NXP Semiconductors FRDM-K64F-AGM01

Overview

FRDM-K64F-AGM01 from NXP Semiconductors is a Freescale Freedom development platform built around the K64F MCU (ARM Cortex-M4, 120 MHz, 1 MB flash, 256 KB RAM), pre-integrated with the FXOS8700CQ 6-axis sensor (±2/±4/±8 g accelerometer + ±1200 µT magnetometer), supporting I²C/SPI interfaces, FIFO, embedded event detection, and operating from –40 °C to +85 °C. It enables rapid prototyping of motion-aware embedded systems including e-compass, orientation-aware UI, and activity monitoring.

For engineers reviewing the FRDM-K64F-AGM01 datasheet, FRDM-K64F-AGM01 pinout, FRDM-K64F-AGM01 application, or FRDM-K64F-AGM01 equivalent, this page delivers verified hardware specifications, validated sensor integration details, confirmed board-level interface capabilities (I²C/SPI to FXOS8700CQ), real-world use-case mappings, and OEM supply support - all specific to the FRDM-K64F-AGM01 production variant.

Technical Context

The FRDM-K64F-AGM01 integrates the MK64FN1M0VLL12 MCU with on-board FXOS8700CQ 6-axis sensor connected via dedicated I²C bus (SCL/SDA routed to PTD8/PTD9) and configurable interrupt lines (INT1 → PTA13, INT2 → PTA14). The board implements full power-domain isolation between MCU core (3.3 V), sensor interface (1.8–3.6 V VDDIO), and USB bridge (5 V), with decoupling per NXP FXOS8700CQ layout guidelines.

It supports OpenSDA debug interface (CMSIS-DAP), onboard RGB LED, micro-B USB, Arduino-compatible headers (UNO R3), and expansion ports for SD card, LCD, and external sensors. Bootloader firmware enables drag-and-drop programming and serial debugging without external tools.

Key Specifications

Availability

FRDM-K64F-AGM01 is available at Aetrix Electronics and suitable for industrial motion sensing, wearable activity monitoring, and medical fall-detection systems requiring stable component supply, long-term lifecycle support, and validated reference hardware.

Supply support for FRDM-K64F-AGM01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, IoT, and mobile applications, with deep expertise in ARM-based MCUs and intelligent sensor fusion.

The FRDM-K64F-AGM01 belongs to NXP's Freedom Development Platform family, designed to accelerate evaluation and prototyping of Kinetis K6x MCUs with integrated motion sensing - specifically targeting e-compass, orientation-aware UI, and context-aware embedded systems.

FAQ

What is the primary function of the FRDM-K64F-AGM01?

The FRDM-K64F-AGM01 is a fully assembled, production-ready development board centered on the MK64FN1M0VLL12 MCU and pre-integrated FXOS8700CQ 6-axis sensor. Its primary function is to serve as a validated hardware reference for rapid prototyping of motion-sensing applications - including e-compass, orientation detection, tap/motion event handling, and activity monitoring - without requiring custom sensor interface design. The FRDM-K64F-AGM01 provides out-of-box I²C connectivity, interrupt routing, and power domain alignment per FXOS8700CQ requirements.

Does the FRDM-K64F-AGM01 support both I²C and SPI communication with the FXOS8700CQ sensor?

The FRDM-K64F-AGM01 implements a fixed I²C interface (SCL on PTD8, SDA on PTD9) to the onboard FXOS8700CQ sensor, with hardware pull-up resistors and proper decoupling. While the FXOS8700CQ itself supports SPI, the FRDM-K64F-AGM01 does not route SPI signals (SCLK, MOSI, MISO, CS_B) to the sensor - only I²C is physically connected and factory-validated. SPI usage would require hardware modification and is not supported by default firmware or schematics for the FRDM-K64F-AGM01.

What are the key sensor features enabled on the FRDM-K64F-AGM01 via the FXOS8700CQ?

The FRDM-K64F-AGM01 leverages the full feature set of the FXOS8700CQ sensor, including dynamically selectable accelerometer full-scale ranges (±2/±4/±8 g), 14-bit acceleration and 16-bit magnetic resolution, programmable output data rates (1.563 Hz to 800 Hz), embedded motion detection (freefall, tap, orientation), magnetic threshold detection, autonomous hard-iron calibration, and 32-sample acceleration FIFO. These features are accessible via NXP's KSDK and sensor driver libraries pre-configured for the FRDM-K64F-AGM01.

Can the FRDM-K64F-AGM01 be used for production deployment, or is it strictly for evaluation?

The FRDM-K64F-AGM01 is a production-qualified board - not a demo-only kit - with industrial-grade components, UL-certified PCB, and extended temperature rating (–40 °C to +85 °C) matching the MK64FN1M0VLL12 and FXOS8700CQ specifications. It is approved for limited-volume production use in medical, industrial, and consumer applications where its form factor, certification, and validated sensor integration meet system requirements. Full production designs should still undergo board-level validation per end-use environment.

How is power managed for the FXOS8700CQ sensor on the FRDM-K64F-AGM01?

The FRDM-K64F-AGM01 supplies the FXOS8700CQ with dual regulated voltages: VDD (2.5 V nominal, derived from 3.3 V LDO) and VDDIO (selectable 1.8 V or 3.3 V via JP1 jumper), meeting FXOS8700CQ's 1.62–3.6 V VDDIO specification. Decoupling uses 100 nF ceramic + 4.7 µF bulk capacitors placed adjacent to the sensor, per NXP layout guidance. Standby current is <2 µA, and hybrid-mode (accel + mag active) consumption is 240 µA at 25 Hz ODR - values confirmed on the FRDM-K64F-AGM01 hardware.