Infineon Technologies FM22LD16-55-BGTR
- Part No.:
- FM22LD16-55-BGTR
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
FM22LD16-55-BGTR.pdf
- Description:
- IC FRAM 4MBIT PARALLEL 48FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,070
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Product details
Overview
FM22LD16-55-BGTR from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) ferroelectric RAM (F-RAM) with SRAM-compatible parallel interface, 55 ns access time, 1014 read/write endurance, and 151-year data retention. It operates from 2.7 V to 3.6 V across –40 °C to +85 °C and is packaged in a 48-ball FBGA for industrial nonvolatile memory applications requiring rapid, reliable writes without backup power.
For engineers reviewing the FM22LD16-55-BGTR datasheet, FM22LD16-55-BGTR pinout, FM22LD16-55-BGTR application, or FM22LD16-55-BGTR equivalent, key selection criteria include NoDelay™ write timing, software-configurable block write-protection, page-mode 25 ns cycle time, and drop-in compatibility with 256K × 16 SRAM footprints in metering, PLC, and data logger systems.
Technical Context
The FM22LD16-55-BGTR implements a parallel-interface F-RAM core using a ferroelectric capacitor-based storage cell, enabling true nonvolatility without write latency or wear leveling. Its logic block includes address latching on CE fall, dual-byte enable (UB/LB) for 8-bit sub-access, and internal low-voltage monitoring that blocks array access below VDD(min).
It supports two write control modes: CE-initiated (WE asserted before CE fall) and WE-initiated (CE fall first, then WE fall), both delivering immediate nonvolatile storage. The memory array is partitioned into eight 32K × 16 blocks, each independently protected via a six-read/three-write address/command sequence stored nonvolatilely in dedicated protection registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 16), configurable as 512K × 8 via UB/LB control |
| Access Time | 55 ns - enables direct replacement of fast industrial SRAMs without timing redesign |
| Write Endurance | 1014 cycles - supports >100 years of daily 1000-write operations in data logging |
| Data Retention | 151 years at +85 °C - eliminates need for battery backup or refresh circuitry |
| Supply Voltage | 2.7 V to 3.6 V - compatible with standard 3.3 V industrial rails and brown-out thresholds |
| Operating Temperature | –40 °C to +85 °C - qualified for uncontrolled industrial environments including utility meters |
| Package | 48-ball FBGA (6 mm × 8 mm, 0.8 mm pitch) - surface-mount compatible with automated PCB assembly |
Pinout & Package
FM22LD16-55-BGTR uses a 48-ball fine-pitch ball grid array (FBGA) package with 0.8 mm pitch, 6 mm × 8 mm body size, and JEDEC-standard footprint. Pin assignments follow industry-standard 256K × 16 SRAM layout for mechanical and electrical compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A17–A0 | Address Input | 18-bit address bus latched on CE falling edge; A1–A0 enable 4-column page mode access |
| DQ15–DQ0 | Data I/O | 16-bit bidirectional data bus; driven only when OE = LOW and corresponding UB or LB = LOW |
| WE | Write Enable | Controls write initiation and timing; rising edge stores data immediately to nonvolatile array |
| CE | Chip Enable | Falling edge latches full address and starts memory cycle; deassertion triggers pre-charge |
| OE | Output Enable | Enables DQ drivers during reads; HI-Z when HIGH to prevent bus contention and reduce supply noise |
| UB / LB | Byte Select | Enable upper/lower 8-bit data lanes independently; allow byte-level writes without external logic |
| VDD / VSS | Power / Ground | Single 3.3 V supply rail; decoupling required per datasheet layout guidelines for noise immunity |
| NC | No Connect | Three balls (A2, E1, H1) are unconnected; must remain floating or grounded per PCB design rules |
Key Features
| Feature | Design Value |
|---|---|
| NoDelay™ Writes | Zero-latency nonvolatile storage: data written at end of bus cycle without polling or delay loops |
| Page Mode Performance | 25 ns cycle time for sequential column accesses within same row - doubles throughput vs. random access |
| Software Block Protection | Eight independent 32K × 16 sectors protected via nonvolatile register; no hardware jumpers or pins required |
| SRAM Drop-in Compatibility | Pin- and timing-compatible with 256K × 16 parallel SRAMs - requires no PCB or firmware changes |
| Monolithic Reliability | No battery, capacitor, or external support components needed - reduces BOM count and field failure risk |
Applications
| Smart Electricity Metering | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Storing tariff schedules, consumption logs, and event timestamps with power-loss resilience. IC Role / Device Role / Timing Role: Nonvolatile data buffer replacing battery-backed SRAM; retains critical billing data across mains outages. Use Value: Eliminates battery replacement service calls and avoids data corruption during brownouts or rapid power cycling. | Use Scenario: Logging I/O state transitions, fault records, and configuration parameters in factory automation controllers. IC Role / Device Role / Timing Role: High-endurance write buffer interfacing directly to microcontroller parallel bus. Use Value: Supports 1014 writes - sufficient for 20+ years of continuous 10 kHz state logging without wear degradation. |
| Industrial Data Logger | Medical Diagnostic Equipment |
Use Scenario: Capturing sensor readings (temperature, pressure, vibration) at high sample rates with guaranteed persistence. IC Role / Device Role / Timing Role: Parallel-interface nonvolatile memory acting as front-end capture buffer before host processing. Use Value: 55 ns access + 25 ns page mode enables real-time buffering at >20 MB/s sustained write rate. | Use Scenario: Storing calibration coefficients, patient session history, and safety-critical diagnostic settings. IC Role / Device Role / Timing Role: Fail-safe configuration store with 151-year retention and deterministic write completion. Use Value: Meets IEC 62304 Class C software requirements by eliminating write uncertainty and backup power dependencies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile parallel-memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY14B104Q5BNAXI | Same F-RAM architecture, 4-Mbit, but 44-pin TSOP-II package; 45 ns access time; no UB/LB byte-select pins | Requires PCB redesign for TSOP footprint; lacks byte-level write granularity | Select when board space allows larger package and byte masking is unnecessary |
| AS7C34096B-15JIN | Standard 4-Mbit SRAM (256K × 16); 15 ns access; volatile; requires external battery or capacitor for data retention | Higher speed but fails on power loss unless supported by backup circuitry and management firmware | Select only if system already implements robust BBSRAM infrastructure and ultra-low latency is mandatory |
Compared with CY14B104Q5BNAXI and AS7C34096B-15JIN, FM22LD16-55-BGTR uniquely delivers monolithic nonvolatility with SRAM timing, byte-select flexibility, and industrial FBGA packaging-enabling simpler, more reliable designs where power interruption resilience is non-negotiable.
Availability
FM22LD16-55-BGTR is available at Aetrix Electronics and suitable for smart metering, industrial PLCs, data loggers, and medical diagnostics requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for FM22LD16-55-BGTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT markets.
The FM22LD16 belongs to Infineon's F-RAM product line, engineered to replace battery-backed SRAM and legacy EEPROM/Flash in applications demanding infinite endurance, instant nonvolatile writes, and zero-power data retention.
FAQ
Is FM22LD16-55-BGTR pin-compatible with standard 256K × 16 SRAMs?
Yes. It uses an industry-standard 256K × 16 SRAM pinout in 48-ball FBGA, including identical A0–A17, DQ0–DQ15, CE, WE, OE, and VDD/VSS placement. UB and LB map to standard byte-enable functions, and NC pins align with common SRAM layouts - enabling direct PCB footprint reuse without redesign.
How does the software write-protection mechanism work without external hardware?
The FM22LD16-55-BGTR embeds nonvolatile protection registers. Protection is enabled by issuing a precise six-read/three-write address/data sequence over the parallel bus. Each of the eight 32K × 16 blocks is controlled by one bit in a protection byte; settings persist through power cycles and require no external WP pin or strapping resistors.
What is the significance of "NoDelay™ writes" in system firmware design?
NoDelay™ means write completion is synchronous with the bus cycle - no status polling, timeout loops, or interrupt handling is needed. Firmware can issue consecutive writes back-to-back at full bus bandwidth, reducing CPU overhead and eliminating race conditions associated with delayed nonvolatile storage like EEPROM or Flash.
Does FM22LD16-55-BGTR require special PCB layout considerations compared to SRAM?
Yes. While footprint and signal routing match SRAM, F-RAM demands stricter VDD decoupling: two 100 nF X7R ceramics near VDD balls plus one 4.7 µF tantalum, per datasheet Figure 22. Also, NC balls (A2, E1, H1) must be left unconnected or tied to ground per IPC-7351; floating NCs may cause noise coupling in high-density layouts.
FM22LD16-55-BGTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- F-RAM™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FRAM
- Technology:
- FRAM (Ferroelectric RAM)
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-FBGA (6x8)
FM22LD16-55-BGTR FAQ
1.How can I place an order for FM22LD16-55-BGTR through Aetrix?
Please submit a Request for Quotation (RFQ) for FM22LD16-55-BGTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FM22LD16-55-BGTR reliable?
The price and inventory of FM22LD16-55-BGTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FM22LD16-55-BGTR is usually 5 days.
3.What payment methods are accepted for FM22LD16-55-BGTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FM22LD16-55-BGTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FM22LD16-55-BGTR?
FM22LD16-55-BGTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FM22LD16-55-BGTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FM22LD16-55-BGTR?
For technical support, including FM22LD16-55-BGTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FM22LD16-55-BGTR requirements.
6.How does Aetrix verify that FM22LD16-55-BGTR is sourced from the original manufacturer or authorized distributors?
All FM22LD16-55-BGTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FM22LD16-55-BGTR meets industry standards.
7.What is the process for return or replacement of FM22LD16-55-BGTR?
All FM22LD16-55-BGTR units undergo pre-shipment inspection (PSI). If there is an issue with FM22LD16-55-BGTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FM22LD16-55-BGTR part is unused and in its original packaging.
Return procedure for FM22LD16-55-BGTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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