Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies FM22L16-55-TG

Part No.:
FM22L16-55-TG
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixFM22L16-55-TG.pdf
Description:
IC FRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,140

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

FM22L16-55-TG from Infineon Technologies (formerly Cypress) is a 4-Mbit parallel-interface ferroelectric RAM (F-RAM) organized as 256K × 16, configurable as 512K × 8 via UB/LB controls. It delivers NoDelay™ writes, 100 trillion (10¹⁴) read/write endurance, 151-year data retention, and 55-ns access time. It serves as a drop-in nonvolatile replacement for industrial SRAM in real-time data logging systems requiring frequent, deterministic writes without backup batteries.

For engineers reviewing the FM22L16-55-TG datasheet, FM22L16-55-TG pinout, FM22L16-55-TG application, or FM22L16-55-TG equivalent, key selection criteria include its SRAM-compatible timing, software-configurable block write protection, TSOP-II package compatibility, and guaranteed operation across –40 °C to +85 °C with VDD = 2.7–3.6 V.

Technical Context

The FM22L16-55-TG implements a monolithic ferroelectric memory array with eight 32K × 16 blocks, each independently software write-protectable using a nonvolatile 6-read/3-write address/command sequence. Its internal low-voltage monitor disables memory access when VDD drops below 2.7 V, preventing data corruption.

It supports both CE- and WE-controlled parallel write cycles with identical 55-ns access and 110-ns cycle times for reads and writes. Page mode enables 25-ns cycle access to four column locations per row (A1–A0), and sleep mode reduces current to ≤5 μA via the ZZ pin.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4 Mbit (256K × 16), configurable as 512K × 8 using UB/LB pins
Access Time55 ns - matches standard SRAM timing for seamless drop-in replacement
Endurance10¹⁴ read/write cycles - eliminates wear-out concerns in high-frequency logging
Data Retention151 years at +85 °C - ensures long-term nonvolatility without refresh or backup power
Supply Voltage2.7 V to 3.6 V - compatible with modern 3.3 V industrial logic rails
Operating Temp–40 °C to +85 °C - qualified for extended industrial environments
Active Current8 mA (typ) - enables low-power embedded operation during active memory access

Pinout & Package

FM22L16-55-TG is housed in a 44-pin thin small outline package (TSOP-II, 400-mil width), surface-mount compatible with standard reflow profiles and IPC-7351 design rules.

Pin/TerminalCircuit RoleDesign Meaning
A17–A0Address Inputs18-bit address bus latched on CE falling edge; A1–A0 enable page-mode column access
DQ15–DQ0Data I/O Bus16-bit bidirectional data path; UB/LB control byte-level directionality
CEChip EnableFalling-edge-triggered memory access initiator; latches full address and enables page mode
WEWrite EnableRising edge commits write data; falling edge latches new column address in page mode
OEOutput EnableControls DQ bus drive; HI-Z when HIGH to prevent bus contention and reduce supply transients
UB / LBByte SelectEnable upper (DQ15–DQ8) or lower (DQ7–DQ0) data byte; may be tied LOW if unused
ZZSleep ControlLOW enters ultra-low-power sleep mode (≤5 μA); must be HIGH for normal operation
VDD / VSSPower / Ground2.7–3.6 V supply with internal voltage monitor; VSS referenced to system ground plane

Key Features

FeatureDesign Value
NoDelay™ WritesImmediate nonvolatile storage on rising WE edge - no wait states, polling, or write buffers required
Software Block Write-ProtectEight 32K × 16 sectors individually protected via nonvolatile command sequence - no external hardware or fuses needed
SRAM Pin & Timing CompatibilityIndustry-standard 256K × 16 parallel interface with 55-ns access - direct PCB-level replacement for AS6C4008/IS61LV25616
Monolithic NonvolatilityEliminates battery, capacitor, or EEPROM backup - removes rework, moisture sensitivity, and shock/vibration failure modes
Low-Power Sleep Mode≤5 μA standby current via dedicated ZZ pin - extends battery life in portable industrial recorders

Applications

Industrial Data LoggerSmart Metering Endpoint

Use Scenario: Continuous timestamped sensor sampling (e.g., temperature, pressure) at 100 Hz with power-loss resilience.

IC Role / Device Role / Timing Role: Primary nonvolatile buffer storing raw measurements before batch upload; operates as SRAM-drop-in with deterministic 55-ns writes.

Use Value: Eliminates battery maintenance and avoids EEPROM wear-out - sustains 10+ years of daily 1M-write cycles without degradation.

Use Scenario: Tamper-proof energy consumption logging in utility meters with mandatory 10-year data retention.

IC Role / Device Role / Timing Role: Secure, sector-protected storage for billing-critical kWh registers and event logs; leverages software write-protect for regulatory compliance.

Use Value: Guarantees 151-year retention at +85 °C ambient - exceeds IEC 62056 requirements without thermal derating or refresh overhead.

PLC I/O ModuleMedical Diagnostic Recorder

Use Scenario: Real-time buffering of analog input/output state changes in programmable logic controllers with brownout immunity.

IC Role / Device Role / Timing Role: Volatile-write-equivalent nonvolatile memory interfaced directly to FPGA or microcontroller parallel bus; uses VDD monitor to halt access during undervoltage.

Use Value: Prevents data corruption during line sags - internal low-VDD lockout blocks writes below 2.7 V without external supervisor IC.

Use Scenario: Capturing high-fidelity ECG waveforms during portable patient monitoring where power interruptions are common.

IC Role / Device Role / Timing Role: High-speed, low-latency frame buffer between ADC and wireless transmitter; exploits 25-ns page-mode reads for burst streaming.

Use Value: Enables continuous 10 kS/s waveform capture with zero write latency - no dropped samples during battery swaps or AC dropout.

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile parallel-memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY14B104Q2A-BAISame F-RAM architecture, but 1-Mbit (64K × 16), 48-pin BGA, 45-ns accessLimited density; BGA packaging requires redesign; lacks TSOP-II footprint compatibilitySelect only if board space constraints favor BGA and 1-Mbit capacity suffices
AS6C4008-55TIN4-Mbit battery-backed SRAM; requires external lithium coin cell and supervisor circuitHigher BOM cost, reliability risk from battery leakage/dry-out, and RoHS compliance limitationsChoose only if legacy design mandates exact SRAM behavior and F-RAM qualification is not feasible

Compared with CY14B104Q2A-BAI and AS6C4008-55TIN, FM22L16-55-TG uniquely combines 4-Mbit density, TSOP-II compatibility, monolithic nonvolatility, and 10¹⁴ endurance - enabling simpler, more reliable, and longer-lifecycle designs without battery management or package conversion.

Availability

FM22L16-55-TG is available at Aetrix Electronics and suitable for industrial data loggers, smart metering endpoints, PLC I/O modules, and medical diagnostic recorders requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.

Supply support for FM22L16-55-TG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for industrial, automotive, and IoT applications.

The FM22L16 belongs to Infineon's F-RAM product line, engineered specifically to replace battery-backed SRAM and serial EEPROM in high-endurance, low-latency, nonvolatile data buffering applications.

FAQ

Is FM22L16-55-TG pin-compatible with standard 256K × 16 SRAMs?

Yes - it uses an industry-standard 44-pin TSOP-II footprint and identical signal naming (A0–A17, DQ0–DQ15, CE, OE, WE, UB, LB, VDD, VSS). No PCB redesign is needed for drop-in replacement of devices like IS61LV25616 or AS6C4008, provided VDD range and timing margins align.

Does FM22L16-55-TG require external hardware for write protection?

No - it implements nonvolatile, software-configurable block write protection across eight 32K × 16 sectors. Protection is set via a documented six-read/three-write address/command sequence; no external WP pins, jumpers, or supervisors are required.

How does the NoDelay™ write feature impact system firmware design?

NoDelay™ eliminates all write latency - data is stored nonvolatility on the rising edge of WE with no polling, status checks, or timeout loops. Firmware can issue consecutive writes at full bus speed (110-ns cycle), simplifying real-time logging code and removing EEPROM-style delay dependencies.

Can FM22L16-55-TG operate reliably in high-humidity or vibration-prone environments?

Yes - as a monolithic silicon device with no battery, electrolytic capacitor, or mechanical contacts, it meets industrial reliability standards for moisture resistance, shock, and vibration. Its RoHS-compliant TSOP-II package and ferroelectric process eliminate failure modes associated with BBSRAM in harsh enclosures or mobile equipment.

FM22L16-55-TG Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
F-RAM™
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FRAM
Technology:
FRAM (Ferroelectric RAM)
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
110ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

FM22L16-55-TG FAQ

1.How can I place an order for FM22L16-55-TG through Aetrix?

Please submit a Request for Quotation (RFQ) for FM22L16-55-TG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for FM22L16-55-TG reliable?

The price and inventory of FM22L16-55-TG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FM22L16-55-TG is usually 5 days.

3.What payment methods are accepted for FM22L16-55-TG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FM22L16-55-TG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for FM22L16-55-TG?

FM22L16-55-TG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your FM22L16-55-TG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for FM22L16-55-TG?

For technical support, including FM22L16-55-TG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FM22L16-55-TG requirements.

6.How does Aetrix verify that FM22L16-55-TG is sourced from the original manufacturer or authorized distributors?

All FM22L16-55-TG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FM22L16-55-TG meets industry standards.

7.What is the process for return or replacement of FM22L16-55-TG?

All FM22L16-55-TG units undergo pre-shipment inspection (PSI). If there is an issue with FM22L16-55-TG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The FM22L16-55-TG part is unused and in its original packaging.

Return procedure for FM22L16-55-TG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

FM22L16-55-TG Tags

  • FM22L16-55-TG
  • FM22L16-55-TG PDF
  • FM22L16-55-TG Datasheet
  • FM22L16-55-TG Specifications
  • FM22L16-55-TG Images
  • Infineon Technologies
  • Infineon Technologies FM22L16-55-TG
  • Buy FM22L16-55-TG
  • FM22L16-55-TG Price
  • FM22L16-55-TG Distributor
  • FM22L16-55-TG Supplier
  • FM22L16-55-TG Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER