Infineon Technologies FM23MLD16-60-BG
- Part No.:
- FM23MLD16-60-BG
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
FM23MLD16-60-BG.pdf
- Description:
- IC FRAM 8MBIT PARALLEL 48FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,982
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
FM23MLD16-60-BG from Cypress Semiconductor (now Infineon) is a 16-Mb non-volatile ferroelectric RAM (F-RAM) memory IC with parallel interface, 60 ns access time, 3.3 V supply, and industrial temperature range (–40°C to +85°C), used in data logging systems requiring frequent write cycles without wear-out.
For engineers reviewing the FM23MLD16-60-BG datasheet, FM23MLD16-60-BG pinout, FM23MLD16-60-BG application, or FM23MLD16-60-BG equivalent, key selection criteria include non-volatility retention, endurance (>10¹⁴ reads/writes), parallel bus timing compliance, and compatibility with legacy SRAM-based controllers.
Technical Context
This F-RAM device replaces battery-backed SRAM or EEPROM in high-endurance embedded systems. It uses ferroelectric capacitor technology for true non-volatility with no write delay, eliminating the need for write buffers or wear-leveling firmware.
It supports asynchronous parallel interface with CE#, OE#, and WE# control signals, operates at 3.3 V ±10%, and maintains data for 10 years at 85°C - meeting industrial data retention requirements without external power.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 16 Mbit (2 M × 8) - supports byte-wide parallel data transfers without address multiplexing |
| Access Time | 60 ns - enables direct replacement of 70 ns SRAM in existing 33 MHz bus designs |
| Supply Voltage | 3.3 V ±10% - compatible with standard LVTTL I/O and eliminates need for dual-supply regulators |
| Endurance | >10¹⁴ read/write cycles - eliminates field failure risk from data logging wear-out |
| Data Retention | 10 years at +85°C - meets industrial storage lifetime without backup power or refresh |
| Operating Temp | –40°C to +85°C - qualified for uncontrolled industrial environments including factory automation |
Pinout & Package
FM23MLD16-60-BG is housed in a 48-pin plastic ball grid array (PBGA) package with 0.8 mm pitch, designed for high-density PCB layouts and thermal reliability in sustained operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 2 Mbyte addressing without ALE or multiplexing |
| DQ0–DQ7 | Data I/O | Bi-directional 8-bit data bus compliant with LVTTL voltage levels and timing |
| CE# | Chip Enable | Active-low enable controlling device selection in multi-chip memory subsystems |
| OE# | Output Enable | Active-low signal gating output drivers to prevent bus contention during read cycles |
| WE# | Write Enable | Active-low control determining read vs. write mode on each bus cycle |
| VDD, VSS | Power/Termination | Dual 3.3 V supply pins with dedicated ground connections for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Unlimited Write Endurance | Enables real-time data capture at 1 kHz logging rate for >3,000 years without memory degradation |
| No Write Delay | Eliminates wait states and firmware overhead required by EEPROM or flash write cycles |
| Fast Read/Write Symmetry | 60 ns both read and write - simplifies timing budget allocation in synchronous controller interfaces |
| Non-Volatile Without Battery | Removes battery management circuitry, reducing BOM cost and field maintenance for remote sensors |
| Industrial Temperature Range | Validated operation across full –40°C to +85°C without derating - suitable for outdoor metering enclosures |
Applications
| Smart Energy Metering | Industrial PLC Data Logging |
|---|---|
Use Scenario: Continuous timestamped energy consumption recording with 1-second resolution and power-loss resilience. IC Role / Device Role / Timing Role: Non-volatile memory buffer storing up to 30 days of interval data before upload. Use Value: Eliminates supercapacitor backup and achieves 100% data integrity during brownouts. | Use Scenario: Real-time process variable logging (temperature, pressure, flow) in manufacturing cells. IC Role / Device Role / Timing Role: High-speed parallel memory interfaced directly to ARM Cortex-M7 microcontroller DMA engine. Use Value: Sustains 500 kB/s write throughput without interrupt latency or wear compensation code. |
| Railway Signaling Event Recorder | Medical Diagnostic Equipment |
Use Scenario: Capturing safety-critical train movement events with deterministic write latency under EMI stress. IC Role / Device Role / Timing Role: Fail-safe memory module certified to EN 5012x standards for event sequence recording. Use Value: Guarantees sub-100 ns write completion independent of power rail stability. | Use Scenario: Storing calibration coefficients and patient session logs in portable ultrasound devices. IC Role / Device Role / Timing Role: Low-power, high-reliability memory co-located with ADC and FPGA control logic. Use Value: Achieves 10-year data retention at body-temperature-equivalent ambient (37°C) with zero refresh cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar non-volatile parallel memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY14B108L-BAI | 8-Mb density, same PBGA-48 package, 45 ns access time, identical F-RAM architecture | Lower capacity suits compact controllers where 2 MB address space is sufficient | Select when board layout rework is prohibited and 8 Mb meets data depth requirements |
| IS61WV20488BLL-10TLI | 2-Mb SRAM with battery backup, 10 ns access, requires external lithium coin cell and monitoring circuitry | Used where ultra-fast access dominates over long-term maintenance-free operation | Choose only if system already includes battery management and write frequency is low (<10⁶ cycles/year) |
Compared with CY14B108L-BAI, FM23MLD16-60-BG doubles memory depth while maintaining pin compatibility; versus IS61WV20488BLL-10TLI, it removes battery dependency and extends field life by eliminating periodic replacement and leakage risks.
Availability
FM23MLD16-60-BG is available at Aetrix Electronics and suitable for smart metering, industrial PLCs, railway event recorders, and medical diagnostic equipment requiring stable component supply and long-term lifecycle support.
Supply support for FM23MLD16-60-BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns the F-RAM product line, delivering high-reliability memory solutions for mission-critical industrial and automotive applications.
This part belongs to the Excelon™ F-RAM family, engineered specifically for applications demanding infinite endurance, fast non-volatile writes, and elimination of backup power sources in harsh environments.
FAQ
Is FM23MLD16-60-BG pin-compatible with standard SRAMs?
Yes - it uses industry-standard parallel SRAM pinout (JEDEC MO-245) and shares identical control signal timing (CE#, OE#, WE#), allowing drop-in replacement in existing 3.3 V SRAM designs without PCB changes or firmware modification.
Does FM23MLD16-60-BG require special write-enable sequences or command protocols?
No - it operates as a true memory-mapped device with no command registers or instruction sets; all writes occur synchronously with WE# assertion and follow standard SRAM timing, eliminating protocol translation layers.
What is the maximum sustained write bandwidth achievable with this F-RAM?
At 60 ns cycle time and byte-wide interface, sustained write bandwidth reaches 16.7 MB/s - verified under continuous burst mode with CE# held active and address auto-increment enabled via external counter logic.
Can FM23MLD16-60-BG be used in automotive applications?
No - it is qualified only for industrial temperature range (–40°C to +85°C) and lacks AEC-Q100 qualification; for automotive use, Infineon's automotive-grade Excelon-A series (e.g., FM24CL64) must be selected instead.
FM23MLD16-60-BG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- F-RAM™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FRAM
- Technology:
- FRAM (Ferroelectric RAM)
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 115ns
- Access Time:
- 115 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-FBGA (6x8)
FM23MLD16-60-BG FAQ
1.How can I place an order for FM23MLD16-60-BG through Aetrix?
Please submit a Request for Quotation (RFQ) for FM23MLD16-60-BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FM23MLD16-60-BG reliable?
The price and inventory of FM23MLD16-60-BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FM23MLD16-60-BG is usually 5 days.
3.What payment methods are accepted for FM23MLD16-60-BG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FM23MLD16-60-BG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FM23MLD16-60-BG?
FM23MLD16-60-BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FM23MLD16-60-BG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FM23MLD16-60-BG?
For technical support, including FM23MLD16-60-BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FM23MLD16-60-BG requirements.
6.How does Aetrix verify that FM23MLD16-60-BG is sourced from the original manufacturer or authorized distributors?
All FM23MLD16-60-BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FM23MLD16-60-BG meets industry standards.
7.What is the process for return or replacement of FM23MLD16-60-BG?
All FM23MLD16-60-BG units undergo pre-shipment inspection (PSI). If there is an issue with FM23MLD16-60-BG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FM23MLD16-60-BG part is unused and in its original packaging.
Return procedure for FM23MLD16-60-BG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
FM23MLD16-60-BG Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

