Infineon Technologies FM1808B-SG
- Part No.:
- FM1808B-SG
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
FM1808B-SG.pdf
- Description:
- IC FRAM 256KBIT PARALLEL 28SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:2,389
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
FM1808B-SG from Infineon Technologies (formerly Cypress) is a 256-Kbit (32 K × 8) parallel-interface ferroelectric RAM (F-RAM) with NoDelay™ writes, 1014 read/write endurance, and 151-year data retention. It functions as a nonvolatile drop-in replacement for SRAM in industrial data logging systems requiring rapid, frequent writes without battery backup.
For engineers reviewing the FM1808B-SG datasheet, FM1808B-SG pinout, FM1808B-SG application, or FM1808B-SG equivalent, key selection criteria include its 70-ns access time, 4.5–5.5 V operation, industrial temperature range (–40 °C to +85 °C), and compatibility with standard SRAM timing and address/data bus protocols.
Technical Context
The FM1808B-SG uses a ferroelectric memory array organized as 32,768 × 8 bytes, with all operations initiated by the falling edge of CE to latch address and trigger pre-charge. Unlike EEPROM or flash, it performs true byte-level writes at bus speed-no internal write cycles, no polling, and no delay between successive read/write operations.
Its control logic supports both CE-controlled and WE-controlled write modes, with identical 70-ns access time and 130-ns cycle time for reads and writes. The device requires CE strobing for every access to ensure row-level pre-charge and address latching-eliminating SRAM-style static CE usage but simplifying controller timing compared to legacy nonvolatile memories.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 256 Kbit (32 K × 8 bytes); supports full byte-addressable nonvolatile storage without block erasure. |
| Access time | 70 ns max; enables direct interface with 14-MHz+ microcontrollers without wait states. |
| Endurance | 1014 read/write cycles; supports continuous logging at ≥100 Hz for >30 years per memory location. |
| Data retention | 151 years at +85 °C; eliminates need for periodic refresh or backup power during long-term storage. |
| Supply voltage | 4.5 V to 5.5 V; compatible with standard 5-V industrial logic rails and avoids level-shifting overhead. |
| Operating temp | –40 °C to +85 °C; qualified for deployment in uncontrolled industrial enclosures and automotive under-hood proximity. |
| Active current | 15 mA max at 5 V/70 ns; reduces thermal load in dense memory subsystems versus battery-backed SRAM. |
Pinout & Package
FM1808B-SG is housed in a 28-pin Small Outline Integrated Circuit (SOIC) package with gull-wing leads, RoHS-compliant, and designed for reflow soldering on standard PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address inputs | 15-bit parallel address bus; latched on falling edge of CE-allows address bus reuse mid-cycle. |
| DQ0–DQ7 | Data I/O lines | 8-bit bidirectional data path; tristated when OE = HIGH or during pre-charge (CE = HIGH). |
| CE | Chip Enable | Active-low enable; falling edge initiates address latch and memory cycle; must strobe for every access. |
| WE | Write Enable | Active-low write control; falling edge (after CE) switches ongoing read to write mode within same cycle. |
| OE | Output Enable | Active-low output driver control; enables DQ bus drive only when valid read data is ready. |
| VDD | Power supply | 4.5–5.5 V primary supply; powers core logic and F-RAM array-no separate VBACKUP required. |
| VSS | Ground | System reference ground; must be low-impedance connection to minimize noise-induced bit errors. |
| NC | No connect | Internally unconnected pin; must remain floating-no external bias or tie-off permitted. |
Key Features
| Feature | Design Value |
|---|---|
| NoDelay™ write architecture | Writes complete in ≤70 ns-no firmware wait loops, no status polling, and no bus arbitration delays. |
| Ferroelectric nonvolatility | Retains data without power, battery, capacitor, or external energy storage-monolithic reliability. |
| SRAM-compatible timing & pinout | Direct replacement for 32 K × 8 parallel SRAMs (e.g., IS61LV256AL) without PCB or firmware changes. |
| Row-based endurance optimization | 64-bit row structure allows software-aware data placement to extend effective lifetime beyond 1014 cycles. |
| Pre-charge synchronization | Internal pre-charge triggered by CE HIGH ensures consistent timing margins across temperature and voltage. |
Applications
| Industrial Data Logger | Smart Meter Firmware Storage |
|---|---|
Use Scenario: Continuous timestamped sensor sampling (e.g., temperature, pressure) at 100 Hz into circular buffer memory. IC Role / Device Role / Timing Role: Nonvolatile byte-addressable scratchpad replacing BBSRAM; stores raw samples until batch upload. Use Value: Eliminates battery leakage, cold-start corruption, and mechanical rework-enabling 15+ year field life without maintenance. | Use Scenario: Storing tariff tables, calibration coefficients, and event logs in electricity/water/gas meters. IC Role / Device Role / Timing Role: Field-updatable configuration store with guaranteed write integrity during brownout or grid disconnect. Use Value: Withstands >106 annual writes and retains data through 100,000+ power cycles-meeting ANSI C12.19 and DLMS/COSEM requirements. |
| PLC I/O Module Configuration | Medical Diagnostic Device Settings |
Use Scenario: Storing channel mapping, scaling factors, and alarm thresholds in modular programmable logic controllers. IC Role / Device Role / Timing Role: Fast-write configuration register bank accessed via parallel bus from ARM Cortex-M4 host MCU. Use Value: Enables sub-millisecond parameter updates during runtime-critical for adaptive control loop tuning without system freeze. | Use Scenario: Preserving user-selected imaging parameters (gain, exposure, ROI) and calibration offsets between power cycles in portable ultrasound units. IC Role / Device Role / Timing Role: Fail-safe settings store synchronized to button press-guarantees immediate restore on wake-up. Use Value: Meets IEC 62304 Class C safety requirements via deterministic write completion and zero-latency nonvolatility. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile parallel memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY14B102QN-SXIT | Same F-RAM technology, 256 Kbit, but uses SPI interface instead of parallel; 10 MHz max clock vs. 14 MHz effective throughput. | Requires serial-to-parallel bridge or MCU SPI peripheral-unsuitable for legacy SRAM-bus designs. | Select only if board space or pin count constraints outweigh need for SRAM pin compatibility. |
| IS61LV256AL-10TLI | Standard 32 K × 8 SRAM; volatile; requires external battery/capacitor for data retention; 10 ns faster access but no inherent nonvolatility. | Valid only where backup power infrastructure exists and maintenance access is feasible. | Choose only when cost sensitivity outweighs reliability, lifetime, and design simplicity goals. |
Compared with CY14B102QN-SXIT and IS61LV256AL-10TLI, FM1808B-SG uniquely delivers SRAM-equivalent timing *and* monolithic nonvolatility-removing battery management complexity while preserving existing parallel bus layouts and real-time write performance.
Availability
FM1808B-SG is available at Aetrix Electronics and suitable for industrial data loggers, smart meter firmware storage, and PLC I/O module configuration requiring stable component supply over extended production lifecycles.
Supply support for FM1808B-SG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for industrial, automotive, and IoT applications.
The FM1808B-SG belongs to Infineon's F-RAM product line, engineered specifically to replace battery-backed SRAM and legacy EEPROM in high-write-frequency, mission-critical embedded systems where data integrity and longevity are non-negotiable.
FAQ
Is FM1808B-SG pin-compatible with standard 28-pin SOIC SRAMs like the IS61LV256AL?
Yes-FM1808B-SG uses an industry-standard 32 K × 8 parallel pinout with identical A0–A14, DQ0–DQ7, CE, WE, OE, VDD, and VSS assignments. However, CE must be actively strobed (not held low), and OE timing must respect the 70-ns access window. No PCB redesign is needed, but minor firmware timing adjustments may apply.
Does FM1808B-SG require external circuitry for data retention during power loss?
No-FM1808B-SG is inherently nonvolatile due to its ferroelectric memory cell structure. It retains data for 151 years at +85 °C without batteries, supercapacitors, or auxiliary power sources. System-level power sequencing only requires ensuring VDD stays within 4.5–5.5 V during active operation.
What is the significance of the "pre-charge operation" in FM1808B-SG timing?
The pre-charge operation is an internal reset phase triggered when CE rises HIGH. It prepares the memory array for the next access and enforces minimum timing margins. Unlike SRAM, FM1808B-SG mandates this phase-requiring CE to go HIGH between cycles. This ensures reliable row activation and eliminates cumulative timing drift across temperature and voltage.
Can FM1808B-SG be used in place of EEPROM for firmware storage in microcontroller boot loaders?
Yes-but only where byte-level random writes and fast update rates are prioritized over absolute density efficiency. FM1808B-SG supports unlimited writes at bus speed, making it ideal for dynamic configuration storage or runtime parameter logging. For pure firmware image storage (infrequent large-block writes), serial NOR flash may offer higher density at lower cost.
FM1808B-SG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- F-RAM™
- Package/Case:
- 28-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FRAM
- Technology:
- FRAM (Ferroelectric RAM)
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 130ns
- Access Time:
- -
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SOIC
FM1808B-SG FAQ
1.How can I place an order for FM1808B-SG through Aetrix?
Please submit a Request for Quotation (RFQ) for FM1808B-SG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FM1808B-SG reliable?
The price and inventory of FM1808B-SG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FM1808B-SG is usually 5 days.
3.What payment methods are accepted for FM1808B-SG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FM1808B-SG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FM1808B-SG?
FM1808B-SG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FM1808B-SG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FM1808B-SG?
For technical support, including FM1808B-SG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FM1808B-SG requirements.
6.How does Aetrix verify that FM1808B-SG is sourced from the original manufacturer or authorized distributors?
All FM1808B-SG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FM1808B-SG meets industry standards.
7.What is the process for return or replacement of FM1808B-SG?
All FM1808B-SG units undergo pre-shipment inspection (PSI). If there is an issue with FM1808B-SG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FM1808B-SG part is unused and in its original packaging.
Return procedure for FM1808B-SG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
FM1808B-SG Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

