/O modules requiring stable component supply and long-term industrial availability.
Supply support for FIN1019MX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Fairchild Semiconductor was a U.S.-based analog and power IC manufacturer acquired by ON Semiconductor in 2016; its legacy products remain widely deployed in industrial and communications infrastructure.
The FIN1019MX belongs to Fairchild's LVDS interface product line, designed specifically for noise-immune, high-speed point-to-point digital interconnects in telecom, computing, and industrial automation systems.
FAQ
What is the maximum data rate supported by the FIN1019MX?
FIN1019MX supports greater than 400 Mbps data rate as specified in its datasheet. This performance is achieved under standard operating conditions (VCC = 3.3 V, TA = 25°C) with proper 100 Ω differential termination and controlled PCB impedance. The device maintains signal integrity up to this rate due to its low propagation delay (≤1.5 ns driver, ≤2.5 ns receiver) and tight pulse skew (≤0.5 ns), making FIN1019MX suitable for high-speed serial links in FPGA and ASIC interconnects.
Does the FIN1019MX require external termination resistors?
Yes, the FIN1019MX requires a 100 Ω differential termination resistor across DOUT+ and DOUT− for proper LVDS driver operation, and similarly across RIN+ and RIN− for receiver input termination. These resistors are not integrated and must be placed as close as possible to the receiver input or driver output pins. The FIN1019MX itself does not include internal termination, unlike some newer LVDS transceivers such as MAX3045CSA+.
How does the fail-safe feature of the FIN1019MX operate?
The FIN1019MX fail-safe feature guarantees that the receiver output ROUT remains LOW under three invalid input conditions: open-circuit (RIN+ = RIN−), shorted (RIN+ = RIN− = VCC or GND), or properly terminated (100 Ω across RIN+/RIN−). This behavior is implemented via internal biasing and is independent of RE state. It ensures deterministic system behavior during cable faults or connector disengagement, a critical requirement in industrial and telecom applications using FIN1019MX.
What is the purpose of the NC pin on the FIN1019MX SOIC package?
The NC (No Connect) pin on the FIN1019MX 14-lead SOIC package is an unconnected die pad with no internal bond wire or circuit connection. It must remain unconnected on the PCB layout to prevent unintended coupling, ground loops, or solder bridging. Unlike thermal pads, this NC pin serves no electrical or thermal function and is included solely for mechanical symmetry in the package mold; leaving it floating is mandatory for reliable FIN1019MX operation.
Can the FIN1019MX operate with a 5 V supply?
No, the FIN1019MX is strictly a 3.3 V device with recommended supply range of 3.0 V to 3.6 V. Its absolute maximum VCC rating is +4.6 V, and operation above 3.6 V risks parametric shift or reliability degradation. The datasheet specifies all DC and AC characteristics-including VOH/VOL, VOD, and propagation delay-at VCC = 3.3 V. Using 5 V violates the device's design envelope and may damage FIN1019MX or cause non-compliant LVDS signaling.
FIN1019MX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- -
- Number of Elements:
- -
- Number of Bits per Element:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Output High, Low:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
FIN1019MX FAQ
1.How can I place an order for FIN1019MX through Aetrix?
Please submit a Request for Quotation (RFQ) for FIN1019MX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FIN1019MX reliable?
The price and inventory of FIN1019MX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FIN1019MX is usually 5 days.
3.What payment methods are accepted for FIN1019MX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FIN1019MX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FIN1019MX?
FIN1019MX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FIN1019MX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FIN1019MX?
For technical support, including FIN1019MX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FIN1019MX requirements.
6.How does Aetrix verify that FIN1019MX is sourced from the original manufacturer or authorized distributors?
All FIN1019MX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FIN1019MX meets industry standards.
7.What is the process for return or replacement of FIN1019MX?
All FIN1019MX units undergo pre-shipment inspection (PSI). If there is an issue with FIN1019MX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FIN1019MX part is unused and in its original packaging.
Return procedure for FIN1019MX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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